Abstract: New beta-style (bcc) titanium alloys are disclosed. The new alloys generally include 4-8 wt. % Al, 4-8 wt. % Nb, 4-8 wt. % V, 1-5 wt. % Mo, optionally 2-6 wt. % Cr, the balance being titanium, optional incidental elements, and unavoidable impurities. The new alloys may realize an improved combination of properties as compared to conventional titanium alloys.

Abstract: A method of generating search suggestions includes receiving an indication of a current location of the user device. After a user accesses a search function on the user device and before the user submits a search request, the method includes determining search results associated with locations in proximity to the current location of the user device, using query log data indicating selections of past search results by users after presentation of the past search results in response to respective past queries. The method also includes determining relative positioning of the search results based on the number of users that selected each search result, determining categories associated with the search results, grouping the search results by the determined categories; and sending the grouped search results and the one or more categories associated with the search results to the user device for display according to the determined relative positioning.

Abstract: New beta-style (bcc) titanium alloys are disclosed. The new alloys generally include 2.0-6.0 wt. % Al, 4.0-12.0 wt. % V, and 1.0-5.0 wt. % Fe, the balance being titanium, any optional incidental elements, and unavoidable impurities. The new alloys may realize an improved combination of properties as compared to conventional titanium alloys.

Abstract: New alpha-beta titanium alloys are disclosed. The new alloys generally include 7.0-11.0 wt. % Al, and 1.0-4.0 wt. % Mo, wherein Al:Mo, by weight, is from 2.0:1-11.0:1, the balance being titanium, any optional incidental elements, and unavoidable impurities. The new alloys may realize an improved combination of properties as compared to conventional titanium alloys.

Abstract: The leadframe substrate includes an isolator incorporated with metal leads by a compound layer. The metal leads are disposed about sidewalls of the isolator and provide horizontal and vertical routing for a semiconductor device to be assembled on the isolator. The compound layer covers the sidewalls of the isolator and fills in spaces between the metal leads, and provides robust mechanical bonds between the metal leads and the isolator.

Abstract: New aluminum alloys having iron, vanadium, silicon, and copper, and with a high volume of ceramic phase therein are disclosed. The new products may include from 3 to 12 wt. % Fe, from 0.1 to 3 wt. % V, from 0.1 to 3 wt. % Si, from 1.0 to 6 wt. % Cu, from 1 to 30 vol. % ceramic phase, the balance being aluminum and impurities. The ceramic phase may be homogenously distributed within the alloy matrix.

Abstract: A wiring board includes an electrical isolator laterally surrounded by a base board and a molding compound. The electrical isolator is inserted into a through opening of the base board and has a thickness greater than that of the base board. The molding compound covers the top side of the base board and sidewalls of the electrical isolator, and provides a reliable interface for deposition of a routing circuitry thereon. The base board can serve as an alignment guide for isolator placement or/and provide another routing to enhance electrical routing flexibility for the wiring board.

Abstract: A thermally enhanced semiconductor assembly with three dimensional integration includes a semiconductor chip electrically coupled to a wiring board by bonding wires. A heat spreader that provides an enhanced thermal characteristic for the semiconductor chip is disposed in a through opening of a wiring structure. Another wiring structure disposed on the heat spreader not only provides mechanical support, but also allows heat spreading and electrical grounding for the heat spreader by metallized vias. The bonding wires provide electrical connections between the semiconductor chip and the wiring board for interconnecting the semiconductor chip to terminal pads provided in the wiring board.

Abstract: A technique is disclosed for automatic switching of a mobile device between a videoconference operating mode and a teleconference operating mode, where the automatic switching is based on a detected functional use and current position of the device in relation to a user of the device. In at least some embodiments, the disclosed technology includes a video-audio switching system that works in coordination with a sensor mechanism associated with the device to enable the automatic switching. The technology disclosed herein enables the user to carry out a conversation via the device (i.e., conference session) without interruption when transitioning between different settings, (e.g., using the device while sitting at an office to using it while on-the-go to an appointment).

Abstract: A system and method for quantifying clinical skill of a user, comprising: collecting data relating to a surgical task done by a user using a surgical device; comparing the data for the surgical task to other data for another similar surgical task; quantifying the clinical skill of the user based on the comparing of the data for the surgical task to the other data for the other similar surgical task; outputting the clinical skill of the user.

