Abstract: A range finder includes a prism module and a prism adjusting mechanism. The prism module includes a fixing prism group and a movable prism group, wherein the fixing prism group is adjacent to the movable prism group. The prism adjusting mechanism includes a first adjusting group and a second adjusting group, wherein the first adjusting group includes a first adjusting member and a second adjusting member, and the second adjusting group includes a third adjusting member. The first adjusting member or the second adjusting member is rotated to axially move so that the movable prism group is rotated with respect to the fixing prism group about a first axis, the third adjusting member is rotated to axially move so that the movable prism group is rotated with respect to the fixing prism group about a second axis, and the first axis is perpendicular to the second axis.

Abstract: A display control system includes a plurality of driver circuits connected in series. A driver circuit among the plurality of driver circuits includes a receiver, a duty cycle correction circuit and a transmitter. The receiver is configured to receive a first signal from a previous driver circuit among the plurality of driver circuits. The duty cycle correction circuit, coupled to the receiver, is configured to adjust a duty cycle of the first signal to generate a second signal. The transmitter, coupled to the duty cycle correction circuit, is configured to transmit the second signal to a next driver circuit among the plurality of driver circuits.

Abstract: A clock generator includes a pulse generator and a duty cycle correction circuit. The pulse generator is configured to receive an input clock signal and generate a pulse signal according to the input clock signal. The duty cycle correction circuit, coupled to the pulse generator, is configured to adjust a duty cycle of the pulse signal to generate an output clock signal.

Abstract: A control system includes a plurality of driving circuits coupled in series, which includes a first driving circuit and a second driving circuit. The first driving circuit includes a first receiver, a first transmitter and a replica receiver. The first transmitter is coupled to the first receiver, and the replica receiver is coupled to an output terminal of the first transmitter. The second driving circuit, coupled to the first driving circuit, includes a second receiver and a second transmitter. The second receiver is coupled to the first transmitter, and the second transmitter is coupled to the second receiver.

Abstract: An apparatus for perform metal etching and plasma ashing includes: a processing chamber having an enclosed area; an electrostatic chuck disposed in the enclosed area and configured to secure a wafer, the electrostatic chuck connected with a bias power; at least one coil connected with a source power; a etchant conduit configured provide an etchant to a metal of the wafer within the processing chamber in accordance with a photoresist mask of the wafer; and a gas intake conduit connected with a gas source, wherein the gas intake conduit is configured to supply the processing chamber with a gas from the gas source during performance of plasma ashing within the processing chamber.

Abstract: A non-diffusion type photodiode is described and has: a substrate, a buffer layer, a light absorption layer, an intermediate layer, and a multiplication/window layer. The buffer layer is disposed on the substrate. The light absorption layer is disposed on the buffer layer. The intermediate layer is disposed on the light absorption layer and has a first boundary, wherein the intermediate layer is an I-type semiconductor layer or a graded refractive index layer. The multiplication/window layer is disposed on the intermediate layer and has a second boundary, wherein in a top view, the first boundary surrounds the second boundary, and a distance between the first boundary and the second boundary is greater than or equal to 1 micrometer. The non-diffusion type photodiode can reduce generation of dark current.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: A touch display device includes a substrate, first light emitting units, second light emitting units, an insulation layer, and mesh units. The first and the second light emitting units are disposed on the substrate. The second light emitting units are greater than the first light emitting units in area. The insulation layer is disposed on the first and the second light emitting units. The mesh units are disposed on the insulation layer. Each of the mesh units has a mesh frame and a mesh opening. At least one of the first light emitting units and at least one of the second light emitting units are disposed in the mesh opening respectively. A gap is disposed between a first end portion of at least one of the mesh frames and a second end portion of the mesh frame, and the first end portion is electrically connected to the second end portion.

Abstract: An overload protection switch with reverse restart switching structure, particularly to one that has a molded-case circuit breaker which adding a lampshade parallel stagnation position for overload indication, and when resetting, needs to press back to the RESET for reconfirmation; due to the stagnation position and reverse restart structure, it can avoid repeating the reset action, preventing the reduction of the life of the overload protection switch and repeated exposure or the misjudgment and then resetting of electrical products that have been overloaded and tripped and then overload again then results in causing dangerous; also, the lampshade can be completely tripped even when the lampshade is suppressed, and prevent the danger of repeated tripping during overload.

