Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.

Abstract: A method by a rendering device includes receiving a request to render multiple surfaces corresponding to multiple virtual objects to be concurrently displayed on an augmented-reality (AR) headset. The method further includes that the AR headset is connected to the rendering device via a wireless link. In response to a determination that a network quality of the wireless link is below a threshold condition, the method further includes selecting a first subset of the multiple surfaces that are higher priority than a second subset of the plurality of surfaces. The method includes transmitting the first subset of multiple surfaces to the AR headset for display and transmitting the second subset of multiple surfaces to the AR headset for display after transmitting the first subset. This method includes rendering the surfaces in accordance with a set of rendering parameters so as to satisfy one or more network constraints.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: There is provided a smoke detector including a substrate, a light source and a light sensor. The light source and the light sensor are arranged adjacently on the substrate. The substrate is arranged with an asymmetric structure to cause an illumination region of the light source to deviate toward the light sensor thereby increasing a ratio of light intensity reflected by smoke with respect to reference light intensity.

Abstract: A semiconductor device according to the present disclosure includes a first gate structure and a second gate structure aligned along a direction, a first metal layer disposed over the first gate structure, a second metal layer disposed over the second gate structure, and a gate isolation structure extending between the first gate structure and the second gate structure as well as between the first metal layer and the second metal layer.

Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Abstract: A Wireless Interface Device and System (WIDS) is used as a bridge device for transmitting, translating, transporting and/or transforming a first emergency aid seeking signal to a second emergency aid seeking signal recognizable by a smart voice commendable device (e.g., AMAZON® ECHO®). The first emergency aid seeking signal can be generated from a Personal Emergency Response Systems (PERS), a fall sensor (e.g., a senior fall sensor), home security monitoring device, or any other emergency aid requesting devices.

Abstract: A method of fabricating a semiconductor structure includes forming an alignment mark layer on a substrate; patterning the alignment mark layer for forming at least one alignment mark feature; forming a bottom conductive layer on the patterned alignment mark layer in a substantially conformal manner; forming an insulator layer on the bottom conductive layer; and forming a top conductive layer on the insulator layer.

Abstract: A tank valve system comprises a main valve body, an overfill protection device (OPD), a gauge drive apparatus and a fuel level indicator. The OPD and gauge drive apparatus are configured to both be inserted through a narrow neck of a fuel storage tank prior to connecting the valve body to the neck. The valve body includes a primary fuel channel and a shuttle interface channel. The OPD includes an overfill float driving an overfill shutoff valve for controlling fluid flow from the primary channel into the tank. The gauge drive apparatus includes a gauge float, a shuttle, and an elongated extension body. The gauge float is movable with respect to the extension body between an uppermost position and a lowermost position, thereby driving the shuttle. The shuttle has a gauge actuation portion transportable within the shuttle interface channel to thereby actuate the fuel level indicator.

Abstract: A system for intra-operatively registering a pelvis comprising an acetabulum with a computer model of the pelvis in a coordinate system. The system may include: a) a surgical navigation system including a tracking device; and b) at least one computing device in communication with the surgical navigation system. The at least one computing device: i) receiving first data points from first intra-operatively collected points on an articular surface of the acetabulum, the first data points collected with the tracking device; ii) receiving a second data point from a second intra-operatively collected point on the pelvis, the second data point collected with the tracking device, the second data point corresponding in location to a second virtual data point on the computer model; and iii) determining an intra-operative center of rotation of the femur relative to the pelvis from the first data points.

Abstract: A method of forming a semiconductor structure is provided. Two wafers are first bonded by oxide bonding. Next, the thickness of a first wafer is reduced using an ion implantation and separation approach, and a second wafer is thinned by using a removal process. First devices are formed on the first wafer, and a carrier is then attached over the first wafer, and an alignment process is performed from the bottom of the second wafer to align active regions of the second wafer for placement of the second devices with active regions of the first wafer for placement of the first devices. The second devices are then formed in the active regions of the second wafer. Furthermore, a via structure is formed through the first wafer, the second wafer and the insulation layer therebetween to connect the first and second devices on the two sides of the insulation layer.

Abstract: An exemplary endoscope may be provided with a first shaft, a second shaft and an image capture module. The first shaft may extend from a distal end of an endoscope body and may include a distal opening and a proximal opening. The second shaft may extend through an interior of the first shaft and may also include a distal opening and a proximal opening. The image capture module may be in operable communication with the endoscope body distal end. The endoscope may be configured to clear debris from the image capture module with suction when the second shaft proximal opening and first shaft proximal opening are in alignment. Methods of use are also disclosed.

Abstract: A backlight device to provide a light source is provided. The backlight device includes a switching element, a graphics processor, and a graphics generator. The graphics processor is electrically connected to the switching element, and generates a partition data signal. The graphics generator is electrically connected to the switching element, and generates an image signal. When the backlight device operates in a normal mode, the switching element receives the partition data signal, so that different blocks of the backlight device have different levels of brightness. When the backlight device operates in a safe mode, the switching element receives the image signal, so that different blocks of the backlight device have the same level of brightness.

Abstract: A switching power converter is provided with a one-shot bias boosting circuit that responds to a premature trip point to boost the performance of a linear comparator in a pulse width modulator. In a sense-amplifier based implementation of the comparator, a clock-edge generator boosts the performance of the sense amplifier at the premature trip point.

Abstract: The present disclosure relates to multicistronic RNA vaccines and uses thereof. The present disclosure also relates to multicistronic conventional mRNA vaccines and uses thereof.

Abstract: A key structure is applicable to an electronic device having a housing. The key structure includes a seat, a switch, a button, and an elastic sheet. The seat is disposed in the housing and has a first through hole. The switch is disposed on the seat. A key pillar of the button passes through the first through hole to abut against the switch. The elastic sheet includes a body, and a plurality of first elastic arms, second elastic arms and third elastic arms. The first elastic arms extending from the body are abutting against the housing. The second elastic arms extending from an inner edge of the second through hole are engaged with the key pillar. The third elastic arms abutting against the keycap are configured to support the button and provide a restoring force that can restore the button from a pressed position to an initial position.

Abstract: The present disclosure relates to self-replicating RNA encoding an antigen from severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) and uses thereof. Specifically, the disclosure provides a self-replicating RNA or a monocistronic self-replicating RNA comprising a nucleotide sequence encoding an antigen operably linked to a subgenomic promoter, wherein the antigen is from SARS-CoV-2, and wherein the antigen is a Spike (S) protein or a nucleocapsid (N) protein.