Abstract: A thermally enhanced semiconductor assembly with three dimensional integration includes a stacked semiconductor sub-assembly electrically coupled to a wiring board by bonding wires. A heat spreader that provides an enhanced thermal characteristic for the stacked semiconductor sub-assembly is disposed in a through opening of a wiring structure. Another wiring structure disposed on the heat spreader not only provides mechanical support, but also allows heat spreading and electrical grounding for the heat spreader by metallized vias. The bonding wires provide electrical connections between the sub-assembly and the wiring board for interconnecting devices assembled in the sub-assembly to terminal pads provided in the wiring board.

Abstract: A thermally enhanced semiconductor assembly with three dimensional integration includes a first component and a second component face-to-face mounted together. A heat spreader that provides an enhanced thermal characteristic for the semiconductor assembly is disposed in a through opening of a routing circuitry. Another routing circuitry disposed on the heat spreader not only provides mechanical support, but also allows heat spreading and electrical grounding for the heat spreader by metallized vias.

Abstract: Systems for quantifying clinical skill of a user, comprising: collecting data relating to a surgical task done by a user using a surgical device; comparing the data for the surgical task to other data for another similar surgical task; quantifying the clinical skill of the user based on the comparing of the data for the surgical task to the other data for the other similar surgical task; outputting the clinical skill of the user.

Abstract: Described herein is a teleoperational medical system for performing a medical procedure in a surgical field. The teleoperational system comprises an eye tracking unit and a control unit. The eye tracking unit includes an image display configured to display to a user an image of the surgical field, at least one eye tracker configured to measure data about a gaze point of the user, and a processor configured to process the data to determine a viewing location in the displayed image at which the gaze point of the user is directed. The control unit is configured to control at least one function of the teleoperational medical system based upon the determined viewing location.

Abstract: A semiconductor assembly includes an anti-warping controller, a semiconductor device, a balance layer and a first routing circuitry positioned within a through opening of a stiffener and a second routing circuitry positioned outside of the through opening of the stiffener and electrically connected to the first routing circuitry and a vertical connecting element of the stiffener. The mechanical robustness of the stiffener and the anti-warping controller can prevent the assembly from warping, whereas the vertical connecting element of the stiffener provides electrical connection between two opposite sides of the stiffener. The first routing circuitry can enlarge the pad size and pitch of the semiconductor device, whereas the second routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the first routing circuitry with the stiffener.

Abstract: New magnesium-zinc aluminum alloy bodies and methods of producing the same are disclosed. The new magnesium-zinc aluminum alloy bodies generally include 3.0-6.0 wt. % magnesium and 2.5-5.0 wt. % zinc, where at least one of the magnesium and the zinc is the predominate alloying element of the aluminum alloy bodies other than aluminum, and wherein (wt. % Mg)/(wt. % Zn) is from 0.6 to 2.40, and may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new magnesium-zinc aluminum alloy bodies may realize improved strength and other properties.

Abstract: A semiconductor assembly includes a face-to-face semiconductor sub-assembly electrically coupled to a circuit board by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a routing circuitry, and is disposed in a through opening of the circuit board. The bonding wires provide electrical connections between the routing circuitry and the circuit board to interconnect the devices face-to-face assembled in the sub-assembly with the circuit board for next-level connection from two opposite sides of the circuit board.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for dynamically generating indicators of entity locations on an electronic map corresponding, for example, to a suggested search request. In one aspect, a method includes providing an electronic map of a geographic area for display on a user interface, receiving a character string entered into the user interface, the character string representing a partial search query, determining a suggested search request based on the character string, and identifying an entity responsive to the suggested search request and a geographic location for the identified entity. An indicator identifying the geographic location of the entity is provided for display on the electronic map.

Abstract: A semiconductor assembly with three dimensional integration includes a face-to-face semiconductor sub-assembly electrically coupled to a heat spreader by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a first routing circuitry, and the heat spreader includes a metal plate and a second routing circuitry on the metal plate.

Abstract: Embodiments of this disclosure include systems, methods, and kits for sterilizing in vivo catheters using an optical fiber to deliver UV light. In an embodiment, a method for sterilizing a catheter with at least a first lumen, includes inserting a distal end of a fiber optic cable into a fiber insertion port of a catheter connector attached to a hub of the first lumen, flushing the first lumen with fluid from a fluid source, inserting the fiber optic cable into the first lumen until a stopper of the fiber optic cable is adjacent to the fiber insertion port, providing light to the fiber optic cable from a light source after the fiber optic cable is inserted into the first lumen, withdrawing the fiber optic cable from the first lumen while the light is provided, and ceasing to provide light to the fiber optic cable after the fiber optic cable is withdrawn from the first lumen. The disclosure is also applicable to catheters with multiple lumens and to catheters accessed through subcutaneous ports.