Abstract: A LED driving apparatus with differential signal interfaces is introduced, including: N-stages LED drivers, wherein the first stage LED driver receives a first data packet differential signal and a first clock differential signal and outputs a second data packet differential signal and a second clock differential signal, the Mth stage LED driver receives a Mth data packet differential signal and a Mth clock differential signal and outputs a (M+1)th data packet differential signal and a (M+1)th clock differential signal.

Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. A substrate having a cell region and a mark region is received. A dielectric layer is etched to expose a conductive line in the cell region and form a trench in the mark region. A conductive layer is formed over the cell region and in the trench. The conductive layer is etched to form a bottom electrode via in the cell region and a first mark layer in the trench.

Abstract: A thin film transistor substrate includes a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The first conductive layer is disposed on the substrate and includes a trace portion extending along a first direction and a protrusive portion extending from the trace portion. The second conductive layer is disposed on the first conductive layer and includes a wiring portion extending along a second direction. The trace portion has a first edge and a second edge opposite to the first edge, and the protrusive portion has at least one curved edge connecting with the second edge. When viewed in a third direction perpendicular to the first direction and the second direction, an interface disposes between the trace portion and the protrusive portion, a virtual extending line overlaps the second edge and the interface, and the semiconductor layer extends beyond the virtual extending line.

Abstract: A lighting apparatus and a system for indicating locations within an area are provided. The system includes a plurality of lighting apparatuses that are installed at different locations within the area. The lighting apparatuses form a mesh network. Every lighting apparatus is assigned with an identifier for locating the lighting apparatus with a color or a pattern. The lighting apparatus includes a control circuit that controls the lighting apparatus to operate with a first mode or a second mode. The apparatus includes a lighting unit that can be activated to illuminate color or pattern on a region for indicating where the lighting apparatus is located under the second mode. In an aspect, the area is divided into multiple regions that are indicated by different combinations of colors and patterns illuminated by the lighting units of the lighting apparatuses separately.

Abstract: A LED driving apparatus with clock embedded cascaded LED drivers is introduced, including: a plurality of LED drivers, wherein the first stage LED driver receives an original data signal and outputs a first data signal, the Nth stage LED driver receives a (N?1)th data signal and outputs a Nth data signal. The Nth stage LED driver includes a clock data recovery circuit generating a recovery clock signal and a recovery data signal according to the (N?1)th data signal; and a first transmitter outputting the Nth data signal according to the recovery clock signal and the recovery data signal.

Abstract: A coating system comprising a vessel, a flexible container within the vessel, and a coating apparatus. The flexible container including an outlet port, wherein the flexible container is configured to contract in response to an increase in pressure within the vessel. The flexible container is configured to output a coating composition through the outlet port in response to contraction. The coating apparatus is configured to receive the coating composition from the outlet port.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: The present disclosure relates to a transistor device. The transistor device includes a plurality of first source/drain contacts disposed over a substrate. A plurality of gate structures are disposed over the substrate between the plurality of first source/drain contacts. The plurality of gate structures wrap around the plurality of first source/drain contacts in a plurality of closed loops. A second source/drain contact is disposed over the substrate between the plurality of gate structures. The second source/drain contact continuously wraps around the plurality of gate structures as a continuous structure.

Abstract: A warp scheduling method includes: storing plural of first warps issued to a streaming multiprocessor in an instruction buffer module; marking plural of second warps which are able to be scheduled in the first warps by a schedulable warp indication window, wherein the number of the marked second warps is the size of the schedulable warp indication window; sampling the read/storage unit stall cycle in each time interval to obtain a read/storage unit stall cycle proportion; comparing the read/storage unit stall cycle proportion with the stall cycle threshold, and adjusting the size of the schedulable warp indication window and determining the second warps according to the comparison result; issuing the second warps from the instruction buffer module to a corresponding one of the processing modules for execution.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.

Abstract: A dummy load for automotive LED lights is revealed. The dummy load includes an automotive battery and a control module which is electrically connected both a body computer and a LED light module and provided with a LED control circuit and a charge control circuit. The charge control circuit includes a signal mixer circuit receiving signals from the body computer and discharge signals of the automotive battery, a charger integrated circuit (IC) and a feedback control circuit for battery both electrically connected to the signal mixer circuit, and a battery charging circuit electrically connected to the charger IC and transmitting charge signals to the feedback control circuit for battery and the automotive battery. Thereby a conventional dummy load resistor is replaced by the automotive battery for protecting the automotive LED light from overheating, increasing product stability and recycling a part of electricity for recharge of the automotive battery.