Patents by Inventor Chou

Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11837632
    Abstract: Provided is a wafer including a ring part and a processed part. The processed part is connected to the ring part. The processed part has a top surface which has been grounded and a bottom surface opposite to the top surface. The processed part is surrounded by the ring part. A region where the top surface connects to the ring part is a curved surface curved upwards.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: December 5, 2023
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Chan-Ju Wen, Chih-Wei Chang, Su Lien Chou
  • Patent number: 11836885
    Abstract: In one implementation, a method includes receiving a warped image representing simulated reality (SR) content (e.g., to be displayed in a display space), the warped image having a plurality of pixels at respective locations uniformly spaced in a grid pattern in a warped space, wherein the plurality of pixels are respectively associated with a plurality of respective pixel values and a plurality of respective scaling factors indicating a plurality of respective resolutions at a plurality of respective locations of the SR content (e.g., in the display space). The method includes processing the warped image in the warped space based on the plurality of respective scaling factors to generate a processed warped image and transmitting the processed warped image.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: December 5, 2023
    Inventors: Tobias Eble, Ye Cong, Cody J. White, Arthur Yasheng Zhang, Randall Rauwendaal, Moinul Khan, Jim C. Chou, Hao Pan, Nicolas Bonnier
  • Patent number: 11835760
    Abstract: The present disclosure provides a calibration system for wavelength-division multiplexing (WDM), a WDM system, and a calibrating method for WDM. The calibration system includes heating devices, an optical sensor, and an electrical device. When the optical sensor receives no beam with energy exceeding a threshold value from a first channel, the optical sensor transmits a first signal to the electrical device. In response to the first signal, the electrical device is configured to control the one or more of the heating devices to heat one or more of channels. When the optical sensor receives a beam having energy exceeding the threshold value from the first channel, the optical sensor transmits a second signal to the electrical device. In response to the second signal, the electrical device is configured to control the one or more of the heating devices to maintain the temperature of the one or more of the channels.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: December 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tai-Chun Huang, Lan-Chou Cho, Chewn-Pu Jou, Stefan Rusu
  • Patent number: 11837886
    Abstract: The disclosure provides a charging device and a method for positioning an electronic device. The method includes: in response to determining that a positioning request signal from an electronic device is received, enabling multiple antennas; controlling each antenna to receive a first radio frequency signal broadcast by the electronic device, and determining an arrival angle of the first radio frequency signal and a distance between the electronic device and the charging device based on the first radio frequency signal received by each antenna; and determining a relative position between the charging device and the electronic device based on the arrival angle and distance.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: December 5, 2023
    Assignee: LUXSHARE-ICT CO., LTD.
    Inventors: Shih Hsiao Chou, Kai Yuan Cheng, Ta Yu Lin
  • Patent number: 11836023
    Abstract: An information handling system uses one connector for both liquid and air cooling and detects the type of cooling system installed. That provides the ability to choose the correct thermal handling table based on the installed cooling system. To detect the type of cooling system installed, a thermal management controller sets a control signal supplied to the cooling system through the connector to a first control value and determines if a tachometer signal supplied by the cooling system to the thermal management controller through the connector indicates a first type of cooling system. If the first type of cooling system is not detected, the thermal management controller checks if the tachometer signal from the cooling system with the control signal set at the first control value, or alternatively at a second control value, indicates a second type of cooling system. If no cooling system is detected, an error condition exists.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: December 5, 2023
    Assignee: Dell Products L.P.
