Patents by Inventor Chun Chieh

Chun Chieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180140143
    Abstract: A packaging container for interfold tissue paper includes a packaging, a dispensing slot, and a yielding hanger. The packaging has a soft-material package and a space, the space formed in the soft-material package. The dispensing slot is formed on a bottom surface of the soft-material package of the packaging and the yielding hanger is disposed on a top surface of the soft-material package of the packaging.
    Type: Application
    Filed: November 20, 2017
    Publication date: May 24, 2018
    Inventors: Hsin Fa LIEN, Pei-Ju LIEN, Chun-Chieh Lien
  • Publication number: 20180146302
    Abstract: A MEMS microphone package structure is provided to have a circuit substrate, an acoustic wave transducer, an application-specific integrated circuit, a lid, and at least two solder pads. The circuit substrate has a top surface, a bottom surface, and a sound hole passing through the top surface and the bottom surface. The acoustic wave transducer and the application-specific integrated circuit are disposed on the top surface and electrically connected. The lid is disposed on the top surface and made by a multilayer printed circuit boards. The lid surrounds and covers the acoustic wave transducer and the application-specific integrated circuit. The lid further has a shielding layer completely disposed on inner surfaces of the lid and two embedded first metal layers served for signal transmission and grounding and electrically connected with the solder pads respectively.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 24, 2018
    Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Chun-Chieh WANG, Yong-Shiang CHANG
  • Publication number: 20180144460
    Abstract: An inspection system is adaptive to detect cutting tools stored in a storage having slots. The system includes an image acquisition device and an inspection control device. The image acquisition device is disposed coaxially with one of the slot and is movable along the central axis of the slot. The inspection control device is used to control the image acquisition device to obtain an image of an end face of the cutting tool in the slot. The image has a wearing area. When the maximum width value of a projection of the wearing area projecting on a short reference line in the wearing area exceeds a threshold value, an alerting signal for changing cutting tool is delivered. In addition, an inspection method for an inspection system is provided.
    Type: Application
    Filed: October 5, 2017
    Publication date: May 24, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ping-Cheng HSIEH, Chun-Chieh WANG
  • Publication number: 20180145076
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming the same are provided. The FinFET device structure includes a fin structure extending above a substrate. The fin structure includes a channel region, a portion of the channel region is made of silicon germanium (SiGe), and the silicon germanium (SiGe) has a gradient germanium (Ge) concentration. The FinFET device structure includes a gate structure formed on the channel region of the fin structure.
    Type: Application
    Filed: November 18, 2016
    Publication date: May 24, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh WANG, Zheng-Yang PAN, Shih-Chieh CHANG, Yi-Min HUANG, Shahaji B. MORE, Tsung-Lin LEE
  • Patent number: 9972771
    Abstract: MRAM devices and methods of forming the same are provided. One of the MRAM devices includes a dielectric layer, a resistance variable memory cell and a conductive layer. The dielectric layer is over a substrate and has an opening. The resistance variable memory cell is in the opening and includes a first electrode, a second electrode and a magnetic tunnel junction layer between the first electrode and the second electrode. The conductive layer fills a remaining portion of the opening and is electrically connected to one of the first electrode and the second electrode of the resistance variable memory cell.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: May 15, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh Mo, Shih-Chi Kuo, Tsung-Hsien Lee, Wu-An Weng, Chung-Yu Lin
  • Patent number: 9974052
    Abstract: A cell and a method and a system for bandwidth management of a backhaul network of the cell, adapted for arranging a routing path of a bearer established between a user equipment and a serving gateway through the cell in the backhaul network, are provided. In the method, the cell connects the user equipment to establish the bearer between the user equipment and the serving gateway or change an established bearer. The cell sets a packet label on the data packets of the bearer and transmits the packet label and bandwidth management information of the bearer to a controller of the backhaul network for the controller to arrange the routing path of the data packets using the packet label in the backhaul network according to the bandwidth management information.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 15, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Chieh Wang, Kuei-Li Huang, Mu-Liang Wang
  • Publication number: 20180129602
    Abstract: A garbage collection method for a data storage device includes steps of: entering a background mode from a foreground mode; selecting a plurality of source data blocks from a plurality of in-use data blocks; dividing a mapping table into a plurality of sub-mapping tables and selecting one of the sub-mapping tables as a target sub-mapping table, wherein the target sub-mapping table is used to manage one of the source data blocks; selecting a destination data block from a plurality of spare data blocks; and sequentially updating a correspondence relationship of data stored in the target sub-mapping table from the source data blocks to the destination data block, wherein the updating comprises copying the data stored in the source data blocks to the destination data block.
