Patents Examined by Shamim Ahmed
  • Patent number: 10867794
    Abstract: A hard mask formed over a patterned photoresist layer in a tri-layer photoresist and a method for patterning a target layer using the same are disclosed. In an embodiment, a method includes depositing a photoresist layer over a first hard mask layer; patterning the photoresist layer to form a plurality of openings in the photoresist layer; depositing a second hard mask layer over the photoresist layer, the second hard mask layer filling the plurality of openings, the second hard mask layer having a first etch selectivity relative to the first hard mask layer, the photoresist layer having a second etch selectivity relative to the first hard mask layer, the first etch selectivity being greater than the second etch selectivity; planarizing the second hard mask layer; removing the photoresist layer; and etching the first hard mask layer using the second hard mask layer as a mask.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yu Chang, Jung-Hau Shiu, Szu-Ping Tung, Chun-Kai Chen, Jen Hung Wang, Tze-Liang Lee
  • Patent number: 10858740
    Abstract: The present disclosure presents a method and a system for modifying a surface of a substrate. The method includes an act of abrasive blasting of a part of the surface of the substrate. In the abrasive blasting, an abrasive media is provided to the part of the surface. The abrasive media is carried to the part by a first carrier. The abrasive media collides with the part of the surface and causes abrasion to the part of the surface. In the method, the first carrier includes steam. The steam of the first carrier heats the part of the surface.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: December 8, 2020
    Assignee: Siemens Aktiengesellschaft
    Inventors: Per Möller, Asger Andersen, Sara Eisenhardt, Kasper Bondo Hansen, Martin Kalmar Hansen, Melanie Thyrhaug
  • Patent number: 10861718
    Abstract: One of a setting dissolved oxygen concentration and a setting atmosphere oxygen concentration is determined based on a required etching amount. Thereafter, based on the required etching amount and the one of the determined setting dissolved oxygen concentration and setting atmosphere oxygen concentration, the other of the setting dissolved oxygen concentration and the setting atmosphere oxygen concentration is determined. A low oxygen gas whose oxygen concentration is equal or approached to the determined setting atmosphere oxygen concentration flows into a chamber that houses a substrate. Furthermore, an etching liquid whose dissolved oxygen is reduced such that its dissolved oxygen concentration is equal or approached to the determined setting dissolved oxygen concentration is supplied to the entire region of the upper surface of the substrate held horizontally.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: December 8, 2020
    Inventors: Sei Negoro, Kenji Kobayashi
  • Patent number: 10851267
    Abstract: Polishing compositions are disclosed which contribute to improvement of level difference performance (in particular, erosion). The polishing composition used for polishing an object to be polished includes abrasive grains and a dispersing medium, wherein the abrasive grains have an average primary particle size of 40 nm or less, and the number of coarse particles having a particle size of 0.2 to 1,600 ?m in the abrasive grains is 20,000 or less per 1 cm3 of the polishing composition.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: December 1, 2020
    Assignee: FUJIMI INCORPORATED
    Inventors: Yukinobu Yoshizaki, Youhei Takahashi
  • Patent number: 10849833
    Abstract: The invention discloses a manufacturing method of a preservative-free facial mask and process equipment thereof. The method includes preparing distilled water with boiling point of 80-100° C., and reserving at a constant temperature; transporting the distilled water into a mixing agitator, cooling to 45-55° C.; weighing a facial mask powder into a drying mixer and mixing; turning on the mixing agitator, stirring the distilled water, adding the facial mask powder and a facial mask liquid material, stirring to form a paste liquid; importing the paste liquid into a colloid grinder, and forming a facial mask slurry; transporting into a coating machine, spreading the facial mask slurry onto surface of non-woven cloth to form facial mask slurry layer; drying the non-woven cloth, and performing instantaneous high-temperature sterilization and rolling up; slicing, moulding and packaging. The invention protects the human skin from being harmed and has a better effect without containing preservatives.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: December 1, 2020
    Inventor: Fengying Qian
  • Patent number: 10844469
    Abstract: A method for manufacturing a member according to one embodiment of the present disclosure is a method for manufacturing a member having a substrate and a sprayed coating formed on a surface of the substrate. The method includes: supplying an oil into a recessed portion of the sprayed coating, a kinematic viscosity of the oil at 40° C. being more than or equal to 3 mm2/s and less than or equal to 43 mm2/s; and dry-cutting, using a cutting tool, a surface of the sprayed coating with the recessed portion supplied with the oil. A supplied amount of the oil is more than or equal to 0.1 weight % and less than or equal to 2.7 weight % with respect to an apparent weight of the sprayed coating.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: November 24, 2020
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Kazushi Takahama, Satoru Kukino
  • Patent number: 10844153
    Abstract: A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: November 24, 2020
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Wataru Kasai, Toru Sasaki, Masatoshi Abe
  • Patent number: 10838148
    Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: November 17, 2020
    Assignees: IMEC VZW, KATHOLIEKE UNIVERSITEIT LEUVEN
    Inventors: Md Mahmud Ul Hasan, Simone Severi, Veronique Rochus, Wouter Jan Westerveld
  • Patent number: 10838298
    Abstract: Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: November 17, 2020
    Assignee: Molecular Imprints, Inc.
