Abstract: A video entertainment system includes a master handset electronic device for generating a first control signal, receiving a second control signal, and processing the first control signal and the second control signal, to generate and transmit a video data; and a slave handset electronic device for generating and transmitting a second control signal to the master handset electronic device.

Abstract: Provided is a method of fabricating an image sensor device. The method includes providing a first substrate having a radiation-sensing region disposed therein. The method includes providing a second substrate having a hydrogen implant layer, the hydrogen implant layer dividing the second substrate into a first portion and a second portion. The method includes bonding the first portion of the second substrate to the first substrate. The method includes after the bonding, removing the second portion of the second substrate. The method includes after the removing, forming one or more microelectronic devices in the first portion of the second substrate. The method includes forming an interconnect structure over the first portion of the second substrate, the interconnect structure containing interconnect features that are electrically coupled to the microelectronic devices.

Abstract: A semiconductor image sensor device includes first and second semiconductor substrates. A pixel array and a control circuit are formed in a first surface of the first substrate. An interconnect layer is formed over the first surface of the first substrate and electrically connects the control circuit to the pixel array. A top conducting layer is formed over the interconnect layer to have electrical connectivity with at least one of the control circuit or the pixel array via the interconnect layer. A surface of a second substrate is bonded to the top conducting layer. A conductive through-silicon-via (TSV) passes through the second substrate, and has electrical connectivity with the top conducting layer. A terminal is formed on an opposite surface of the second substrate, and electrically connected to the TSV.

Abstract: A method includes forming a first implantation mask comprising a first opening, implanting a first portion of a semiconductor substrate through the first opening to form a first doped region, forming a second implantation mask comprising a second opening, and implanting a second portion of the semiconductor substrate to form a second doped region. The first portion of the semiconductor substrate is encircled by the second portion of the semiconductor substrate. A surface layer of the semiconductor substrate is implanted to form a third doped region of an opposite conductivity type than the first and the second doped regions. The third doped region forms a diode with the first and the second doped regions.

Abstract: A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure mainly includes a stress control layer disposed between a light emitting layer and a p-type carrier blocking layer. The p-type carrier blocking layer is made from AlxGa1-xN (0<x<1) while the stress control layer is made from AlxInyGa1-x-yN (0<x<1, 0<y<1, 0<x+y<1). The light emitting layer has a multiple quantum well structure formed by a plurality of well layers and barrier layers stacked alternately. There is one well layer disposed between the two barrier layers. Thereby the stress control layer not only improves crystal quality degradation caused by lattice mismatch between the p-type carrier blocking layer and the light emitting layer but also reduces effects of compressive stress on the well layer caused by material differences.

Abstract: A method of making a pillar structure includes forming a first under-bump-metallurgy (UBM) layer formed on a pad region of a substrate, wherein the first UBM layer includes sidewalls. The method further includes forming a second UBM layer on the first UBM layer, wherein the second UBM layer includes a sidewall surface, an area of the first UBM layer is greater than an area of the second UBM layer. The method further includes forming a copper-containing pillar on the second UBM layer, wherein the copper-containing pillar includes a sidewall surface and a top surface. The method further includes forming a protection structure on the sidewall surface of the copper-containing pillar and on an entirety of the sidewall surface of the second UBM layer, wherein the protection structure does not cover the sidewalls of the first UBM layer, and the protection structure is a non-metal material.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes proving a substrate. The substrate includes a gate stack over the substrate and source/drain regions separated by the gate stack. A first dislocation with a first pinch-point is formed within the source/drain region with a first depth. A second dislocation with a second pinch-point is formed within the source/drain region at a second depth. The second depth is substantial smaller than the first depth.

Abstract: The present disclosure illustrates a peripheral apparatus management system, peripheral apparatus operating system and sharing system thereof. The sharing system includes first electronic apparatus, second electronic apparatus and peripheral apparatus electrically connected with the second electronic apparatus. In the local area network, the peripheral apparatus is controlled remotely by the first electronic apparatus, via communication between a first apparatus driver module installed in the first electronic apparatus and a second apparatus driver module installed in the second electronic apparatus, so that the operation convenience of operating the peripheral apparatus can be improved. Besides, the user can operate this peripheral apparatus without running additional application program in the second electronic apparatus.

Abstract: A training or rating system includes a shape sensing enabled device (104) and a database (140) of possible shapes and sequences of shapes for the shape sensing enabled device. The possible shapes and sequences of shapes include a collection of poses derived by appropriately performing a procedure with the shape sensing enabled device. A comparison module (154) is configured to compare real-time poses of the shape sensing enabled device with the collection of poses in the database to output comparison feedback for a user of the shape sensing enabled device.

Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Abstract: A non-transitory computer-readable storage medium storing a set of instructions executable by a processor. The set of instructions is operable to receive a current patient medical image of a current patient, compare the current patient medical image to a plurality of previous patient medical images, each of the previous patient medical images corresponding to a previous patient, select one of the previous patients based on a geometric similarity between the previous patient medical image of the selected one of the previous patients and the current patient medical image, and determine an initial radiation treatment plan based on a radiation treatment plan of the selected one of the previous patients.