    Type: Application
    Filed: October 13, 2017
    Publication date: May 10, 2018
    Inventors: HONG-JUNG HSU, CHUN-CHIEH KUO
  • Publication number: 20180130836
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element and a second semiconductor element bonded on the first semiconductor element. The first semiconductor element includes a first substrate, a common conductive feature in the first substrate, a first inter-level dielectric (ILD) layer, a first interconnection feature and a conductive plug connecting the first interconnection feature to the common conductive feature. The second semiconductor element includes a second substrate, a second ILD layers over the second substrate and a second interconnection feature in second ILD layers. The device also includes a conductive deep plug connecting to the common conductive feature in the first semiconductor element and the second interconnection feature. The conductive deep plug is separated with the conductive plug by the first ILD layer.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 10, 2018
    Inventors: Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai, Min-Feng Kao
  • Publication number: 20180130802
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming the same are provided. The FinFET device structure includes a fin structure extending above a substrate, and the fin structure has a first portion and a second portion below the first portion, and the first portion and the second portion are made of different materials. The FinFET device structure includes an isolation structure formed on the substrate, and an interface between the first portion and the second portion of the fin structure is above a top surface of the isolation structure. The FinFET device structure includes a liner layer formed on sidewalls of the second portion of the fin structure.
    Type: Application
    Filed: November 10, 2016
    Publication date: May 10, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh WANG, Zheng-Yang PAN, Yi-Min HUANG, Shih-Chieh CHANG, Tsung-Lin LEE
  • Publication number: 20180131834
    Abstract: An image filing method including following steps is provided. At least one sheet is searched form from a plurality of scan image data by an office machine or a computer connected to the scanner. the plurality of scan image data is divided into M groups, and the at least one sheet form is set up in a first image data of each of M groups when there are M sheet forms searched from the plurality of scan image data, wherein M is an integral larger than 1. A keyword string is searched in each of the M sheet forms and an encoded string arranged after the keyword string is identified. M files corresponding to the M groups are created and named according to the encoded strings in each of the M sheet forms.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Inventor: Chun-Chieh Liao
  • Publication number: 20180131293
    Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.
    Type: Application
    Filed: August 29, 2017
    Publication date: May 10, 2018
    Inventors: Te-Min Wang, Yu-Ho Ni, Chun-Chieh Lin, Chien-Chung Hou, Cheng-Mao Chien
  • Publication number: 20180128809
    Abstract: A gas detection apparatus includes a housing, a detection assembly, and a data acquiring module. The housing includes a chamber, an air inlet, and an air outlet. The air inlet and the air outlet are intercommunicated with the chamber. The detection assembly is mounted in the chamber of the housing and includes a substrate, a detection unit, and a signal transmission port. The detection unit includes at least one specific gas detection port. A surface of the at least one specific gas detection port is covered with a polymer specific gas detection film that has an affinity for a specific gas. The signal transmission port is disposed on the substrate and is electrically connected to the detection unit. The data acquiring module is electrically connected to the signal transmission port of the detection assembly. Thus, a better balance between the production cost and the detection accuracy is achieved.
    Type: Application
    Filed: November 4, 2016
    Publication date: May 10, 2018
    Inventors: Kuan-Chiao Cheng, Chun-Chieh Tseng, Ying-Cheng Lu
  • Patent number: 9967929
    Abstract: A high performance linear driving circuit converting an AC voltage of an external power supply into a DC output current and then outputs the DC current to at least one LED includes a detection unit, a control unit and a current unit. In a 180-degree phase sine wave period of the AC voltage, the total current of the output current is formed by a first working section, an energy saving section and a second working section, and the detection unit detects at least a voltage value of the AC voltage or a current value of the output current to generate a detection signal, and drives the control unit to modulate the duty cycle and current value of the first working section, energy saving section and second working section, and the amounts of current of the first and second working sections are greater than that of the energy saving section.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: May 8, 2018
    Assignee: Anwell Semiconductor Corp.
