Abstract: The present invention provides a mobile charging device capable of battery replacement, comprising a demountable casing, a control module, and a replaceable battery pack. The demountable casing is demounted or mounted by a demountable means. The control module is disposed in the demountable casing. The replaceable battery pack is disposed in the demountable casing, electrically connected to the control module, controlled by the control module to perform charging or discharging, and is changeable when the demountable casing is demounted. The mobile charging device of the present invention can be directly replaced the battery when the mobile power source is exhausted or insufficient, which enhances practicability.

Abstract: An EUV radiation source module includes a target droplet generator configured to generate target droplets; a first laser source configured to generate first laser pulses that heat the target droplets to produce target plumes; a second laser source configured to generate second laser pulses that heat the target plumes to produce plasma emitting EUV radiation; third and fourth laser sources configured to generate first and second laser beams, respectively, that are directed onto a travel path of the target plumes, wherein the first and second laser beams are substantially parallel; and a monitor configured to receive the first and second laser beams reflected by the target plumes.

Abstract: An EUV radiation source module includes a target droplet generator configured to generate target droplets; a first laser source configured to generate first laser pulses that heat the target droplets to produce target plumes; a second laser source configured to generate second laser pulses that heat the target plumes to produce plasma emitting EUV radiation; third and fourth laser sources configured to generate first and second laser beams, respectively, that are directed onto a travel path of the target plumes, wherein the first and second laser beams are substantially parallel; and a monitor configured to receive the first and second laser beams reflected by the target plumes.

Abstract: The present invention provides a steam-off gel nail removal device comprising a casing. A plurality of finger insertion holes for finger insertion is disposed on one side of the casing, and a receiving space is disposed on the inner side of the casing. The receiving space has therein a heating device and a control device connected to the heating device. A gel polish removing solution container is disposed on the inner side of the receiving space. The heating device is disposed on one side of the gel polish removing solution container to heat the gel polish removing solution container. The steam-off gel nail removal device of the present invention further comprises a safety switch and a finger separation unit for taking safety-enhancing measures to ensure user safety. The finger insertion holes are sufficient for every user's left hand or right hand to be placed comfortably on the steam-off gel nail removal device.

Abstract: A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.

Abstract: A method for monitoring gas in a wafer processing system is provided. The method includes producing an exhaust flow in an exhausting conduit from a processing chamber. The method further includes placing a gas sensor in fluid communication with a detection point located in the exhausting conduit via a sampling tube that passes through a through hole formed on the exhausting conduit. The detection point is located away from the through hole. The method also includes detecting a gas condition at the detection point with the gas sensor. In addition, the method also includes analyzing the gas condition detected by the gas sensor to determine if the gas condition in the exhausting conduit is in a range of values.

Abstract: A method for generating light is provided. The method includes generating targets with a fuel target generator. The method further includes measuring a period of time during which one of the targets passes through two detection positions on a path along which the targets move. The method also includes exciting the targets with a laser generator so as to generate plasma that emits light. In addition, the method includes adjusting at least one parameter of the fuel target generator or the laser generator according to the measured period of time, when the measured period of time is different from a predetermined value.

Abstract: Integrated circuit packages and methods of forming the same are provided. One or more redistribution layers are formed on a carrier. First connectors are formed on a first side of the RDLs. Dies are bonded to the first side of the RDLs using the first connectors. An encapsulant is formed on the first side of the RDLs around the dies. The carrier is de-bonded from the overlaying structure and second connectors are formed on a second side of the RDLs. The resulting structure in diced to form individual packages.

Abstract: A method and a system for diagnosing remaining lifetime of storages in a data center are disclosed. The method includes the steps of: a) sequentially and periodically collecting operating attributes of failed storages along with time-to-fail records of the failed storages in a data center; b) grouping the operating attributes collected at the same time or fallen in a continuous period of time so that each group has the same number of operating attributes; c) sequentially marking a time tag for the groups of operating attributes; d) generating a trend model of remaining lifetime of the storages from the operating attributes and time-to-fail records by ML and/or DL algorithm(s) with the groups of operating attributes and time-to-fail records fed according to the order of the time tags; and e) inputting a set of operating attributes of a currently operating storage into the trend model to calculate a remaining lifetime therefor.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.

Abstract: A lithography apparatus is provided. The lithography apparatus includes a reticle stage. The reticle stage includes a main base, an electrostatic chuck and a safety protecting device. The electrostatic chuck is disposed on the main base and configured to generate an electrostatic force for holding a reticle. The safety protecting device is connected to the main base and is configured to generate a pushing force toward the reticle when the electrostatic force generated by the electrostatic chuck is interrupted.

Abstract: Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.

Abstract: A method of controlling a droplet illumination module/droplet detection module system of an extreme ultraviolet (EUV) radiation source includes irradiating a target droplet with light from a droplet illumination module and detecting light reflected and/or scattered by the target droplet. The method includes determining whether an intensity of the detected light is within an acceptable range. In response to determining that the intensity of the detected light is not within the acceptable range, a parameter of the droplet illumination module is automatically adjusted to set the intensity of the detected light within the acceptable range.

Abstract: A radiation source apparatus is provided. The radiation source apparatus includes a chamber, a target droplet generator, an exhaust module, a measuring device, and a controller. The target droplet generator is configured to provide a plurality of target droplets to the chamber. The exhaust module is configured to extract debris corresponding to the target droplets out of the chamber according to a first gas flow rate. The measuring device is configured to measure concentration of the debris in the chamber. The controller is configured to adjust the first gas flow rate according to the measured concentration of the debris.

Abstract: A light source for extreme ultraviolet (EUV) radiation is provided. The light source includes a target droplet generator, a laser generator, a measuring device, and a controller. The target droplet generator is configured to provide a plurality of target droplets to a source vessel. The laser generator is configured to provide a plurality of first laser pulses according to a control signal to irradiate the target droplets in the source vessel, so as to generate plasma as the EUV radiation. The measuring device is configured to measure process parameters including temperature of the source vessel, droplet positions of the target droplets, and beam sizes and focal points of the first laser pulses. The controller is configured to provide the control signal according to at least two of the process parameters.

Abstract: A method for achieving distributed deduplication for a storage system for Internet Of Things (IOT) backup in a data center and associated storage system are provided. The system includes a number of storage units. Each storage unit includes a number of to-be-stored-destinations; a control unit, for controlling operations of the storage unit; and a distributed deduplication module, for providing or updating the deterministic function to the control unit and the edge component, and executing each step of the method in the control unit and/or the edge component.

Abstract: The present invention is to provide a gel nail photocuring machine with multicolor light effects, comprising: a machine body and a control module. The machine body has a curing cavity and one or a plurality of multicolor indicator light module provided on the machine body to produce color light effects on a housing of the machine body, wherein the multicolor indicator light module has a composite light source and a uniform illumination unit provided on one side of the composite light source. The control module is provided on the machine body and is connected to the multicolor indicator light module on the machine body, wherein the control module provides a color difference control instruction to the multicolor indicator light module according to a preset instruction in order to control an output power of each of a plurality of base-color light-emitting units of the composite light source, thereby instructing the multicolor indicator light module to emit light of various colors.

Abstract: A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.