    Inventors: Pei-Yi Chou, Chien-Yi Juan, Che-Ling Huang, Adolfo Montero, William Leara
  • Patent number: 11837287
    Abstract: A memory device includes a memory cell and a sense amplifier. The sense amplifier has a reference circuit configured to output a reference voltage and a sensing circuit connected to the memory cell. A comparator includes a first input and a second input, with the first input connected to the reference circuit to receive the reference voltage, and the second input connected to the memory cell. A precharger is configured to selectively precharge the sensing circuit to a predetermined precharge voltage.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: December 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Jun Lin, Chung-Cheng Chou, Pei-Ling Tseng
  • Patent number: 11838820
    Abstract: A UE for performing mobility management is disclosed. The UE includes at least one non-transitory computer-readable medium storing computer-executable instructions, and at least one processor coupled to the at least one non-transitory computer-readable medium, and configured to execute the computer-executable instructions to: transmit, to a first network node, a RRC message indicating a required network slice/service of the UE, the required network slice/service uniquely identified by S-NSSAI; receive, from the first network node, a second RRC message including information of a second network node that supports the required network slice/service of the UE when the required network slice/service identified by the S-NSSAI is not supported by the first network node; and perform a mobility management procedure based on the information of the second network node received from the first network node when the required network slice/service is not supported by the first network node.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: December 5, 2023
    Assignee: FG Innovation Company Limited
    Inventors: Mei-Ju Shih, Chie-Ming Chou, Yung-Lan Tseng
  • Patent number: 11838897
    Abstract: A method performed by a first base station (BS) in a secondary cell group (SCG) associated with a user equipment (UE) is provided. The method receives, from a second BS in a master cell group (MCG) associated with the UE, a request for a configuration for packet data convergence protocol (PDCP) data duplication. The method then generates a mapping configuration for the PDCP data duplication in the SCG after receiving the request. The method transmits, to the UE, the mapping configuration.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: December 5, 2023
    Assignee: FG Innovation Company Limited
    Inventors: Yung-Lan Tseng, Chie-Ming Chou, Mei-Ju Shih, Chia-Hung Wei
  • Patent number: 11839075
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate structure, and a first spacer. The gate structure includes a floating gate structure disposed on the substrate, an inter-gate dielectric layer disposed on the floating gate structure, and a control gate structure disposed on the inter-gate dielectric layer. The control gate structure includes an electrode layer disposed on the inter-gate dielectric layer, a contact layer disposed on the electrode layer, and a cap layer disposed on the contact layer. The first spacer is disposed on a sidewall of the control gate structure and covering the electrode, the contact layer and the cap layer. A bottom surface of the first spacer is positioned between a bottom surface and a top surface of the electrode layer.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: December 5, 2023
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Chih-Jung Ni, Chuan-Chi Chou, Yao-Ting Tsai
  • Patent number: 11833618
    Abstract: A solder joint inspection model training method includes the steps of: training a first identification model according to first sample images to identify a surface-mount device with a solder joint in an image; training a second identification model according to second sample images to identify a surface-mount device without a solder joint in an image; inputting labeled original images to a trained first identification model to output first images; inputting the first images to a trained second identification model to output second images; masking the first images with the second images to generate images with normal solder joints and images with abnormal solder joints; and training a solder joint inspection model based on the images with normal solder joints and the images with abnormal solder joints.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 5, 2023
    Assignee: PEGATRON CORPORATION
    Inventors: Chun-Chou Cheng, Ming-Lung Lee
  • Patent number: 11839020
    Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: December 5, 2023
    Assignee: MPI CORPORATION
    Inventors: Yu-Shan Hu, Yi-Lung Lee, Shao-Lun Wei, Yu-Wen Chou
  • Patent number: 11837509
    Abstract: A method of packaging the silicon photonics wafer for fabricating custom optical-electrical modules includes fabricating a wafer with multiple dies of silicon photonics circuits based on custom design and conducting electrical and optical tests of the silicon photonics circuits in wafer level. The method further includes preparing the wafer for next point of use. Additionally, the method includes performing post-wafer processing on the wafer received at the next point of use. The method further includes conducting post-process electrical tests of the silicon photonics circuits in wafer level. Furthermore, the method includes preparing the wafer with known-good-dies or a known-good-wafer identified for custom use. Moreover, the method includes performing custom process on the know good dies.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: December 5, 2023
    Assignee: MARVELL ASIA PTE LTD
    Inventors: Hsu-Feng Chou, Keith Nellis, Loi Nguyen
  • Patent number: 11833784
