Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Abstract: A semiconductor structure including a first substrate, a first dielectric layer, a first oxygen doped carbide (ODC) bonding layer, a second substrate, a second dielectric layer, and a second ODC bonding layer is provided. The first dielectric layer is located on the first substrate. The first ODC bonding layer is located on the first dielectric layer. The second dielectric layer is located on the second substrate. The second ODC bonding layer is located on the second dielectric layer. The first ODC bonding layer and the second ODC bonding layer are bonded to each other.

Abstract: Provided herein are methods of mediating killing of a tumor cell by administering to the subject a multispecific antigen binding molecule with a first antigen binding region specific for first target antigen and a second antigen binding region specific for a CD28 protein. In some embodiments, the tumor cell does not express the target antigen. In some embodiments, the tumor cell is not predicted to express the target antigen.

Abstract: An embodiment is package structure including a first integrated circuit die, a redistribution structure bonded to the first integrated circuit die, the redistribution structure including a first metallization pattern in a first dielectric layer, the first metallization pattern including a plurality of first conductive features, each of the first conductive features including a first conductive via in the first dielectric layer and first conductive line over the first dielectric layer and electrically coupled to the respective first conductive via, each of the first conductive lines comprising a curve in a plan view, a second dielectric layer over the first dielectric layer and the first metallization pattern, and a second metallization pattern in the second dielectric layer, the second metallization pattern including a plurality of second conductive via in the second dielectric layer, each of the second conductive vias being over and electrically coupled to a respective first conductive line.

Abstract: A package structure is provided. The package structure includes a semiconductor die over a redistribution structure, bonding elements below the redistribution structure, and an underfill layer surrounding the bonding elements and the redistribution structure. The semiconductor die has a rectangular profile in a plan view. A pitch of the bonding elements is defined as the sum of a diameter of the bonding elements and a spacing between neighboring two of the bonding elements. A first circular area of the redistribution structure is entirely covered and in direct contact with the underfill layer. The center of the first circular area is aligned with a first corner of the rectangular profile of the semiconductor die. A diameter of the first circular area is greater than twice the pitch of the bonding elements.

Abstract: Antigen binding molecules (ABMs) comprising Fab domains in non-native configurations, ABM conjugates comprising the ABMs and cytotoxic or cytostatic agents, pharmaceutical compositions containing the ABMs and ABM conjugates, methods of using the ABMs, ABM conjugates and pharmaceutical compositions for treating cancer, nucleic acids encoding the ABMs, cells engineered to express the ABMs, and methods of producing ABMs.

Abstract: A computer-implemented method for quality measurement for videoconferencing may include (i) measuring the interaction levels of a plurality of video conference attendees in a group video conference, (ii) designating, based at least in part on the interaction levels, a current dominant speaker in the group video conference, (iii) calculating a video conference quality level for the current dominant speaker in the group video conference, and (iv) providing the video conference quality level for the current dominant speaker as the video conference quality level for the group video conference. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The present disclosure generally relates to techniques and user interfaces for capturing media, displaying a preview of media, displaying a recording indicator, displaying a camera user interface, and/or displaying previously captured media.

Abstract: The present disclosure relates to IL2 agonists with improved therapeutic profiles.

Abstract: The present invention provides multispecific antibodies that bind to EGFR and CD28 (EGFRxCD28) as well as anti-EGFR antibodies. Such antibodies may be combined with a further therapeutic agent such as an anti-PD1 antibody. Methods for treating cancers (e.g., EGFR-expressing cancer) by administering the antibodies (e.g., and combinations thereof with anti-PD1) are also provided. The EGFRxCD28 antibodies of the present invention embody a tumor-targeted immunotherapeutic modality combined with PD-1 inhibition. These bispecific antibodies bind a tumor-specific antigen (TSA) (EGFR) with one arm and the co-stimulatory receptor, CD28, on T-cells with the other arm. Combination therapy with PD-1 inhibitors specifically potentiated intra-tumoral T cell activation, promoting an effector memory-like T cell phenotype without systemic cytokine secretion in a variety of syngeneic and human tumor xenograft models.

