Abstract: The present disclosure relates to a driving method for a display device and a display device. The display device includes a display driver, the display driver includes a plurality of driving channels each of which drives corresponding display unit according to display data in a pulse width modulation manner within one frame period, the method comprises: selectively enabling, in each sub-frame subset among a plurality of different sub-frame subsets of the frame period, different channel subset among a plurality of channel subsets of the plurality of driving channels to drive corresponding display unit, wherein each channel subset of the plurality of channel subsets includes two or more driving channels among the plurality of driving channels.

Abstract: A pulp transportation system is adapted for transporting a pulp among a pulp-supply machine and a plurality of forming machines, and includes a pump unit, a first pipe unit, a second pipe unit and a valve unit. The pump unit is adapted for urging the pulp to flow. The valve unit is operable to control flow of the pulp through the first pipe unit and the second pipe unit, such that the flow of the pulp is convertible between a pulp-supply state, in which the pulp flows out from the pulp supply machine into at least one of the forming machines, and a pulp-return state, in which the pulp flows out from at least one of the forming machines into the pulp supply machine.

Abstract: A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.

Abstract: A capacitor structure comprises a substrate having a first side and a second side opposite to the first side; a plurality of first trenches formed on the first side of the substrate; a plurality of second trenches formed on the second side of the substrate; a first capacitor extending along the first side and into the first trenches; and a second capacitor extending along the second side and into the second trenches.

Abstract: A system that includes a pixel processing stage decoupled from an entropy coding stage is disclosed. The pixel processing results comprise quantized transform coefficients that are divided into component blocks. The component blocks including non-zero data are identified. An optimized version of the pixel processing results for storage in a buffer storage is generated. The optimized version includes an identification of which of the component blocks include non-zero data, and the optimized version includes contents of one or more of the component blocks that include non-zero data, without including contents of one or more of the component blocks that only include zero data. The optimized version of the pixel processing results is provided for storage in the buffer storage. The optimized version of the pixel processing results from the buffer storage is received and processed to generate an unpacked version of the pixel processing results for use in entropy coding.

Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

Abstract: A patent search system, comprising: a database storing a plurality of first patent document data items; and a server accessing the database, the server receiving a first search criterion instruction and then retrieving a plurality of second patent document data items from the plurality of first patent document data items based on the first search criterion instruction, wherein the server receives a first selection instruction associated with a first selected patent document data item in the plurality of second patent document data items, obtains a first keyword data item from the first selected patent document data item based on the first selection instruction, and generates a second search criterion instruction at least based on the first search criterion instruction and the first keyword data item, the second search criterion instruction comprising the first keyword data item, wherein the server retrieves a plurality of third patent document data items from the plurality of first patent document data items

Abstract: A device for collecting and transferring light emitting elements of microscale size includes a non-magnetic plate, a plurality of magnetic probes, and a magnetic plate. The non-magnetic plate defines through holes. Each of the probes is fixed in one through holes. The magnetic plate is on a surface of the non-magnetic plate and closes one opening of each of the through holes. The magnetic plate generates a magnetic field, so that each of the probes magnetically attracts one light emitting element. A method for making the transfer device and a method for transferring light emitting elements using the transfer device are also disclosed.

Abstract: A semiconductor structure, including a substrate and multiple chips, is provided. The chips are stacked on the substrate. Each of the chips has a first side and a second side opposite to each other. Each of the chips includes a transistor adjacent to the first side and a storage node adjacent to the second side. Two adjacent chips are bonded to each other. The transistor of one of the two adjacent chips is electrically connected to the storage node of the other one of the two adjacent chips to form a memory cell.

Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.

Abstract: Building response systems and methods of building responses are described. The building response systems include a building monitoring system configured to detect the presence of a harmful agent within an enclosed space, a building management system configured to monitor a building status and control building systems, a middleware system configured to receive information from each of the building monitoring system and the building management system, wherein the information from the building monitoring system comprises an alarm status and the information from the building management system comprises building status information, and a decision engine configured to receive information from the middleware system and to determine a mitigation action in response to receiving a positive alarm status.

Abstract: This invention provides an antenna assembly equipped with a sub-wavelength structured enhancer, comprising an antenna supporting substrate with a top surface and a bottom surface opposite to each other; a first patch antenna is disposed on the top surface of the antenna supporting substrate or inside of the antenna supporting substrate; a ground layer is disposed under the bottom surface of the antenna supporting substrate; a signal feeding layer for transmitting satellite communicating signals is disposed on one of surfaces of the antenna supporting substrate, or inside of the antenna supporting substrate, or under the first patch antenna, or under a side of the ground layer back to the antenna supporting substrate; and a solid sub-wavelength structured enhancer is disposed above the first patch antenna and spaced with each other by an air gap ranging between 7 mm and 47 mm.

Abstract: Provided is a method for testing a perovskite precursor solution, including: taking a perovskite precursor solution containing a plurality of dispersed perovskite colloids as a sample to perform liquid analysis, thereby obtaining an analysis information; and determining whether the perovskite precursor solution is a good product based on obtained analysis information from the liquid analysis, wherein the analysis information is at least one selected from the group consisting of element content of the colloid, element distribution, colloid size, and colloid appearance, thereby a feasible and effective testing method is defined through the correlation between the perovskite precursor colloid and the perovskite.

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

Abstract: A polyphenylene ether bismaleimide resin, a method for manufacturing the same, and a resin composition are provided. The polyphenylene ether bismaleimide (PPE-BMI) resin is obtained by a condensation reaction with a maleic anhydride and a primary amine compound as reactants. The primary amine compound is a polyphenylene ether diamine.

Abstract: A parametric equalizer includes an equalizer circuit, a first protection circuit, a second protection circuit, and a first addition circuit. The equalizer circuit is arranged to receive an input signal, and process the input signal to generate an output signal. The first protection circuit is arranged to generate a first protection signal according to the output signal, the input signal, and a first processed signal. The second protection circuit is arranged to generate a second protection signal according to the input signal and a second processed signal. The first addition circuit is coupled to the first protection circuit and the second protection circuit, and is arranged to combine the first protection signal and the second protection signal to generate an equalizer output signal.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor devices include a package substrate, a stack of dies carried by the package substrate, and one or more radiation shields configured to absorb neutrons from neutron radiation incident on the semiconductor device. The radiation shields can include one or more walls attached to a perimeter portion of the package substrate at least partially surrounding the stack of dies and/or a lid carried over the stack of dies. Each of the radiation shields can include hydrocarbon materials, boron, lithium, gadolinium, cadmium, and like materials that effectively absorb neutrons from neutron radiation. In some embodiments, the semiconductor devices also include a molding material over the stack of dies and the radiation shields, and a hydrocarbon coating over an external surface of the mold material.

Abstract: A semiconductor device includes a semiconductor film and a gate structure on the semiconductor film. The gate structure includes a multi-stepped gate dielectric on the semiconductor film and a gate electrode on the multi-stepped gate dielectric. The multi-stepped gate dielectric includes a first gate dielectric segment having a first thickness and a second gate dielectric segment having a second thickness that is less than the first thickness.