Patents by Inventor Chieh Hsieh

Chieh Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DRINK CONTAINER AND LID ASSEMBLY THEREOF
    Publication number: 20220386796
    Abstract: A drink container and a lid assembly thereof are provided. The drink container includes a container body and the lid assembly, the lid assembly includes a first lid and a second lid, the first lid is screwed at an opening end of the container body through screw threads, the first lid has a top portion, and the top portion of the first lid has an opening portion. The second lid is disposed above the first lid, the second lid includes a plunger component, and a bottom portion of the plunger can be engaged with the opening portion and sealed with the opening portion. The plunger component is connected to a connection arm, and one side of the connection arm corresponding to the plunger component is pivotally connected to a pivot portion of the first lid. The plunger component has a second accommodating space configured to accommodate a straw.
    Type: Application
    Filed: January 18, 2022
    Publication date: December 8, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • Die stacking structure and method forming same
    Patent number: 11521959
    Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: December 6, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Ming Hung Tseng
  • OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
    Publication number: 20220382004
    Abstract: An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Yu-Hsiang Hu, Chewn-Pu Jou, Feng-Wei Kuo
  • Crystal for flow cytometry with dual laser beams
    Patent number: 11513055
    Abstract: A crystal for flow cytometry with dual laser beams is disclosed. The crystal is a birefringent crystal comprising a material composition including a quartz mineral having a face side including a face angle of ninety degrees plus or minus one tenth of a degree; a wedge side that is substantially perpendicular to the face side, wherein the wedge side includes a wedge angle of two degrees plus or minus one tenth of a degree; and a major side that is substantially perpendicular to the face side and the wedge side. The major side includes a thickness of one and one-half millimeter plus or minus one tenth of a millimeter. A polarized light beam entering the birefringent crystal at an incident angle is separated into an ordinary light beam and an extraordinary light beam.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 29, 2022
    Assignee: Cytek Biosciences, Inc.
    Inventors: Ming Yan, Eric Chase, Yung-Chieh Hsieh
  • Probe card device and disposable adjustment film thereof
    Patent number: 11506685
    Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: November 22, 2022
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Wei-Jhih Su, Chao-Hui Tseng, Hsien-Yu Wang, Vel Sankar Ramachandran
  • Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap
    Patent number: 11506843
    Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Che-Hsiang Hsu, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu
  • PROBE CARD DEVICE AND DISPOSABLE ADJUSTMENT FILM THEREOF
    Publication number: 20220365110
    Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.
    Type: Application
    Filed: October 1, 2021
    Publication date: November 17, 2022
    Inventors: KAI-CHIEH HSIEH, WEI-JHIH SU, CHAO-HUI TSENG, HSIEN-YU WANG, VEL SANKAR RAMACHANDRAN
  • SEMICONDUCTOR DEVICE HAVING PHOTONIC AND ELECTRONIC DIES AND AN OPTICAL FIBER ASSEMBLY CREATING AN AIR GAP
    Publication number: 20220365286
    Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Che-Hsiang Hsu, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220365273
    Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Che-Hsiang Hsu, Chewn-Pu Jou, Cheng-Tse Tang
  • STRAW STRUCTURE
    Publication number: 20220361697
    Abstract: A straw structure is provided. The straw structure includes a straw body, and the straw body has a first beveled edge at an opening of a bottom end of the straw body and a second beveled edge connected to a rear side of the first beveled edge. A puncturing end opening is formed at the first beveled edge and a side edge of the straw body, and the bottom end of the straw body has a beveled opening formed at the second beveled edge. The puncturing end opening is an acute angle that is less than 90 degrees, and a slope of the second beveled edge is greater than a slope of the first beveled edge.
    Type: Application
    Filed: November 30, 2021
    Publication date: November 17, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • PACKAGE STRUCTURE
    Publication number: 20220365297
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • CONTAINER ASSEMBLY AND CONTAINER LID
    Publication number: 20220355982
    Abstract: A container assembly and a container lid are provided. The container assembly includes a container body, a lid, a sleeved portion, an annular pressing portion, and a straw. The container body has an opening portion at an upper end thereof. The lid is detachably disposed on the opening portion and has a top portion at a top end thereof. The annular pressing portion is formed at a side surface of the sleeved portion. The sleeved portion has a second accommodating space recessed therein. When the lid is disposed on the opening portion, the annular pressing portion is in contact with an upper end edge of the opening portion, and a height of a bottom surface of the top portion is greater than a height of the upper end edge of the opening portion. The straw is accommodated in an accommodating space of the container body.
    Type: Application
    Filed: December 1, 2021
    Publication date: November 10, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • Die Stacking Structure and Method Forming Same
    Publication number: 20220359488
    Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Ming Hung Tseng
  • CONTAINER PROTECTIVE SLEEVE
    Publication number: 20220355975
    Abstract: A container protective sleeve is provided. The container protective sleeve is configured to be sleeved around a container bottom portion of a container. The container protective sleeve includes a protective sleeve body. The protective sleeve body is made of rubber or a silicone elastic material. The protective sleeve body includes a bottom board portion and a side wall portion surrounding an outer periphery of the bottom board portion. The side wall portion has at least one concave portion at one side of the side wall portion corresponding to the bottom board portion and at least one extension fin relatively protruding from the at least one concave portion. The at least one extension fin extends away from the bottom board portion.