    Abstract: A thermoplastic film 10 is a thermoplastic film comprising a light-emitting layer 11, wherein the light-emitting layer 11 comprises a thermoplastic resin and a light-emitting material that emits light by being irradiated with excitation light, and a change in yellowness of laminated glass obtained by bonding two sheets of clear glass in accordance with JIS R 3211 (1998) having a thickness of 2.5 mm with the thermoplastic film interposed therebetween after conducting a light resistance test for 2000 hours based on JIS R3205 2005 is 4 or less. The present invention provides a thermoplastic film comprising a light-emitting material, in which the emission intensity is unlikely to lower even when the thermoplastic film is exposed to ultraviolet rays for a long period of time.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 5, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuusuke Oota, Kinryou Chou, Daisuke Nakajima, Takanori Hamada
  • Patent number: 11834867
    Abstract: An anti-theft lock includes an engaging member arranged on a chassis, a latch module including a connecting member and a latch coupled to the connecting member, a fixing module coupled to the connecting member, a magnetic module arranged on the top cover and used to cooperate with the fixing module to control movement of the connecting member, and an unlocking mechanism including magnetic members. The connecting member is movably arranged on a top cover. The latch is engaged with or separated from the engaging member through movement of the connecting member. The magnetic members are attracted to or repelled from the magnetic module so that the magnetic module fixes or loosens the connecting member. When the connecting member can move, the latch is disengaged from and separated from the engaging member.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: December 5, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Tung-Ho Shih, Hung-Wei Chen, Wei-Chung Chou, Ming-Heng Lu
  • Patent number: 11837622
    Abstract: An image sensor includes a semiconductor substrate, a gate dielectric layer, a gate electrode, a protection oxide film, and a nitride hard mask. The gate dielectric layer is over the semiconductor substrate. The gate electrode is over the gate dielectric layer. An entirety of a first portion of the gate dielectric layer directly under the gate electrode is of uniform thickness. The protection oxide film is in contact with a top surface of the gate electrode. The gate dielectric layer extends beyond a sidewall of the protection oxide film. The nitride hard mask is in contact with a top surface of the protection oxide film.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: December 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Wei Chia, Chun-Hao Chou, Kai-Chun Hsu, Kuo-Cheng Lee, Shyh-Fann Ting
  • Patent number: 11837300
    Abstract: A multi-fuse memory cell is disclosed. The circuit includes: a first fuse element electrically coupled to a first transistor, a gate of the first transistor is electrically coupled to a first selection signal; a second fuse element electrically coupled to a second transistor, a gate of the second transistor is electrically coupled to a second selection signal, both the first transistor and the second transistor are grounded; and a programming transistor electrically coupled to the first fuse element and the second fuse element, wherein a gate of the programming transistor is electrically coupled to a programming signal.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: December 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Meng-Sheng Chang, Chia-En Huang, Shao-Yu Chou, Yih Wang
  • Patent number: 11837552
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 5, 2023
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu, Chih-Ming Hung, Wei-Hsiu Hsu
  • Patent number: 11833642
    Abstract: The invention relates to a power tool with an electrically controlled commutating assembly comprising: an electrically controlled commutating assembly and a control unit; the electrically controlled commutating assembly has an electromagnetic unit; the electromagnetic unit is capable of performing a change in displacement due to electromagnetic action; the control unit has a control member, the control member is capable of changing a working direction of a power tool, and displacement of the electromagnetic unit is capable of actuating the control member of the control unit to make the power tool switch the working direction.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: December 5, 2023
    Assignee: TECHWAY INDUSTRIAL CO., LTD.
    Inventors: Fu-Hsiang Chung, Hong Fang Chen, Wei-Ting Chen, Shih-Wei Hung, Kuo Chou Li
  • Patent number: 11832971
    Abstract: A wearable device utilizing flexible electronics is disclosed. The wearable device may comprise a flexible matrix material and may include sensors for measuring biometric measurements of an individual, an accelerometer for measuring an acceleration of a body part to which the wearable device is attached, a wireless transmitter, a flexible power source, and a microcontroller. During an activity, the microcontroller may receive signals from the sensors including the biometric measurements, and signals from the accelerometer including acceleration and force measurements associated with the individual. The microcontroller may convert the signals into digital signals and transmit the signals to a computing device for analysis. The computing device may analyze the digital signals to determine a performance metric for the individual. The performance metric may be compared to baseline data for the individual to determine a fatigue level, injury risk, or an adjustment to be made by the individual during the activity.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: December 5, 2023
    Assignee: Advancing Technologies, LLC
    Inventors: Ricky Alphonse, Kelsey Melrose, Catherine Chou, Noah Schimmel, Ramamurthy Siripuram, Anthony Tran, Britny Farahdel, Dalton Smith, Danice Wang, Kunal Mehan, Theodore Virtue
  • Patent number: 11838000
    Abstract: Aspects of the present disclosure provide a method for regulating an integration current of a sensing amplifier. The sensing amplifier includes a first input transistor and a second input transistor, wherein a source of the first input transistor and a source of the second input transistor are coupled to a source node. The method includes pulling a current from or sourcing the current to the source node, measuring the integration current, comparing the measured integration current with a reference signal, and adjusting the current pulled from or sourced to the source node based on the comparison.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Todd Morgan Rasmus, Shih-Wei Chou