Abstract: A mobile device capable of offline and online synchronous image identifying is disclosed. The mobile device includes an image capturing unit, a processor, and a display monitor. The image capturing unit retrieves frames of a recognition target. The processor determines whether the mobile device is operatively connected to Internet. Also, the processor sends the frames to a recognition server via the Internet, and performs offline image recognition to the frames and displays the result of the offline image recognition on the display monitor when the mobile device is connected to the Internet, and receives a result of an online image recognition performed synchronously to the frames by the recognition server and displays the result of the online image recognition on the display monitor when the result of the online image recognition has a recognition value higher than a recognition value of the result of the offline image recognition.

Abstract: A semiconductor device comprises a first chip bonded on a second chip. The first chip comprises a first substrate and first interconnection components formed in first IMD layers. The second chip comprises a second substrate and second interconnection components formed in second IMD layers. The device further comprises a first conductive plug formed within the first substrate and the first IMD layers, wherein the first conductive plug is coupled to a first interconnection component and a second conductive plug formed through the first substrate and the first IMD layers and formed partially through the second IMD layers, wherein the second conductive plug is coupled to a second interconnection component.

Abstract: Semiconductor devices, methods of manufacturing thereof, and image sensor devices are disclosed. In some embodiments, a semiconductor device comprises a semiconductor chip comprising an array region, a periphery region, and a through-via disposed therein. The semiconductor device comprises a guard structure disposed in the semiconductor chip between the array region and the through-via or between the through-via and a portion of the periphery region.

Abstract: A semiconductor structure includes a semiconductive substrate including a first surface and a second surface opposite to the first surface, a shallow trench isolation (STI) including a first portion at least partially disposed within the semiconductive substrate and tapered from the first surface towards the second surface, and a second portion disposed inside the semiconductive substrate, coupled with the first portion and extended from the first portion towards the second surface, and a void enclosed by the STI, wherein the void is at least partially disposed within the second portion of the STI.

Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, an interlayer dielectric, an inter-source layer, an inter-source plug, an inter-drain layer, an inter-drain plug, an inter-gate layer, and an inter-gate plug. The active layer is made of III-V group semiconductors. The source electrode, the drain electrode, and the gate electrode are disposed on the active layer. The gate electrode is disposed between the source electrode and the drain electrode. The interlayer dielectric covers the source electrode, the drain electrode, and the gate electrode. The inter-source layer, the inter-drain layer, and the inter-gate layer are disposed on the interlayer dielectric. The inter-source plug is electrically connected to the source electrode and the inter-source layer. The inter-drain plug is electrically connected to the drain electrode and the inter-drain layer. The inter-gate plug is electrically connected to the gate electrode and the inter-gate layer.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode.

Abstract: A point stick module has a sensing device, a rank unit and a signal processing device. The sensing device outputs multiple sensing signals in response to operations done by a user. The rank unit provides a rank signal to represent a rank of the sensing device. The signal processing device is coupled to the sensing device and the rank unit to receive the multiple sensing signals and the rank signal, wherein the signal processing device selects a parameter according to the rank signal.

Abstract: An air pressure sensing system including a first sensing unit and a second sensing unit is provided. The first sensing unit includes a substrate, a diaphragm, and a supporting member. The substrate has a cavity connected with an exterior environment. The diaphragm is movably and deformably disposed at the substrate and suspended in the cavity. An electrostatic force is provided to the substrate and the diaphragm to move the diaphragm, such that a portion of the base, the supporting member and the diaphragm are contacted with each other and a closed space is formed therebetween in the cavity. The closed space and the exterior environment are divided by the diaphragm, and the diaphragm is deformed due to an air pressure difference between the closed space and the exterior environment. An air pressure sensing method is also provided.

Abstract: An image processing method and a display device thereof are provided. The method is adapted to a display panel with a display area. The image processing method includes the following steps. Whether original images to be displayed on a plurality of sub-areas of the display area are still is analyzed and determined. When the original image in a current sub-area is still, a time length of the original image being still is recorded. The current sub-area is one of the sub-areas. Processing levels corresponding to a plurality of image processing schemes are determined based on the time length. Overall or partial luminance (luma) of the original image in the current sub-area is gradually reduced by the image processing schemes with the determined processing levels, and a corresponding luma-reduced image is displayed on the current sub-area.

Abstract: An image processing method and a display device thereof are provided. The method is adapted to a display panel with a display area. The image processing method includes the following steps. Whether original images to be displayed on a plurality of sub-areas of the display area are still is analyzed and determined. When the original image in a current sub-area is still, a time length of the original image being still is recorded. The current sub-area is one of the sub-areas. Processing levels corresponding to a plurality of image processing schemes are determined based on the time length. Overall or partial luminance (luma) of the original image in the current sub-area is gradually reduced by the image processing schemes with the determined processing levels, and a corresponding luma-reduced image is displayed on the current sub-area.

Abstract: A semiconductor process for forming a plug includes the following steps. A dielectric layer having a recess is formed on a substrate. A titanium layer is formed to conformally cover the recess. A first titanium nitride layer is formed to conformally cover the titanium layer, thereby the first titanium nitride layer having first sidewall parts. The first sidewall parts of the first titanium nitride layer are pulled back, thereby second sidewall parts being formed. A second titanium nitride layer is formed to cover the recess. Moreover, a semiconductor structure formed by said semiconductor process is also provided.