    Type: Application
    Filed: November 30, 2021
    Publication date: November 10, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220352078
    Abstract: A semiconductor device includes a stacked structure, first conductive terminals and second conductive terminals. The stacked structure includes a first semiconductor component having a first area and a second semiconductor component stacked on the first semiconductor component and having a second area smaller than the first area, wherein an extending direction of the first area and an extending direction of the second area are perpendicular to a stacking direction of the first semiconductor component and the second semiconductor component. The first conductive terminals are located on the stacked structure, electrically coupled to the first semiconductor component and aside of the second semiconductor component. The second conductive terminals are located on the stacked structure and electrically coupled to the second semiconductor component.
    Type: Application
    Filed: June 30, 2022
    Publication date: November 3, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Hung Tseng, Cheng-Chieh Hsieh, Hao-Yi Tsai
  • SYSTEM AND METHOD FOR PERFORMING EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY PROCESSES
    Publication number: 20220350257
    Abstract: A photolithography system utilizes tin droplets to generate extreme ultraviolet radiation for photolithography. The photolithography system irradiates the droplets with a laser. The droplets become a plasma and emit extreme ultraviolet radiation. The photolithography system senses contamination of a collector mirror by the tin droplets and adjusts the flow of a buffer fluid to reduce the contamination.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 3, 2022
    Inventors: Tai-Yu CHEN, Sagar Deepak KHIVSARA, Kuo-An LIU, Chieh HSIEH, Shang-Chieh CHIEN, Gwan-Sin CHANG, Kai Tak LAM, Li-Jui CHEN, Heng-Hsin LIU, Chung-Wei WU, Zhiqiang WU
  • DEVICE AND METHOD TO REMOVE DEBRIS FROM AN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY SYSTEM
    Publication number: 20220342323
    Abstract: A method includes irradiating debris deposited in an extreme ultraviolet (EUV) lithography system with laser, controlling one or more of a wavelength of the laser or power of the laser to selectively vaporize the debris and limit damage to the EUV) lithography system, and removing the vaporized debris.
    Type: Application
    Filed: December 10, 2021
    Publication date: October 27, 2022
    Inventors: Chun-Han LIN, Chieh HSIEH, Sheng-Kang YU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN
  • SEMICONDUCTOR STRUCTURE OF CELL ARRAY WITH ADAPTIVE THRESHOLD VOLTAGE
    Publication number: 20220343053
    Abstract: Semiconductor structures are provided. A semiconductor structure includes a cell array. The cell array includes a first regular cell, a second regular cell and a first mixed cell. Each P-type transistor has a first threshold voltage and each N-type transistor has a second threshold voltage in the first regular cell. Each P-type transistor has a third threshold voltage and each N-type transistor has a fourth threshold voltage in the second regular cell. Each P-type transistor has the first threshold voltage and each N-type transistor has the fourth threshold voltage in the first mixed cell. The first regular cell, the second regular cell and the first mixed cell are arranged in the same row of the cell array. The first mixed cell is arranged between the first and second regular cells and is in contact with the first regular cell.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 27, 2022
    Inventors: Kin-Hooi DIA, Ho-Chieh HSIEH
  • Light source for lithography exposure process
    Patent number: 11483918
    Abstract: A method for generating light is provided. The method further includes measuring a period of time during which one of targets from a fuel target generator passes through two detection positions. The method also includes exciting the targets with a laser generator so as to generate plasma that emits light. In addition, the operation of exciting the targets with the laser generator includes: irradiating a pre-pulse laser on the targets to expand the targets; detecting conditions of expanded targets; and adjusting at least one parameter of the laser generator according to the measured period of time and the conditions when the measured period of time is different from a predetermined value. The parameter of the laser generator which is adjusted according to the measured period of time includes a frequency for generating a laser for illuminating the targets.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: October 25, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh Hsieh, Shang-Chieh Chien, Chun-Chia Hsu, Bo-Tsun Liu, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng
  • PROBE CARD DEVICE AND SPRING-LIKE PROBE
    Publication number: 20220334145
    Abstract: A probe card device and a spring-like probe are provided. The spring-like probe defines a longitudinal direction and a separation plane that is parallel to the longitudinal direction, and includes a fixing end portion, a testing end portion, and two stroke arms that are arranged between the fixing end portion and the testing end portion. The two stroke arms are spaced apart from each other and are respectively located at two opposite sides of the separation plane. Each of the two stroke arms is in a curved shape. Two projection regions defined by orthogonally projecting the two stroke arms onto the separation plane have at least one intersection point. In a cross section of the two stroke arms perpendicular to the longitudinal direction, an area of any one of the two stroke arms is 95% to 105% of an area of another one of the two stroke arms.
    Type: Application
    Filed: October 1, 2021
    Publication date: October 20, 2022
    Inventors: KAI-CHIEH HSIEH, WEI-JHIH SU, Hong-Ming Chen, VEL SANKAR RAMACHANDRAN