    Inventors: Chun-Chieh Kuo, Shih-Ping Tu, Bo-En Yan, Cheng-Po Hsiao, Chung-Hsin Huang
  • Patent number: 9962805
    Abstract: A polisher head of a polishing apparatus includes a membrane and a first local pressure nodule and a second local pressure nodule physically contacting the membrane. The first local pressure nodule is configured to apply a first local force to the membrane and the second local pressure nodule is configured to apply a second local force to the membrane. The first local pressure nodule and the second local pressure nodule are independently controllable.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: May 8, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Kui Chang, Fu-Ming Huang, Liang-Guang Chen, Chun-Chieh Lin
  • Publication number: 20180120560
    Abstract: A projector includes a projection lens, an image capture module and a processor. The projection lens projects a projection image onto a display surface. The image capture module is disposed on one side of the projection lens and captures an image frame covering the projection image and defines a plurality of zones on the image frame. The zones correspond to parts of the image frame and cover at least the projection image and do not cover the entire image frame. The image capture module analyzes the parts of the image frame to obtain image data including a plurality of respective zone values. The processor is electrically connected to the image capture module and receives the image data and adjusts a focal length of the projection lens according to at least two of these zone values selected based on the image data. A focal length adjusting method is also provided.
    Type: Application
    Filed: October 25, 2017
    Publication date: May 3, 2018
    Inventors: CHUN-CHIEH WANG, ZHI-XIANG LI, JUI-TA LIU, YU-CHI WU
  • Patent number: 9953868
    Abstract: A method of forming a conductive structure includes forming a first opening and a second opening in a dielectric layer on a substrate, wherein the first opening is narrower than the second opening. The method further includes depositing a diffusion barrier layer to line the first opening and the second opening. The method further includes forming a metal layer over the diffusion barrier layer to fill at least portions of the first opening and the second opening, wherein a maximum thickness of the metal layer in the first opening is greater than a maximum thickness of the metal layer in the second opening.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: April 24, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Ming Hsing Tsai, Syun-Ming Jang
  • Publication number: 20180108775
    Abstract: Structures of a semiconductor device are provided. The semiconductor device includes a substrate, a gate structure over the substrate, and a first recess and a second recess in the substrate and at opposite sides of the gate structure. The semiconductor device also includes two source/drain structures over the first recess and the second recess respectively. At least one of the source/drain structures includes a first doped region partially filling in the first recess, a second doped region over the first doped region, and a third doped region over the second doped region. The second doped region contains more dopants than the first doped region or the third doped region.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 19, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shahaji B. MORE, Zheng-Yang PAN, Chun-Chieh WANG, Cheng-Han LEE, Shih-Chieh CHANG
  • Publication number: 20180109087
    Abstract: A pair of single-blade-double-edged steel wire rope shears, includes: a first cutting member and a second cutting member pivotally connected to each other. The first cutting member includes a first grip and a first blade, the first blade includes a first lateral cutting section and a first bottom cutting section; the second cutting member includes a second grip and a second blade, the second blade includes a second lateral cutting section and a second bottom cutting section; when the first and second grips pivot toward each other, the first and second lateral cutting sections cut a to-be-cut object inserted therebeween, meanwhile, the first and second bottom cutting sections also cut the to-be-cut object, so as to form at least three cutting points on the to-be-cut object, and as a result, the pair of single-blade-double-edged steel wire rope shears can improve cutting efficiency.
    Type: Application
    Filed: June 29, 2017
    Publication date: April 19, 2018
    Inventors: SUNG-YU CHANG, CHUN-CHIEH LIAO
  • Publication number: 20180108873
    Abstract: The disclosure provides a counterforce apparatus, mask manufacturing apparatus and corresponding method, the force applying apparatus includes one or more applying apparatus body, one or a plurality of contact members, and each application apparatus is connected with the main body of the pivot, the contact member is configured to contact with the frame, applying apparatus body is configured for the contact member and applied against force to the frame by means of the contact member is driven by the mobile, wherein the contact component rotation freedom is restricted.
    Type: Application
    Filed: February 16, 2017
    Publication date: April 19, 2018
    Inventors: Zhiming LIN, Zhen WANG, Chun Chieh HUANG, Jian ZHANG
  • Patent number: D816086
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: April 24, 2018
    Assignee: Acer Incorporated
    Inventors: Chu-Yu Chen, Ting-Wei Yuan, Chun-Chieh Chiu