Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.

Abstract: In one embodiment, an apparatus includes a memory array having a plurality of memory cells, a plurality of bitlines coupled to the plurality of memory cells, and a plurality of wordlines coupled to the plurality of memory cells. The memory array may further include a sense amplifier circuit to sense and amplify a value stored in a memory cell of the plurality of memory cells. The sense amplifier circuit may include: a buffer circuit to store the value, the buffer circuit coupled between a first internal node of the sense amplifier circuit and a second internal node of the sense amplifier circuit; and an equalization circuit to equalize the first internal node and the second internal node while the sense amplifier circuit is decoupled from the memory array. Other embodiments are described and claimed.

Abstract: An asynchronous NAND-type memory device includes a circuit configured to perform an operation based on a signal, a first pin configured to obtain an operation control signal, a second pin configured to output a data output reference signal, and a third pin configured to output data in synchronization with the data output reference signal. The circuit is provided such that the first pin obtains, from the external device, the operation control signal that is transitioned at a second time point after a first time point at which the memory device enters into a ready state, the second pin outputs the data output reference signal, which is transitioned at a third time point that is later than the second time point by a predetermined time interval, and the third pin outputs the data in synchronization with the operation control signal which is periodically transitioned, from the third time point.

Abstract: A storage device may include a controller and a memory array including a plurality of dies arranged into a plurality of channels. In some examples, the controller may be configured to define, from the memory array, a plurality of die-sets based on respective chip enable lines associated with the plurality of dies, wherein each die-set of the plurality of die-sets includes at least one die from each of the plurality of channels; define, from a selected die-set of the plurality of die-sets, a plurality of blocksets, wherein each blockset includes a block from each die of the selected die-set; receive a unit of data to be stored; and issue commands that cause the unit of data to be stored in blocks of a selected blockset of the plurality of blocksets.

Abstract: Magnetic Josephson junction driven flux-biased superconductor memory cell and methods are provided. A memory cell may include a magnetic Josephson junction (MJJ) superconducting quantum interference device (SQUID) comprising a first MJJ device and a second MJJ device, arranged in parallel to each other, where the MJJ SQUID is configured to generate a first flux-bias or a second flux-bias, where the first flux-bias corresponds to a first direction of current flow in the MJJ SQUID and the second flux-bias corresponds to a second direction of current flow in the MJJ SQUID. The memory cell may further include a superconducting metal-based superconducting quantum interference device (SQUID) including a first Josephson junction (JJ) and a second JJ, arranged in parallel to each other, where each of the first JJ and the second JJ has a critical current responsive to any flux-bias generated by the MJJ SQUID.

Abstract: The present invention provides a layout pattern of a static random access memory (SRAM), comprising at least two inverters coupled to each other for storing data, each inverter comprising an L-shaped gate structure on a substrate, the L-shaped gate structure includes a first portion arranged along a first direction and a second portion aligned along a second direction, wherein the first portion crosses a first diffusion region to form a pull-up device, and the first portion crosses a second diffusion region and a third diffusion region to form a pull-down device, and each of the inverters includes a local interconnection layer, crossing the second diffusion region and the third diffusion region.

Abstract: An integrated circuit structure includes a first fuse line formed in a first metal layer; a second fuse line formed in the first metal layer; a first pair of fuse wings formed in the first metal layer on opposite sides of a first end of the first fuse line; a second pair of fuse wings formed in the first metal layer on opposites sides of a first end of the second fuse line; a third pair of fuse wings formed in the first metal layer on opposite sides of a second end of the first fuse line; and a fourth pair of fuse wings formed in the first metal layer on opposites sides of a second end of the second fuse line. The first and second pairs of fuse wings share a first common fuse wing and the third and fourth pairs of wings share a second common fuse wing.

Abstract: Some embodiments include memory devices having a wordline, a bitline, a memory element selectively configurable in one of three or more different resistive states, and a diode configured to allow a current to flow from the wordline through the memory element to the bitline responsive to a voltage being applied across the wordline and the bitline and to decrease the current if the voltage is increased or decreased. Some embodiments include memory devices having a wordline, a bitline, memory element selectively configurable in one of two or more different resistive states, a first diode configured to inhibit a first current from flowing from the bitline to the wordline responsive to a first voltage, and a second diode comprising a dielectric material and configured to allow a second current to flow from the wordline to the bitline responsive to a second voltage.

Abstract: Apparatuses and methods for calibrating sense amplifiers in a semiconductor memory are disclosed. An example apparatus includes an amplifier circuit and a calibration circuit. The amplifier circuit is configured to be coupled to a supply voltage and a reference voltage, and when activated the amplifier circuit is configured to provide an output signal at an output that is complementary to an input signal provided to an input. When activated by a calibration signal, the calibration circuit is configured to provide a calibration voltage to the output of the amplifier circuit, wherein the calibration voltage is an equilibration voltage between the supply voltage and the reference voltage provided to the amplifier circuit.

Abstract: A nonvolatile memory device includes a first cell string including a first dummy cell and connected to a selected string select line, a second cell string including a second dummy cell and connected to the selected string select line, a page buffer circuit configured to select one of the first and second cell strings to read data in a read operation, and a control logic circuit configured to apply a first bit line voltage to a bit line connected to the selected one of the first and second cell strings and a second bit line voltage to a bit line connected to an unselected one of the first and second cell strings in the read operation. The control logic circuit turns off the second dummy cell when the first cell string is selected and turns off the first dummy cell when the second cell string is selected.

