Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.

Abstract: The present invention provides multispecific antibodies that bind to EGFR and CD28 (EGFR×CD28) as well as anti-EGFR antibodies. Such antibodies may be combined with a further therapeutic agent such as an anti-PD1 antibody. Methods for treating cancers (e.g., EGFR-expressing cancer) by administering the antibodies (e.g., and combinations thereof with anti-PD1) are also provided. The EGFR×CD28 antibodies of the present invention embody a tumor-targeted immunotherapeutic modality combined with PD-1 inhibition. These bispecific antibodies bind a tumor-specific antigen (TSA) (EGFR) with one arm and the co-stimulatory receptor, CD28, on T-cells with the other arm. Combination therapy with PD-1 inhibitors specifically potentiated intra-tumoral T cell activation, promoting an effector memory-like T cell phenotype without systemic cytokine secretion in a variety of syngeneic and human tumor xenograft models.

Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.

Abstract: In some embodiments, an electronic device displays a plurality of content items in a messaging conversation. In some embodiments, the electronic device displays user interfaces associated with one or more content items in a messaging conversation.

Abstract: The present disclosure generally relates to user interfaces for electronic devices, including user interfaces for viewing and interacting with media items.

Abstract: A package structure is provided. The package structure includes a substrate having interior sidewalls forming a recess. The interior sidewalls have an upper sidewall, a lower sidewall, and an intermediate sidewall. The intermediate sidewall is between the upper sidewall and the lower sidewall. The upper sidewall, the lower sidewall, and the intermediate sidewall have different slopes. The package structure also includes a chip-containing structure over the substrate. A component of the chip-containing structure is partially or completely surrounded by the interior sidewalls.

Abstract: A computer system receives, by a first application, a plurality of shared media items and receives a request to display a view of a media application that includes the media library that includes a first plurality of media items. The computer system displays a collection of media items in the media application that are selected based on first criteria. Displaying the collection of media items includes displaying a second plurality of media items selected from the media library based on the first criteria. In accordance with a determination that a first shared media item from a set of one or media items that have not been added to the media library meets display criteria, the display criteria including the first criteria, displaying the first shared media item in the collection of media items concurrently with the second plurality of media items.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: A method of forming a semiconductor device includes forming a dummy gate over a substrate, forming dielectric materials over a top surface and sidewalls of the dummy gate, and replacing the dummy gate with a gate structure. The dummy gate has a first width located a first distance away from the substrate, a second width located a second distance away from the substrate, and a third width located a third distance away from the substrate. The second distance is less than the first distance. The second width is less than the first width. The third distance is less than the second distance. The third width is greater than the second width.

Abstract: A package structure is provided. The package structure includes a first conductive pad in an insulating layer, a first under bump metallurgy structure under the first insulating layer, and a first conductive via in the insulating layer. The first conductive via is vertically connected to the first conductive pad and the first under bump metallurgy structure. In a plan view, a first area of the first under bump metallurgy structure is confined within a second area of the first conductive pad.

Abstract: A semiconductor device and method of manufacture are provided which utilize a remote plasma process which reduces or eliminates segregation of material. By reducing segregation of the material, overlying conductive material can be deposited on a smoother interface. By depositing on smoother interfaces, overall losses of the deposited material may be avoided, which improves the overall yield.

Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.

Abstract: This invention relates to an innovative recyclable hair clip, which includes at least a clip body and a twisted plastic elastic sheet. Said clip body 1 is provided with a first body 10 and a second body 11, said first body 10 is provided with a first clamping portion 100 and a first pressing portion 101, and said second body 11 is provided with a second clamping portion 110 and a second pressing portion 111; a pivoting fastening mechanism 12 is arranged between said first body 10 and said second body 11, through which said first body 10 and said second body 11 can be pivotally opened and clamped to each other. Said twisted plastic elastic sheet is inserted inside said clip body, so the recyclable hair clip can be assembled quickly to effectively reduce the manufacturing cost, and the whole used hair clip can be recycled and reused.

Abstract: The present disclosure provides IL2 proproteins comprising an IL2 moiety that is masked with an IL2R? moiety and a protease-cleavable linker, configured such that the IL2R? moiety is released from the IL2 moiety upon the action of a protease, e.g., at a tumor site. The IL2 proproteins optionally further comprise a targeting moiety, e.g., a targeting moiety that recognizes a tumor-associated antigen and directs the proprotein to a tumor site. The disclosure further provides pharmaceutical compositions comprising the IL2 proproteins, and methods of use of the IL2 proproteins in therapy, as well as nucleic acids encoding the IL2 proproteins, recombinant cells that express the IL2 proproteins and methods of producing the IL2 proproteins.

Abstract: A semiconductor device and methods of fabricating the same are disclosed. The semiconductor device includes a substrate, a fin structure with a fin top surface disposed on the substrate, a source/drain (S/D) region disposed on the fin structure, a gate structure disposed on the fin top surface, and a gate spacer with first and second spacer portions disposed between the gate structure and the S/D region. The first spacer portion extends above the fin top surface and is disposed along a sidewall of the gate structure. The second spacer portion extends below the fin top surface and is disposed along a sidewall of the S/D region.

Abstract: A method of forming a semiconductor device includes: forming a first conductive feature in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; etching the second dielectric layer using a patterned mask layer to form an opening in the second dielectric layer, where the opening exposes the first conductive feature; performing an ashing process to remove the patterned mask layer after the etching; wet cleaning the opening after the ashing process, where the wet cleaning enlarges a bottom portion of the opening; and filling the opening with a first electrically conductive material.

Abstract: A semiconductor device and method of manufacture are provided which utilize a remote plasma process which reduces or eliminates segregation of material. By reducing segregation of the material, overlying conductive material can be deposited on a smoother interface. By depositing on smoother interfaces, overall losses of the deposited material may be avoided, which improves the overall yield.

Abstract: The present disclosure provides IL2 proproteins comprising an IL2 moiety that is masked with an IL2R? moiety and a protease-cleavable linker, configured such that the IL2R? moiety is released from the IL2 moiety upon the action of a protease, e.g., at a tumor site. The IL2 proproteins optionally further comprise a targeting moiety, e.g., a targeting moiety that recognizes a tumor-associated antigen and directs the proprotein to a tumor site. The disclosure further provides pharmaceutical compositions comprising the IL2 proproteins, and methods of use of the IL2 proproteins in therapy, as well as nucleic acids encoding the IL2 proproteins, recombinant cells that express the IL2 proproteins and methods of producing the IL2 proproteins.

Abstract: Various implementations include systems for processing audio signals. In particular implementations, a system for processing audio signals includes: an accessory device that includes a first processor for running a machine learning model on an input signal, where the machine learning model includes a classifier configured to generate metadata associated with the input signal; and a wearable audio device configured for wireless communication with the accessory device, the wearable audio device including a second processor that utilizes the metadata from the accessory device to process a source audio signal and output a processed audio signal.

Abstract: The present disclosure generally relates to methods and user interfaces concerning media libraries, such as methods and user interfaces for managing one or more media libraries, methods and user interfaces for notifying participants of changes to one or more media libraries, methods and user interfaces for managing captured media for one or more media libraries, methods and user interfaces for recommending media items for one or more media libraries, and methods and user interfaces for managing duplicate media.