    Inventor: Vikramjit Singh
  • Patent number: 10838121
    Abstract: A three-dimensional diffraction grating is generated by selective deposition and/or selective etching. The three-dimensional diffraction grating includes a substrate and a plurality of structures located at different positions on the substrate. The structures have different materials. Edges of at least some of the structures are aligned. The three-dimensional diffraction grating includes different materials and aligned edges in all three dimensions. With the different materials and aligned edges, the three-dimensional diffraction gratings is configured to eliminate display artifacts, such as ghost, rainbow, etc.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: November 17, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Nihar Ranjan Mohanty, Giuseppe Calafiore, Matthew E. Colburn, Austin Lane, Matthieu Charles Raoul Leibovici
  • Patent number: 10831099
    Abstract: A method for manufacturing an optical member includes: forming a mask pattern on a glass member, the mask pattern comprising oxygen and indium; performing dry etching on the glass member using the mask pattern as a mask, while using an etching gas comprising fluorine; after performing the dry etching, performing wet etching on the glass member using the mask pattern as a mask, while using an etching solution comprising fluorine; and after alternately repeating performing the dry etching and the wet etching a plurality of times, removing the mask pattern.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: November 10, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Naoki Musashi
  • Patent number: 10824255
    Abstract: A manufacturing method of a touch panel includes following steps. The first sensing electrodes and the second sensing electrodes are formed on a substrate first. Connecting bridges are formed next, wherein adjacent two first sensing electrodes are connected by at least one connecting bridge, and a manufacturing method of the connecting bridges includes following steps. A metal layer is formed on the substrate first, wherein a material of the metal layer includes silver. A photoresist layer is formed on a surface of the metal layer next, wherein a material of the photoresist layer includes sulfur. A photolithography process and an etching process are respectively performed on the photoresist layer and the metal layer to form the connecting bridges, wherein silver in the metal layer and sulfur in the photoresist layer react with each other to form a silver sulfide layer after the photoresist layer is formed.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: November 3, 2020
    Assignee: HANNSTAR DISPLAY CORPORATION
    Inventors: Chih-Wei Chen, Mei-Ling Chou, Yao-Chih Chuang
  • Patent number: 10822056
    Abstract: A system and method for the application and thermal curing of specialized vessel deck coatings is disclosed. A system capable of controlling environmental conditions is assembled on the deck of a vessel and utilized to control conditions within the system during application and curing of deck coatings is disclosed. A method of utilizing a system capable of controlling environmental conditions during the pretreatment, treatment and curing phases of specialized vessel deck coatings is also disclosed.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: November 3, 2020
    Inventor: Christopher William Fertig
  • Patent number: 10827608
    Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: November 3, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: Stephen Gonya, Kenn Twigg, Jim Patterson
  • Patent number: 10822524
    Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions that comprise a mixture of (a) one or more alkoxylated diamines having a number average molecular weight (Mn) of from 1,000 to 20,000, or, preferably, from 1000-15000 and having four (poly)alkoxy ether groups each containing from 5 to 100 alkoxy repeat units; (b) from 0.01 to 2 wt. % or, preferably, from 0.1 to 1.5 wt. %, as solids, based on the total weight of the compositions, of one or more aqueous dispersions of elongated, bent or nodular colloidal silica particles, preferably, having a secondary particle size as determined by dynamic light scattering (DLS) of from 20 to 60 nm; and (c) ammonia or an amine base, wherein the compositions have a pH ranging from 9 to 11. The compositions are substantially free of metals, such as alkali or alkaline earth metals that can damage substrates in polishing.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 3, 2020
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, I
    Inventors: Naresh Kumar Penta, Matthew Van Hanehem, Kwadwo E. Tettey, Koichi Yoshida, Kyohei Yoshida
  • Patent number: 10821489
    Abstract: An encapsulated reactant(s) having at least one encapsulant and at least one reactant. An outermost encapsulant is substantially non-reacting, impermeable and non-dissolving with water. The reactant(s) contribute to at least one reaction with contaminants in environmental media rendering the environmental media less harmful. Processes for using the encapsulated reactant in environmental media is also hereby claimed.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: November 3, 2020
    Assignee: Specialty Earth Sciences, LLC
    Inventors: Jason Swearingen, Lindsay Swearingen
  • Patent number: 10823894
    Abstract: A method of manufacturing a waveguide having a combination of a binary grating structure and a blazed grating structure includes cutting a substrate off-axis, depositing a first layer on the substrate, and depositing a resist layer on the first layer. The resist layer includes a pattern. The method also includes etching the first layer in the pattern using the resist layer as a mask. The pattern includes a first region and a second region. The method further includes creating the binary grating structure in the substrate in the second region and creating the blazed grating structure in the substrate in the first region.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: November 3, 2020
    Assignee: Magic Leaps, Inc.
    Inventors: Christophe Peroz, Mauro Melli, Vikramjit Singh, David Jurbergs, Jeffrey Dean Schmulen, Zongxing Wang, Shuqiang Yang, Frank Y. Xu, Kang Luo, Marlon Edward Menezes, Michael Nevin Miller
  • Patent number: 10822525
    Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 3, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akira Sugawa
  • Patent number: 10815392
    Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; nonionic polyacrylamide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive having a negative zeta potential; and, optionally, a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten is inhibited as well as erosion of dielectrics underlying the tungsten.
    Type: Grant
    Filed: March 3, 2019
    Date of Patent: October 27, 2020
    Assignee: ROHM AND HAAS ELECTRONIC CMP HOLDINGS, INC.
    Inventors: Lin-Chen Ho, Wei-Wen Tsai
  • Patent number: 10814348
    Abstract: A particle can be discretely ejected from a orifice.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: October 27, 2020
    Assignees: MASSACHUSETTS INSTITUTE OF TECHNOLOGY, UNIVERSITY OF MICHIGAN
    Inventors: Anastasios John Hart, Justin Douglas Beroz, Homayoon Maghsoodi