Abstract: In a method of operating a ferroelectric device, a ferroelectric device including a first electrode layer, a ferroelectric layer and a second electrode layer that are sequentially disposed is provided. A first remanent polarization is written in the ferroelectric layer. An operating voltage is applied between the first and second electrode layers to write a second remanent polarization having a polarization value different from a polarization value of the first remanent polarization in the ferroelectric layer. An amplitude of the operating voltage varies within a voltage application time period and varies in a set voltage range.

Abstract: Provided is a magnetic memory including: a first bit line, a second bit line, and a third bit line; a word line; a first magnetoresistance effect element; a first transistor; a second magnetoresistance effect element; and a second transistor, wherein free layers of the first and second magnetoresistance effect elements and the second bit line are connected, a fixed layer of the first magnetoresistance effect element and a source terminal of the first transistor are connected, a drain terminal of the first transistor and the first bit line are connected, a fixed layer of the second magnetoresistance effect element and a drain terminal of the second transistor are connected, a source terminal of the second transistor and the third bit line are connected, and the word line is connected to each of a gate terminal of the first transistor and a gate terminal of the second transistor.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.

Abstract: Methods, systems, and devices for techniques to mitigate disturbances of unselected memory cells in a memory array during an access operation are described. A shunt line may be formed between a plate of a selected memory cell and a digit line of the selected memory cell to couple the plate to the digit line during the access operation. A switching component may be positioned on the shunt line. The switching component may selectively couple the plate to the digit line based on instructions received from a memory controller. By coupling the plate to the digit line during the access operation, voltages resulting on the plate by changes in the voltage level of the digit line may be reduced in magnitude or may be altered in type.

Abstract: Apparatus including an array of memory cells and a controller configured to program all memory cells of a grouping of memory cells that are to be respectively programmed to different levels other than a lowest level, corresponding to a lowest data state, to an intermediate level from the lowest level, and to respectively program all the memory cells of the grouping of memory cells that are to be respectively programmed to the different levels other than the lowest level to the different levels other than the lowest level from the intermediate level.

Abstract: Embodiments of the present disclosure generally relate to data storage and computer memory systems, and more particularly, to a SOT-MRAM chip architecture. The SOT-MRAM chip architecture includes a plurality of leads, a plurality of memory cells, and a plurality of transistors. The leads may be made of a material having large spin-orbit coupling strength and high electrical resistivity. Each lead of the plurality of leads may include a plurality of first portions and a plurality of second portions distinct from the first portions. The electrical resistivity of the second portions is less than that of the first portions, so the total electrical resistivity of the lead is reduced, leading to improved power efficiency and signal to noise ratio.

Abstract: The present application relates to an improved static random access memory (SRAM) device having a plurality of storage cells and a separate read/write circuit. Each of the plurality of storage cells is connected to a read/write data node of the read/write circuit by a dedicated connection, and an access switch which permits read/write access to the storage cell. The dedicated connection exhibits a greater capacitance than the read/write data node of the read/write circuit, such that the primary read mechanism of the SRAM is charge equalization. The SRAM write data connection to the read/write node of the read/write circuit, to permit data to be written to the plurality of storage cells. Write assist techniques are disclosed which assist writing of a ‘1’ to the plurality of storage cells.

Abstract: A semiconductor device includes a latch circuit receiving a first signal, generated in synchronization with a clock signal, from a pulse generation circuit, and generating a second signal; a first delay circuit receiving the second signal from the latch circuit, and generating a third signal by delaying the second signal; a second delay circuit receiving the third signal from the first delay circuit, and generating a fourth signal by delaying the third signal; and a logic circuit receiving the second and fourth signals from the latch and second delay circuits, respectively, and generating a word line control signal based on one of the second signal and the fourth signal. The latch circuit generates the second signal of a first level based on the first signal, and generates the second signal of a second level, which is different from the first level, based on the third signal.

Abstract: The present disclosure is drawn to, among other things, a magnetoresistive memory. The magnetoresistive memory includes a first memory cell, a first access circuit, a second access circuit, and a current generating circuit. The first memory cell includes a first magnetic tunnel junction and a second magnetic tunnel junction. The first access circuit is configured to receive access command signals for accessing the first magnetic tunnel junction. The first access circuit includes a first access switch and a second access switch. The second access circuit is configured to receive access command signals for accessing the second magnetic tunnel junction. The second access circuit includes a third access switch and a fourth access switch. The current generating circuit is configured to generate a first write current through the first magnetic tunnel junction and generate a second write current through the second magnetic tunnel junction based on data input signals.

Abstract: Apparatuses and techniques are described for programming memory cells with a narrow threshold voltage (Vth) distribution in a memory device. In one approach, the final pass of a multi-pass program operation on a word line WLn includes applying a variable voltage to WLn+1 during verify tests on WLn. The variable voltage (Vread) can be an increasing function of the verify voltage on WLn, and thus a function of the data state for which the verify test is performed. In one approach, Vread on WLn+1 is stepped up with each increase in the verify voltage on WLn. The step size in Vread can be the same as, or different than, the step size in the verify voltage. Vread can be different for each different verify voltage, or multiple verify voltages can be grouped for use with a common Vread.