Patents by Inventor Chun Chieh

Chun Chieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10013487
    Abstract: A system and a method for multi-modal fusion based fault tolerant video content recognition is disclosed. The method conducts multi-modal recognition on an input video to extract multiple components and their respective appearance time in the video. Next, the multiple components are categorized and recognized respectively via different algorithms. Next, when the recognition confidence of any component is insufficient, a cross-validation with other components is performed to increase the recognition confidence and improve the fault tolerance of the components. Furthermore, when the recognition confidence of an individual component is insufficient, the recognition continues and tracks the component, spatially and temporally when it applies, until frames of high recognition confidence in the continuous time period is reached.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: July 3, 2018
    Assignee: VISCOVERY PTE. LTD.
    Inventors: Kuo-Don Hsi, Chun-Chieh Huang, Yen-Cheng Chen
  • Patent number: 10015863
    Abstract: Examples relate to changing screen brightness of a computing device. One example enables determination of whether the computing device is being used for one of a set of predetermined application types. The screen brightness of the computing device may be changed based on a set of first brightness values associated with the first predetermined application type responsive to the computing device being used for a first predetermined application type and based on a set of second brightness values associated with the second predetermined application type responsive to the computing device being used for a second predetermined application type.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: July 3, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Chun-Chieh Chen
  • Patent number: 10007460
    Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: June 26, 2018
    Assignee: Silicon Motion Inc.
    Inventors: Tsung-Chieh Yang, Chun-Chieh Kuo, Ching-Hui Lin, Yang-Chih Shen
  • Publication number: 20180169786
    Abstract: A method for manufacturing metal strip comprises abutting at least two metal strips to form a abutment interface between each other, then welding the metal strips along the abutment interface by a laser light to form a weld pass with a welding penetration depth between the metal strips, and a reflected light is reflected from the weld pass, and finally receiving the reflected light by a spectrometer which can determine the welding penetration depth according to the reflected light spectrum. A welding parameter can be selectively adjusted according to the welding penetration depth to correct the welding penetration depth in real time, and the follow-up weld pass can conform to the specification for decreasing weld defective ratio.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 21, 2018
    Inventors: Kuan-Yu Chen, Lung-Tien Wu, Chun-Chieh Wang, Chia-Min Wei, Chun-Lin Yeh
  • Publication number: 20180164196
    Abstract: A biological sample processing device includes a base, a purification unit, a metering unit and a first tube. The purification unit is disposed on the base and is configured to purify a sample. The metering unit is disposed on the base and has an inlet, at least one metering trough and an overflow trough. The inlet is connected to the purification unit via the first tube, and the metering trough is connected between the inlet and the overflow trough. The sample from the purification unit is configured to enter the metering unit through the inlet to be moved toward the metering trough, and to be moved toward the overflow trough after the metering trough is filled with the sample.
    Type: Application
    Filed: December 16, 2016
    Publication date: June 14, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chien-An Chen, Wen-Ching Lee, Tzu-Hui Wu, Pei-Shin Jiang, Ping-Jung Wu, Ruey-Shyan Hong, Hsiao-Jou Chang, Chun-Chieh Huang, Ting-Hsuan Chen, Chih-Lung Lin
  • Publication number: 20180161068
    Abstract: A mandibular fixation device is provided to overcome the low operability of the conventional mandibular fixation device. The mandibular fixation device includes a sleeve, a first screw rod, a second screw rod and two positioning members. The sleeve includes two ends respectively provided with first and second screw holes. The first and second screw holes have opposite spiral directions. The first screw rod has a first threaded portion and a first assembly portion. The first threaded portion is threadedly engaged with the first screw hole, and the first assembly portion is located outside of the sleeve. The second screw rod has a second threaded portion and a second assembly portion. The second threaded portion is threadedly engaged with the second screw hole, and the second assembly portion is located outside of the sleeve. The two positioning members are coupled with the first and second assembly portions, respectively.
