Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A source driver and a driving system for driving an LED panel, and an LED display system are provided. The driving system includes: a plurality of source drivers, for respectively supplying driving currents to channels of different portions on the LED panel, and each source driver includes: a plurality of driving circuits, which are in one-to-one correspondence with the plurality of channels on the LED panel, and are connected to a same current control line, each driving circuit being configured to supply a driving current to a corresponding channel, wherein, the supplied driving current is associated with a voltage on the current control line which the driving circuit is connected with. When one or more driving circuits switch between a non-driving state and a driving state, the driving current being supplied by the driving circuit(s) being in the driving state in the plurality of source drivers is compensated.

Abstract: An optical network device includes a substrate, a photonic integrated circuit, a fiber, and a packaging cap. Photonic integrated circuit is disposed on substrate. Fiber is configured to receive a first optical signal and transmit a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Packaging cap is configured to combine fiber with substrate, and is configured to cover photonic integrated circuit and fix fiber, so as to align fiber with photonic integrated circuit, so that an oblique angle is formed between a normal vector of a plane where photonic integrated circuit is located and a direction in which fiber extends. Photonic integrated circuit is configured to receive second optical signal according to oblique angle. Photonic integrated circuit is configured to couple first optical signal to fiber according to oblique angle.

Abstract: A polyphenylene ether bismaleimide resin, a method for manufacturing the same, and a resin composition are provided. The polyphenylene ether bismaleimide (PPE-BMI) resin is obtained by a condensation reaction with a maleic anhydride and a primary amine compound as reactants. The primary amine compound is a polyphenylene ether diamine.

Abstract: A remote operating method for a HMI is disclosed and includes following steps: obtaining a component information of at least one control component of the HMI when an inquiring command is received; transmitting the component information to a remote electronic device by the HMI; generating and providing an operation related information according to the component information by a translating software of the remote electronic device; receiving an operating activity with respect to the control component; translating the operating activity to a component operating instruction by the translating software and transmitting the component operating instruction to the HMI; and, triggering the control component correspondingly by the HMI based on the component operating instruction.

Abstract: The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe positioned above the semiconductor manufacturing equipment and having a top surface and a bottom surface extending parallel to the top surface; a first branch pipe including an upstream end coupled to a source of a gas mixture and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including an upstream end and a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

Abstract: A charging connector includes a housing, at least one terminal, a movable shell and a stopper. A middle of the housing has an internal insulator fixed in the housing. The at least one terminal is disposed in the internal insulator. The movable shell is rotatably disposed around an outer periphery of the housing, and the movable shell has a threaded guiding groove. The stopper is movably mounted around the housing. The stopper is moved between an unlocking position and a locking position. When the stopper is moved frontward to the locking position, the stopper is interfered with the movable shell to stop the movable shell from rotating.

Abstract: The present disclosure relates to a driver for driving a light emitting unit array of a display device, the driver including: a plurality of driving units, each of the plurality of driving units includes: a driving circuit configured to provide a driving current to a corresponding column of light emitting units in the light emitting unit array according to a pulse width modulation signal, during a turn-on period of a channel switch; a charge path circuit configured to be connected in parallel with the driving circuit, and to be turned on during the turn-on period of the channel switch to form a charge path; and a discharge path circuit configured to be connected in parallel with the driving circuit, and to be turned-on after the channel switch is turned off, to form a discharge path.

Abstract: Provided is a mold core structure, which is arranged on a mold.

Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.

Abstract: A scam detection system includes a user computer that runs a security application and a backend system that runs a scam detector. An email is received at the user computer. The security application extracts and forwards a content of the email, which includes a body of the email, to the backend system. The email body of the email is anonymized by removing personally identifiable information from the email body. A hash of the anonymized email body is generated and compared against hashes of a whitelist and a blacklist. The anonymized email body is classified. A segment of text of the anonymized email body is identified and provided to the user computer when the anonymized email body is classified as scam.

Abstract: An electrical connector includes an insulating body, a plurality of conductive terminals, a plurality of grounding terminals and two shielding elements. The plurality of the conductive terminals are mounted in the insulating body. The plurality of the grounding terminals are mounted in the insulating body. The plurality of the grounding terminals are located adjacent to two outer sides of the plurality of the conductive terminals. The two shielding elements are disposed at a front end of an upper surface and a front end of a lower surface of the insulating body. Each shielding element has a base frame. Two sides of a rear edge of the base frame are connected with two contact portions. The contact portions of the two shielding elements contact with the plurality of the grounding terminals.

Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Abstract: A deep trench structure may be formed between electrodes of a capacitive device. The deep trench structure may be formed to a depth, a width, and/or an aspect ratio that increases the volume of the deep trench structure relative to a trench structure formed using a metal etch-stop layer. Thus, the deep trench structure is capable of being filled with a greater amount of dielectric material, which increases the capacitance value of the capacitive device. Moreover, the parasitic capacitance of the capacitive device may be decreased by omitting the metal etch-stop layer. Accordingly, the deep trench structure (and the omission of the metal etch-stop layer) may increase the sensitivity of the capacitive device, may increase the humidity-sensing performance of the capacitive device, and/or may increase the performance of devices and/or integrated circuits in which the capacitive device is included.

Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device on the top semiconductor layer.

Abstract: A thin hinge includes a rotating part including a rotating member and a support frame; and a torsion providing part. The rotating member includes a first arcuate part and a second arcuate part, the first arcuate part forms two guide slots, the frame forms two lugs disposed in the guide slots and making the first arcuate part rotatable relative to the frame, the first and second arcuate parts open and close sequentially based on a rotation angle of the rotating member. The torsion providing part includes an assembly shaft disposed on the frame, a rotating shaft assembled to the second arcuate part, and a torsion providing member connected to the rotating and assembly shafts and providing torsion for the rotating member, the torsion providing member is composed of connecting rods moving with the rotating shaft when the second arcuate part is manipulated, and driving the assembly shaft to rotate.