Abstract: A method and an apparatus for designing a sound compensation filter of a portable terminal are provided. The method includes synchronizing a signal input through a microphone of the system and a test signal, estimating a loss interval of the synchronized signal, compensating for a frame signal delayed by a signal loss in a time axis when the signal loss of the estimated loss interval is greater than a threshold and restoring the loss interval of the signal.

Abstract: Speakers are identified based on sound origination detection through use of infrared detection of satellite microphones, estimation of distance between satellite microphones and base unit utilizing captured audio, and/or estimation of satellite microphone orientation utilizing captured audio. Multiple sound source localization results are combined to enhance sound source localization and/or active speaker detection accuracy.

Abstract: Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner disposed over the gate electrode and at least a portion of the active area, an insulating layer disposed over the liner. A first contact plug is disposed in the insulating layer and the liner, the first contact plug disposed above and in contact with a portion of the active area, the first contact plug including a first conductive material. A second contact plug is disposed in the insulating layer and the liner, the second contact plug disposed above and in contact with a portion of the gate electrode, the second contact plug includes the first conductive material. A contact material layer is disposed in the active region, the contact material layer disposed under the first contact plug and includes the first conductive material.

Abstract: An electronic device or devices and method for producing a device is disclosed. One embodiment provides an integrated component, a first package body and a contact device. The contact device penetrates the package body.

Abstract: An integrated circuit package system including: providing an integrated circuit die, forming a first layer over the integrated circuit die, forming a bridge on and in the first layer, forming a second layer on the first layer, and forming bump pads on and in the second layer, the bump pads connected to ends of the bridge.

Abstract: An integrated circuit includes a first electrode including an etched recessed portion. The integrated circuit includes a second electrode and a resistivity changing material filling the recessed portion and coupled to the second electrode.

Abstract: The present invention provides a compound semiconductor light emitting device including: an Si—Al substrate; protection layers formed on top and bottom surfaces of the Si—Al substrate; and a p-type semiconductor layer, an active layer, and an n-type semiconductor layer which are sequentially stacked on the protection layer formed on the top surface of the Si—Al substrate, and a method for manufacturing the same.

Abstract: One aspect includes a semiconductor device with self-aligned contacts, integrated circuit and manufacturing method. One embodiment provides gate control structures. Each of the gate control structures is configured to control the conductivity of a channel region within a silicon carbide substrate by field effect. A contact hole is self-aligned to opposing sidewalls of adjacent gate control structures by intermediate spacers.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: A turbine blade and a gas turbine are provided in which the velocity of cooling fluid at the inlet of a pin fin region is improved so that the cooling performance at the trailing edge of the turbine blade can be improved.

Abstract: A heterojunction bipolar transistor (HBT) having an emitter, a base, and a collector, the base including a first semiconductor layer coupled to the collector, the first semiconductor layer having a first bandgap between a first conduction band and a first valence band and a second semiconductor layer coupled to the first semiconductor layer and having a second bandgap between a second conduction band and a second valence band, wherein the second valence band is higher than the first valence band and wherein the second semiconductor layer comprises a two dimensional hole gas and a third semiconductor layer coupled to the second semiconductor layer and having a third bandgap between a third conduction band and a third valence band, wherein the third valence band is lower than the second valence band and wherein the third semiconductor layer is coupled to the emitter.

Abstract: An organic light emitting display device includes a plurality of pixels each coupled to a corresponding one of previous scan lines, a corresponding one of current scan lines, and a data line; first switching elements coupled between the previous scan lines of the pixels and a first test pad, and configured to turn on during a first period of a test period to provide a first test control signal supplied from the first test pad to the pixels; and second switching elements coupled between the current scan lines of the pixels and a second test pad, and configured to turn on during a second period of the test period to provide a second test control signal supplied from the second test pad to the pixels.

Abstract: A gas turbine engine rotor drum includes spaced apart discs providing a cavity between the discs. The discs are configured to rotate in a rotational direction about an axis. An annular support is mounted on at least one of the discs and within the cavity. A cascade of relatively short anti-vortex members is mounted circumferentially on the annular support. The anti-vortex members include an outer end having a concave surface extending within the cavity radially outward from the annular support. The concave surface faces the rotational direction and promotes swirl as the rotor drum rotates.

Abstract: A laser activated phase change device for use in an integrated circuit comprises a chalcogenide fuse configured to connect a first patterned metal line and a second patterned metal line and positioned between an inter layer dielectric and an over fuse dielectric. The fuse interconnects active semiconductor elements manufactured on a substrate. A method for activating the laser activated phase change device includes selecting a laser condition of a laser based on characteristics of the fuse and programming a phase-change of the fuse with the laser by direct photon absorption until a threshold transition temperature is met.

Abstract: A signal processor uses input devices to detect speech or aural signals. Through a programmable set of weights and/or time delays (or phasing) the output of the input devices may be processed to yield a combined signal. The noise contributions of some or each of the outputs of the input devices may be estimated by a circuit element or a controller that processes the outputs of the respective input devices to yield power densities. A short-term measure or estimate of the noise contribution of the respective outputs of the input devices may be obtained by processing the power densities of some or each of the outputs of the respective input devices. Based on the short-term measure or estimate, the noise contribution of the combined signal may be estimated to enhance the combined signal when processed further. An enhancement device or post-filter may reduce noise more effectively and yield robust speech based on the estimated noise contribution of the combined signal.

Abstract: An organic transistor includes a semiconductor section that includes a thin-film laminate in which a first organic thin film and a second organic thin film are alternately stacked. The thin-film laminate includes at least two layers of the first organic thin film. The first organic thin film is a pentacene thin film, and the second organic thin film is an amorphous organic thin film. The pentacene thin film may be a pentacene bilayer thin film, and the amorphous organic thin film may be a tetraaryldiamine thin film. The tetraaryldiamine thin film may be an ?-NPD thin film. The organic transistor has improved transistor characteristics (e.g., mobility, ON/OFF ratio, or threshold value control).

Abstract: A semiconductor light emitting element includes a substrate 11 having a defect concentrated region 11a which has a crystal defect density higher than in the other region. On the substrate 11, a semiconductor layer 12 is formed. On the defect concentrated region 11a, a first electrode 13 is formed. On the semiconductor layer 12, a second electrode 14 is formed.

Abstract: A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the direction of the z-axis (i.e., in a direction normal to the circuit side of the die). The semiconductor package can include a die mounted in a face-up configuration (similar to a wire bond package) or in a face-down or flip chip configuration.

Abstract: An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes a thermal interface material substantially between the semiconductor die and a heat spreader of the integrated circuit device for conducting heat from the semiconductor die to the heat spreader. The thermal interface material includes diamond particles and has a thickness selected to reduce capacitance between the semiconductor die and the heat spreader over that of a conventional integrated circuit device without reducing the rate of thermal conduction from the semiconductor die to the heat spreader. As a result, the integrated circuit device has improved electrostatic discharge immunity.

Abstract: A method for forming a flat panel display includes disposing a light guide plate below a display panel, disposing at least one optical film between the display panel and the light guide plate, and disposing at least one illuminating device package in proximity to the light guide plate. The method for forming the illuminating device package includes forming a light emitting diode device over a substrate and forming a lens encapsulating the light emitting diode device. The lens includes two reflective surfaces disposed substantially symmetrically at either side of a central axis. The reflective surfaces is configured to reflect portions of light beams to at least one of the diffractive surfaces. The lens also includes a plurality of diffractive surfaces separating the reflective surfaces. The diffractive surfaces are configured to diffract the reflected light beams into a convergent angle. Each of the diffractive surfaces having a tilt angle respective to the central axis.