    Type: Application
    Filed: December 9, 2016
    Publication date: June 14, 2018
    Inventors: Yue-Jun Wang, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng, Chih-Lung Lin
  • Patent number: 9997853
    Abstract: A receptacle connector includes an insulative housing defining a base and a mating tongue extending from the base, the mating tongue defining a thicken step structure around a root thereof adjacent to the base; two rows of contacts disposed in the insulating housing with contacting sections exposed upon the mating tongue and mount tails out of the base; and a shielding plate embedded within the insulative housing and disposed between the two rows of contacts. The shielding plate defines a pair of locking sides for locking with an internal latch of a corresponding plug and the locking sides protruding beyond corresponding lateral sides of the mating tongue. The insulative housing and the shielding plate are integrally formed via an insert molding process while at least one row of the contacts are configured to be forwardly assembled to corresponding passageways in the insulating housing.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: June 12, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Chao-Chieh Chen, Chun-Chieh Yang
  • Publication number: 20180159281
    Abstract: A compound electronic device is provided herein, which is connected with a host to transmit data and includes a USB 3.0 male connector, a first electronic unit and a second electronic unit. The USB 3.0 male connector is electrically connected to the host, and includes a first differential signal wiring and a second differential signal wiring. The first electronic unit may transmit or receive the first signal through the first differential signal wiring, and the second electronic unit may transmit or receive the second signal through the second differential signal wiring. When the first signal is communicated between the USB 3.0 male connector and the host, the second signal is communicated between the USB 3.0 male connector and the host at the same time.
    Type: Application
    Filed: January 25, 2017
    Publication date: June 7, 2018
    Inventors: JIUNN-CHANG LEE, CHUN-CHIEH WU
  • Patent number: 9992912
    Abstract: The present invention provides a heat dissipating device combined structure, which consists of a heat sink and a clasp member. At least one expanded portion extends from the heat sink, and a side extends from each of the two sides of a base of the clasp member to form a conduit. The heat sink and a circuit board are disposed inside the conduit, and at least one ledge portion is formed on the sides. Moreover, a slanting portion extends from and is provided on air foils configured on the sides, and the ends of the slanting portions respectively clasp the expanded portions. Accordingly, the circuit board is mounted on the ledge portions, and electronic components on the circuit board are attached to the bottom portion of the aforementioned heat sink.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: June 5, 2018
    Assignee: LIANCHUN INDUSTRIAL CO., LTD.
    Inventor: Chun-Chieh Wang
  • Patent number: 9991125
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a semiconductor substrate. The dielectric layer has a first recess. The method includes forming a first conductive material layer over an inner wall and a bottom of the first recess. The first conductive material layer is partially filled in the first recess. The method includes performing a reflow process to convert the first conductive material layer into a first conductive layer. The first conductive layer has a second recess in the first recess. The method includes performing an electroplating process or an electroless plating process to form a second conductive layer over the first conductive layer so as to fill the second recess.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: June 5, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Rueijer Lin, Chen-Yuan Kao, Chun-Chieh Lin, Huang-Yi Huang
  • Patent number: 9991508
    Abstract: An exemplary embodiment of a synthesis method includes the following acts or steps: providing LiMn2O4 material as a precursor; leaching Mn from the LiMn2O4 material using an acid to form a synthesized solution; adding carbonaceous material to the synthesized solution; adding phosphoric acid to the synthesized solution with carbonaceous material to form MnPO4 composite material; and adding Li containing compound to the MnPO4 composite material to form LiMnPO4 composite material.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: June 5, 2018
    Assignee: CHANGS ASCENDING ENTERPRISE CO., LTD
    Inventors: Chun-Chieh Chang, Tsun Yu Chang
  • Publication number: 20180151427
    Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.
    Type: Application
    Filed: December 30, 2016
    Publication date: May 31, 2018
    Inventors: Chien-Hao Chung, Chang-Sheng Lin, Kuo-Feng Huang, Li-Chieh Wu, Chun-Chieh Lin
  • Publication number: 20180148383
    Abstract: A ceramic surface treatment method includes the following steps. An antibacterial ion and a sol-gel solution containing a silane compound are mixed to form a treatment solution. Next, a ceramic substrate is placed in the treatment solution to perform a treatment bonding reaction such that the antibacterial ion in the treatment solution can be grafted to the surface of the ceramic substrate via the silane compound. Next, a sintering condensation reaction is performed on the ceramic substrate after the treatment bonding reaction to form a protective film on the surface of the ceramic substrate. The protective film is attached to the surface of the ceramic substrate via a hydrophobic layer, and the antibacterial ion is spread on the hydrophobic layer.
    Type: Application
    Filed: June 29, 2017
    Publication date: May 31, 2018
    Applicant: Metal Industries Research & Development Centre
    Inventors: Li-Wen Weng, Chun-Chieh Tseng, Yau-Chia Liu, Chih-Lung Lin
  • Publication number: 20180151428
    Abstract: A conductive structure includes a substrate including a first dielectric layer formed thereon, at least a first opening formed in the first dielectric layer, a low resistive layer formed in the opening, and a first metal bulk formed on the lower resistive layer in the opening. The first metal bulk directly contacts a surface of the first low resistive layer. The low resistive layer includes a carbonitride of a first metal material, and the first metal bulk includes the first metal material.
