Abstract: A conductive connection structure for secondary batteries employs conductive portions disposed under two lateral sides of a cover plate to conductively connect to at least one battery cell. The conductive portions disposed under the two lateral sides of the cover plate are bendable, and the conductive portions are bent toward outer sides of the cover plate, so that the conductive portions are disposed horizontally; a connecting portion is extended upward respectively from an anode and a cathode terminals on two lateral sides of each of the battery cells, and the connecting portions and the conductive portions are electrically connected. By modifying the design of the connection structure of the battery cells and the two conductive portions under the cover plate, a time for soldering the battery cells and the conductive portions for conductive connection is reduced, the connection is tighter and more reliable and manpower cost is reduced.

Abstract: The present invention discloses a method of describing infrared signal, and infrared signal has a continuous infrared wave type, the method comprises: a step (a) separating the continuous infrared wave into at least one frame; a step (b) separating the at least one frame into at least one signal sequence and at least one data sequence; a step (c) separating the at least one signal sequence into a signal with a level and a duration; a step (d) separating the at least one data sequence into at least one logic signal set, wherein the at least one logic signal set is separated into at least one signal with a level and a duration; and (e) unifying description for the plurality of infrared signals having the same control function.

Abstract: According to an exemplary embodiment, a method of forming a MIM capacitor is provided. The method includes the following operations: providing a first metal layer; providing a dielectric layer over the first metal layer; providing a second metal layer over the dielectric layer; etching the second metal layer to define the metal-insulator-metal capacitor; and oxidizing a sidewall of the second metal layer. According to an exemplary embodiment, a MIM capacitor is provided. The MIM capacitor includes a first metal layer; a dielectric layer over the first metal layer; a second metal layer over the dielectric layer; and an oxidized portion in proximity to the second metal layer and made of oxidized second metal layer.

Abstract: An MEMS microphone package structure includes a substrate, a carrier and an acoustic transducer. The carrier covers the substrate from above and connects to the substrate. The carrier has an n-shaped cross section and includes a flat plate portion, a sidewall connected to the flat plate portion, and two oblique blocks protruded from the inner surface of the sidewall. The oblique blocks each have an inclined surface for connecting the flat plate portion and the bottom surface of the sidewall. The acoustic transducer is posited on the bottom surface of the flat plate portion and electrically connected to the substrate through a plurality of electrical conduction paths passing through the inclined surfaces. The electrical conduction paths are conducive to simplification of wirings of the substrate and the thinning of the substrate. Therefore, simplify the manufacturing process to reduce the manufacturing time and cost.

Abstract: Embodiments of the invention relate to dual shallow trench isolations (STI). In various embodiments related to CMOS Image Sensor (CIS) technologies, the dual STI refers to one STI structure in the pixel region and another STI structure in the periphery or logic region. The depth of each STI structure depends on the need and/or isolation tolerance of devices in each region. In an embodiment, the pixel region uses NMOS devices and the STI in this region is shallower than that of in the periphery region that includes both NMOS and PMOS device having different P- and N-wells and that desire more protective isolation (i.e., deeper STI). Depending on implementations, different numbers of masks (e.g., two, three) are used to generate the dual STI, and are disclosed in various method embodiments.

Abstract: An integrated circuit device includes a semiconductor substrate; and a pad region over the semiconductor substrate. The integrated circuit device further includes an under-bump-metallurgy (UBM) layer over the pad region. The integrated circuit device further includes a conductive pillar on the UBM layer, wherein the conductive pillar has a sidewall surface and a top surface. The integrated circuit device further includes a protection structure over the sidewall surface of the conductive pillar, wherein sidewalls of the UBM layer are substantially free of the protection structure, and the protection structure is a non-metal material.

Abstract: A multimedia playing system is provided. A portable electronic device includes a first dock port, a second dock port, a power module, an audio processor and a controller. When a first single-ear wireless earphone connects with the first dock port, the power module charges the first single-ear wireless earphone via the first dock port. When a second single-ear wireless earphone connects with the second dock port, the power module charges the second single-ear wireless earphone via the second dock port. The audio processor provides a left sound channel signal and a right sound channel signal. When the first single-ear wireless earphone separates from the first dock port, the controller provides one of the left sound channel signal and the right sound channel signal to the first single-ear wireless earphone according to a relative position between the first dock port and a user.

Abstract: An exemplary embodiment of a synthesis method includes the following acts or steps: providing LiMn2O4 material as a precursor; leaching Mn from the LiMn2O4 material using an acid to form a synthesized solution; adding carbonaceous material to the synthesized solution; adding phosphoric acid to the synthesized solution with carbonaceous material to form MnPO4 composite material; and adding Li containing compound to the MnPO4 composite material to form LiMnPO4 composite material.

Abstract: A multimedia playing system is provided. The multimedia playing system includes an earbud-type wireless earphone and a portable electronic device. The earbud-type wireless earphone includes a temperature sensor. The portable electronic device includes a dock port, a wireless module, an audio processor, and a controller. The wireless module receives temperature data from the temperature sensor of the earbud-type wireless earphone. The audio processor provides a first sound channel signal and a second sound channel signal. The controller provides one of the first sound channel signal and the second sound channel signal to the earbud-type wireless earphone according to the temperature data when the earbud-type wireless earphone is separated from the dock port.