Abstract: A classifier (20) is trained by a feature matrix (18, 18?) made up of feature vectors (F11, . . . , Fkm). The feature vectors are generated by operating on each of a plurality (k) of training image data sets with each of a plurality (m) of image processing algorithms (121, . . . , 12m) to generate processed and segmented images. Features of the segmented regions are extracted (14) to generate the feature vectors. In this manner, the classifier is trained with data generated with a variety of image processing algorithms.

Abstract: A Micro-Electro-Mechanical-System (MEMS) microphone device includes a substrate, a MEMS microphone thin film, oxide layer. The substrate has a first penetrating portion. The MEMS microphone thin film is above the substrate and covered the first penetrating portion defining a first cavity. The MEMS microphone thin film includes an elastic portion and a connection portion. The elastic portion has a plurality of first slots arranged along the edge of the elastic portion and sequentially and separately. The first slots are penetrated two surface of the elastic portion, the surface are opposite each other. The connection portion is connected to the elastic portion and contacted the substrate. The oxide layer has a second penetrating portion. The oxide layer is on the MEMS microphone thin film and contacted the connection portion. A part of the MEMS microphone thin film is exposed through the second penetrating portion.

Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, an interlayer dielectric, an inter-source layer, an inter-source plug, an inter-drain layer, an inter-drain plug, an inter-gate layer, and an inter-gate plug. The active layer is made of III-V group semiconductors. The source electrode, the drain electrode, and the gate electrode are disposed on the active layer. The gate electrode is disposed between the source electrode and the drain electrode. The interlayer dielectric covers the source electrode, the drain electrode, and the gate electrode. The inter-source layer, the inter-drain layer, and the inter-gate layer are disposed on the interlayer dielectric. The inter-source plug is electrically connected to the source electrode and the inter-source layer. The inter-drain plug is electrically connected to the drain electrode and the inter-drain layer. The inter-gate plug is electrically connected to the gate electrode and the inter-gate layer.

Abstract: A carrier with the optical registration function is disclosed. The carrier allows the registration of inspected results of the sampling images of the sample to the corresponding address codes of the address coding site of the carrier.

Abstract: A method of determining whether a lens device is shifted is applied to an optical touch system including a screen, a first light source and a first lens device respectively disposed corresponding to a first corner of a touch surface of the screen, and first and second optical strips respectively disposed at first and second sides of the touch surface. The method includes the first lens device setting a first brightness threshold according to a first original image captured by the first lens device toward the touch surface, disposing first and second reflection members at one end of the first optical strip and one end of the second optical strip respectively, and the first lens device determining whether a first optical axis of the first lens device is shifted according to the first brightness threshold and a first actual image captured by the first lens device.

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patterned dielectric layer having a plurality of first openings. The method includes forming a conductive liner layer over the patterned dielectric layer, the conductive liner layer partially filling the first openings. The method includes forming a trench mask layer over portions of the conductive liner layer outside the first openings, thereby forming a plurality of second openings, a subset of which are formed over the first openings. The method includes depositing a conductive material in the first openings to form a plurality of vias and in the second openings to form a plurality of metal lines. The method includes removing the trench mask layer.

Abstract: A network connector socket includes an insulated body, first contacts, and second contacts. Each first contact includes a first fixed segment fixed in the insulated body. The first fixed segments are arranged in parallel on a first plane. Each second contact includes a second fixed segment fixed in the insulated body. The second fixed segments extend on a second plane spaced apart with the first plane and are arranged in parallel. One of the first fixed segments is bent and extends to cross at least one of the second fixed segments. For one of the first contacts, the corresponding first fixed segment has a larger transverse width than that of the rest. For one of the second contacts, the corresponding second fixed segment has a larger transverse width than that of the rest. Thus, the crosstalk noise between the contacts is reduced by capacitive compensation.

Abstract: A device having a rail and a block includes a rail and a block. The rail includes a body and a hollow inside, the hollow inside being located inside the body. The hollow inside of the rail is provided with a lightweight, shock absorption and sound absorption material, and the lightweight, shock absorption and sound absorption material is selected from a group consisting of foam metal material, polystyrene, asbestos, foam, plastic, and rubber. The block is adapted for sliding along the rail to finish a slide path.

Abstract: An optical imaging system includes a display panel, a light source module, a first touch object, a second touch object, an image capturing module and a control module. A first reflective section of the first touch object and a second reflective section of the second touch object have different reflectivities. The image capturing module captures light reflected from the first reflective section of the first touch object and the second reflective section of the second touch object, so as to generate a first signal corresponding to the first touch object and a second signal corresponding to the second touch object. The first signal and the second signal have different waveforms. The control module calculates coordinate values of the first touch object and the second touch object according to the first signal and the second signal.