    Type: Application
    Filed: November 28, 2016
    Publication date: May 31, 2018
    Inventors: Li-Han Chen, Yen-Tsai Yi, Chun-Chieh Chiu, Min-Chuan Tsai, Wei-Chuan Tsai, Hsin-Fu Huang
  • Publication number: 20180149926
    Abstract: The invention provides a method for manufacturing an liquid crystal device to avoid sedimentation problem of spacers and provide a liquid crystal device with better optical properties, comprising the steps of: providing a first substrate; coating an aligning solution on the first substrate, wherein the aligning solution comprises a liquid crystal alignment treatment agent, a solvent and a plurality of spacers; curing the aligning solution to form a first alignment layer; coating a liquid crystal solution on the first alignment layer to form a liquid crystal layer; providing a second substrate; and adhering the second substrate to the first substrate.
    Type: Application
    Filed: January 24, 2017
    Publication date: May 31, 2018
    Inventor: Chun-Chieh Yi
  • Patent number: 9984918
    Abstract: A semiconductor structure includes a semiconductive substrate including a first surface and a second surface opposite to the first surface, a shallow trench isolation (STI) including a first portion at least partially disposed within the semiconductive substrate and tapered from the first surface towards the second surface, and a second portion disposed inside the semiconductive substrate, coupled with the first portion and extended from the first portion towards the second surface, and a void enclosed by the STI, wherein the void is at least partially disposed within the second portion of the STI.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: May 29, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Chung Su, Jiech-Fun Lu, Jian Wu, Che-Hsiang Hsueh, Ming-Chi Wu, Chi-Yuan Wen, Chun-Chieh Fang, Yu-Lung Yeh
  • Patent number: 9985110
    Abstract: A semiconductor process is described. A silicon-phosphorus (SiP) epitaxial layer is formed serving as a source/drain (S/D) region. A crystalline metal silicide layer is formed directly on the SiP epitaxial layer and thus prevents oxidation of the SiP epitaxial layer. A contact plug is formed over the crystalline metal silicide layer.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: May 29, 2018
    Assignee: United Microelectronics Corp.
    Inventors: Pin-Hong Chen, Kuo-Chih Lai, Chia-Chang Hsu, Chun-Chieh Chiu, Li-Han Chen, Min-Chuan Tsai, Kuo-Chin Hung, Wei-Chuan Tsai, Hsin-Fu Huang, Chi-Mao Hsu
  • Patent number: 9980791
    Abstract: An orthodontic remodeling device includes a sleeve having first and second screw holes in two ends thereof. The first and second screw holes have opposite thread directions. A first screw rod includes a first threaded portion threadedly engaged with the first screw hole and a first assembling portion exposed outside of the sleeve. A second screw hole includes a second threaded portion threadedly engaged with the second screw hole and a second assembling portion exposed outside of the sleeve. Two tooth pushing members are respectively engaged with the first and second assembling portions. Each tooth pushing member includes at least one tooth coupling ring mounted on at least one tooth of a patient for pushing the at least one tooth outward. The sleeve is rotatable to move the first and second screw rods toward or away from each other to change a relative position between the two tooth pushing members.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: May 29, 2018
    Assignee: Metal Industries Research & Development Centre
    Inventors: Yue-Jun Wang, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng, Chih-Lung Lin
  • Publication number: 20180144597
    Abstract: The present disclosure provides a smart sensor. The smart sensor includes at least one sensing module, a positioning module, a memory, a processor, and an alerting module connected to each other. The sensing module is configured to record a relative distance and a relative velocity between a user and people, or between the user and objects. The positioning module is configured to record a position signal of the user, and calculating the self-velocity of the user through the position signal. The memory is configured to store the relative distance, the relative velocity, the self-velocity, and a judging method. The processor determines whether the user is in a dangerous position based on the relative distance, the relative velocity, the self-velocity, and the judging method.
    Type: Application
    Filed: January 9, 2017
    Publication date: May 24, 2018
    Inventors: Ping-Hsu CHU, Chun-Chieh CHEN, Sheng-Yuan WU, Hsiang-Hua FANG, Ting-Yi WANG
  • Patent number: D820250
    Type: Grant
    Filed: June 3, 2017
    Date of Patent: June 12, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Jui Chen, Chen-Cheng Wang, Chun-Chieh Chen, Ken-Ping Lin, Jen-Ting Wei