Abstract: A package structure and a formation method of a package structure are provided. The method includes forming a recess in a circuit substrate, and the recess has a first sidewall and a second sidewall. The second sidewall is between the first sidewall and a bottommost surface of the circuit substrate, and the second sidewall is steeper than the first sidewall. The method also includes forming a die package, and the die package has a semiconductor die. The method further includes bonding the die package to the circuit substrate through bonding structures such that a portion of the semiconductor die enters the recess of the circuit substrate. In addition, the method includes forming an underfill material to surround the bonding structures and to fill the recess.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a contact layer over a metal silicide layer. The contact layer extends through a first dielectric structure. The semiconductor device structure includes a first metal nitride barrier layer over sidewalls of the contact layer. The first metal nitride barrier layer is directly adjacent to the first dielectric structure. The semiconductor device structure includes a second metal nitride barrier layer partially between the contact layer and the metal silicide layer and partially between the contact layer and the first metal nitride barrier layer. The metal silicide layer is below the first metal nitride barrier layer and the second metal nitride barrier layer.

Abstract: The present disclosure relates to IL2 agonists with improved therapeutic profiles.

Abstract: A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, an electronic component, a ring structure, and an adhesive layer. The electronic component is located over a surface of the substrate. The ring structure is located over the surface of the substrate and surrounding the electronic component. The ring structure has a bottom surface facing the surface of the substrate and a top surface opposite the bottom surface. The ring structure includes recesses recessed from and located on the top surface, wherein the recesses are arranged corresponding to the corners of the substrate. The adhesive layer is interposed between the bottom surface of the ring structure and the surface of the substrate.

Abstract: An anti-curling film is provided. The anti-curling film includes a first portion and a second portion covering the first portion. The first portion includes polylactic acid (PLA), polycaprolactone (PCL), polyethylene glycol dimethacrylate (PEGDMA) and a photoinitiator. The second portion includes polycaprolactone (PCL), gelatin, hyaluronic acid (HA), alginate (AA), polyvinyl alcohol (PVA) or a combination thereof.

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

Abstract: A method for manufacturing an integrated hull by using 3D structure type fiber clothes and 3D vacuum infusion process includes: sequentially stacking at least one first fiber cloth, at least one core material and at least one second fiber cloth on a mold; deploying structural materials on the second fiber cloth; stacking the third fiber clothes to cover the structure materials and a part of the second fiber cloth, whereby the first fiber cloth, the core material, the second fiber cloth and the third fiber clothes are formed to a lamination; determining a pipe arrangement of vacuum pipes and first and second resin pipes; deploying a vacuum bag on the lamination and covering the first and second resin pipes and the vacuum pipe; executing the 3D vacuum infusion process; curing the resin; and executing a mold release process to complete an integrated hull.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, semiconductor dies over the package substrate, and an underfill element over the package substrate and surrounding the semiconductor dies. A portion of the underfill element is located between the semiconductor dies. The semiconductor die package also includes lid structures respectively attached to the top surfaces of the semiconductor dies. In plan view, each lid structure is located within the periphery of the top surface of the corresponding semiconductor die. Each lid structure is disconnected from other lid structures, and a gap is formed between adjacent lid structures and located over the portion of the underfill element.

Abstract: The present disclosure relates to molecules capable of binding to both CD20 and PD1, as well as pharmaceutical compositions comprising such molecules and methods of use thereof.

Abstract: A composite cleat includes a first component and a second component. The first component is made of a first material and is formed a first connecting portion extended along a longitudinal axis and a ground contact surface disposed at one end thereof. The second component is made of a second material different from the first material and is formed a second connecting portion fixedly connected with the first connecting portion and a threaded stud disposed at one end thereof.