Abstract: An apparatus and a method for sensing a display panel are provided. The apparatus includes a gate driving circuit and a sensing circuit. The gate driving circuit may scan the scan-lines during a plurality of scan-line periods within a frame period. The sensing circuit is coupled to a plurality of pixel circuits. A corresponding scan-line period of the scan-line periods is divided into a test data period and a display data period. In the test data period, the sensing circuit controls a corresponding pixel circuit to receive the test data, and the sensing circuit senses the electrical characteristic of the corresponding pixel circuit. In the display data period, the sensing circuit controls the corresponding pixel circuit to receive the display data from a corresponding data line, and the sensing circuit does not sense the corresponding pixel circuit.

Abstract: An exemplary embodiment of a synthesis method includes the following acts or steps: providing LiMn2O4 material as a precursor; leaching Mn from the LiMn2O4 material using an acid to form a synthesized solution; adding carbonaceous material to the synthesized solution; adding phosphoric acid to the synthesized solution with carbonaceous material to form MnPO4 composite material; and adding Li containing compound to the MnPO4 composite material to form LiMnPO4 composite material.

Abstract: Disclosed is a data transmission method of SGPIO that is applied to an expander and a target device connected by a SGPIO bus. The SGPIO bus at least includes a data output line and a data reading line. The expander outputs a page assign signal to the target device through the data output line. The page assign signal indicates a page address. The target device searches for at least one piece of page data at the page address according to the page assign signal. The target device outputs the page data to the expander through the data reading line. The expander reads the information transmitted through the data reading line. When the expander determines that the information transmitted through the data reading line includes the page address, the expander receives the page data.

Abstract: A mask frame, a mask body, a mask and a method for manufacturing the same are provided in the embodiments of the disclosure. The mask frame includes a loop shaped frame body comprising an outer boundary and an inner boundary, the inner boundary defining a space for receiving a mask body. The mask frame also includes a forced side and a non-forced side, the forced side being subjected to a pulling force of the mask body, the non-forced side being free from the force of the mask body. A width between the outer boundary of the forced side of the mask frame and the inner boundary corresponding to the outer boundary decreases gradually in a direction from a middle position on the forced side toward the non-forced side.

Abstract: In some aspects, a method for manufacturing graphene applied to grow graphene layers on an insulated surface of a work piece, includes: preparing a work piece; preparing a catalyst having a gasiform transition metal element; preparing a carbon feedstock; preparing hydrogen; mixing the carbon feedstock, the hydrogen and the catalyst over the work piece, the flow rate of the catalyst is between 4 sccm and 1,200 sccm; and warming the carbon feedstock, the hydrogen and the catalyst to the temperature between 200 degrees and 1,200 degrees centigrade, and maintaining the pressure inside the chamber between 1 mTorr and 800 Torr to make the catalyst source react with the carbon feedstock and the hydrogen so as to catalyze the decomposition of carbon feedstock to generate a plurality of carbon atoms, and the plurality of carbon atoms form the graphene layers directly on the insulated substrates of the work piece.

Abstract: An electronic device and a hinge assembly thereof are provided. The hinge assembly includes a first and a second fixed block, a first and a second connecting rod, a damper rod and a fastener. The first fixed block has a first and a second end, the second fixed block has a third and a fourth end, and the first connecting rod has a fifth and a sixth end, wherein the fifth end is connected to the second end, and the sixth end is connected to the fourth end. The second connecting rod has a seventh connected to the fourth end, and an eighth end, connected to the second end and the sixth end. The damper rod is slidably disposed on the first fixed block, the fastener is fixed to the first fixed block, and a distal end of the damper rod is fastened into the fastener.

Abstract: The present disclosure relates to a metal mask plate and a method for manufacturing the same. A frame is formed which includes a first side bar and a second side bar parallel to each other, and a support for supporting the first side bar and the second side bar. The frame protrudes toward a first side so that the support forms an arc structure protruding toward the first side of the frame. A plurality of metal masks are stretched and disposed on the first side of the frame, each metal mask extending in a direction which is perpendicular to the direction in which the first side bar extends; and fixing both ends of each of the metal masks to the first side bar and the second side bar respectively. The support is deformed by a surface tension of the plurality of metal masks to form a planar structure.

Abstract: An automatic cleaning system including a charging base and a cleaning robot is provided. The charging base includes a signal transmitter and a power supply portion. The charging base determines whether to transmit a start signal by the signal transmitter according to a preset time. The cleaning robot includes a signal receiver and a power receiving portion. The power receiving portion is configured to be electrically connected to the power supply portion of the charging base when the cleaning robot performs a charging operation. When the signal receiver receives the start signal, the cleaning robot leaves the charging base, and performs a cleaning operation. In addition, a charging base suitable for charging an automatic cleaning device is also provided.

Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two integrated circuits are bonded together. A first opening is formed through one of the substrates. A multi-layer dielectric film is formed along sidewalls and a bottom of the first opening. A second opening is formed extending from the first opening to pads in the integrated circuits. A dielectric liner is formed, and the opening is filled with a conductive material to form a conductive plug.