Abstract: In one embodiment, a battery management system comprising a first circuit comprising a first plurality of circuit elements arranged in series, the first plurality of circuit elements comprising: a direct current (DC) voltage source, and first plural switching devices, each of the first plural switching devices connected to, and operably switched by, a first detection device associated with a battery module to cause a voltage difference responsive to detection of an event corresponding to operation of the battery module.

Abstract: A plug for provision of power includes a housing forming a receiving cavity with two opposite sites in a vertical direction which is compatible with a standard plug connector with twelve contacts on each site and a first and second rows of contacts on the sides while in diagonally symmetrical manner. Each contact includes a contacting section, and a connecting section for directly connecting to a corresponding wire. Each row of contacts is categorized with a pair of power contacts, a pair of grounding contacts and a specific contact without any high speed differential pair. Two pair of power contacts of both two rows are electrically connected together either via direct mechanical connection via vertical extensions or via indirect electrical connection via the latch which has a pair of side arms extending into the receiving cavity at two opposite transverse ends.

Abstract: A pixel of a display panel includes a first transistor with a first end coupled to a data line, a control end coupled to a scan line; a second transistor with a first end coupled to a first voltage source, a control end coupled to a second end of the first transistor; a third transistor with a first end coupled to a second end of the second transistor, a control end for receiving a control signal; a light emitting unit with a first end coupled to the second end of the second transistor, a second end coupled to a second voltage source; a first capacitor with a first end coupled to the second end of the first transistor, a second end coupled to a second end of the third transistor; and a second capacitor coupled between the second end of the first capacitor and the second voltage source.

Abstract: A chip-stacked microphone includes a cover, an acoustic wave transducer module, an application-specific integrated circuit chip (ASIC) and a substrate arranged in proper order from top to bottom. The cover is connected to the substrate and covered over the acoustic wave transducer module, providing a sound hole. The application-specific integrated circuit chip (ASIC) is electrically connected to the substrate. The acoustic wave transducer module is electrically connected to the application-specific integrated circuit chip (ASIC) using a 3D packaging technology, allowing an acoustic wave to pass therebetween. Thus, the invention greatly reduces the area for footprint and fully utilizes the space between the cover and the two modules for back chamber to maintain the overall performance of the microphone.

Abstract: A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

Abstract: An illuminated running board for a vehicle includes a running board body and at least one light-emitting device installed in the running board body. The running board body includes two lateral ends and an outer end portion extending between the lateral ends. The light-emitting device includes a light guide bar and at least one illuminant. The light guide bar is held inside the outer end portion and includes a plane facing the outer end portion for development of a luminous surface. The illuminant is adjacent to an end face of the light guide bar and projects light rays which are guided into the light guide bar through the end face and emitted from the outer end portion, so that the running board can be clearly observed by passengers and other vehicle drivers for better security of the running board in service.

Abstract: A network flow abnormality detection system and method for detecting at least one network packet to determine whether a flow condition of the network packet is abnormal. The network packet includes L bit data element values. The method is fetching M data element values in above-mentioned L bit data element values by data element value fetch unit, wherein M is an odd number and larger than 1; N parallel processing units receive and process above-mentioned M data element values; comparison module compares above-mentioned M data element values and a standard threshold to generate M comparison result values; sum unit sums above-mentioned M comparison result values to obtain a comparison sum value; determination unit compares the comparison sum value and an abnormality threshold, wherein when the comparison sum value is larger than the abnormality threshold, the determination unit determines the flow condition is abnormal.

Abstract: In one embodiment, a method comprising causing motion of an enclosed container comprising substrate material and graphite material within the container; and coating surfaces of the substrate material with the graphite material responsive to the motion of the container, the coated surfaces comprising graphene or graphene layers.

Abstract: A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot.

Abstract: An image sensor structure that includes a first semiconductor substrate having a plurality of imaging sensors; a first interconnect structure formed on the first semiconductor substrate; a second semiconductor substrate having a logic circuit; a second interconnect structure formed on the second semiconductor substrate, wherein the first and the second semiconductor substrates are bonded together in a configuration that the first and second interconnect structures are sandwiched between the first and second semiconductor substrates; and a backside deep contact (BDCT) feature extended from the first interconnect structure to the second interconnect structure, thereby electrically coupling the logic circuit to the image sensors.

Abstract: An apparatus for estimating channel effects is provided. A receiving module receives first data and first reference information arriving in a first time period, second data and second reference data arriving in a second time period, and third data and third reference data arriving in a third time period. An estimation module estimates channel effects corresponding to the first and third data, and the first, second and third reference data, respectively. A coefficient calculation module performs a Wiener filter coefficient calculation on the channel effects corresponding to the first, second and third reference data to generate a set of time-domain interpolation coefficients. An interpolation module interpolates the channel effects corresponding to the first third data according to the set of time-domain interpolation coefficients to generate a channel effect corresponding to the second data.