Abstract: A display apparatus and a method for noise reduction are introduced. The method comprises steps of sensing a first pixel signal being superimposed by noises from a first pixel through a first sensing line in a first phase of a sensing operation and sensing a first noise signal from the first sensing line in a second phase of the sensing operation. The method further comprises steps of sensing a second noise signal from a second sensing line in the first phase of the sensing operation, and sensing a third noise signal from the second sensing line in the second phase of the sensing operation. The method further removes the noises that are superimposed to the first pixel signal according to a difference between the first pixel signal and the first noise signal and a difference between the second noise signal and the third noise signal to generate a denoised sensing value of the first pixel.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: A safety gate has a first post assembly, a spinning mechanism, a cover body, and a positioning mechanism. The spinning mechanism is rotatably mounted in the first post assembly. The cover body has an edge mounted in the spinning mechanism. The gate body is wound around and is pulled out from the spinning mechanism to spin the spinning mechanism. The positioning mechanism has a knob and a positioning mount. The positioning mount is moved upwardly or downwardly relative to the spinning mechanism to selectively disengage from and engage with the spinning mechanism. The spinning mechanism is prevented from spinning while being engaged with the positioning mount.

Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.

Abstract: In a display device, the display device includes a substrate, a first conductive layer, a second conductive layer, a semiconductor layer, an opposite substrate and a display medium layer. The first conductive layer is disposed on the substrate and includes a trace portion extending along a first direction and a protrusive portion extending from the trace portion. The second conductive layer is disposed on the first conductive layer and includes a wiring portion extending along a second direction. The semiconductor layer is disposed on the substrate. When viewed in a third direction perpendicular to the first direction and the second direction, an interface disposes between the trace portion and the protrusive portion, a virtual extending line overlaps the second edge and the interface, and the semiconductor layer extends beyond the virtual extending line. The display medium layer is disposed between the substrate and the opposite substrate.

Abstract: A circuit for parameter PSRR measurement includes a filter, a first regulator and a second regulator. The filter may be configured for receiving an AC input signal and a DC input signal, and for outputting a combined output signal according to the AC input signal and the DC input signal. The first regulator may be configured for receiving the combined output signal, and for outputting a first output signal having a first AC component signal and a first DC component signal. The second regulator may be configured for receiving the first output signal, and for outputting a second output signal having a second AC component signal and a second DC component signal. A parameter PSRR of the second regulator may be obtained according to a ratio between the second AC component signal and the first AC component signal.

Abstract: A LED driving apparatus with clock embedded cascaded LED drivers is introduced, including: a plurality of LED drivers, wherein the first stage LED driver receives an original data signal and outputs a first data signal, the Nth stage LED driver receives a (N?1)th data signal and outputs a Nth data signal. The Nth stage LED driver includes a clock data recovery circuit generating a recovery clock signal and a recovery data signal according to the (N?1)th data signal; and a first transmitter outputting the Nth data signal according to the recovery clock signal and the recovery data signal.

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

Abstract: A manufacture method of a concave disc-shaped structure of bimetal strip, particularly to one that is a coaxial positioning method of the guide hole which having elastic disc-shape structure bimetal strips not affected by external stress, which having a bimetal structure which outer edge will not be damaged and does not affect by stress while inner edge pulling closed to the outer edge, it includes: a bimetal strip, a lug, and an assembling jig, having two displaceable positioning holes, and use the guiding surface to make the two positioning holes gradually turn inside to condense to the combining surface of the lugs, so as to achieve the purpose of accurate positioning and combination.

Abstract: A repeater and a synchronization method for the same are provided. The synchronization method includes: configuring a base station to transmit an input signal during downlink transmission durations according to a time division duplex (TDD) configuration, in which the TDD configuration defines a predetermined pattern composed of an uplink transmission duration and a downlink transmission duration; configuring a processor generate a received signal code according to the input signal; configuring the processor to sample the received signal code by using a signal window to generate a target pattern; configuring the processor to dynamically compare the target pattern with the predetermined pattern according to the TDD configuration, positions of the received downlink transmission durations and positions of the received uplink transmission durations stored in a memory of the repeater, and determine whether the target pattern matches to the predetermined pattern.

Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

Abstract: A source driver adapted to drive a display panel is provided. The source driver includes an output buffer and a slew rate adjustment circuit. An input terminal of the output buffer receives a driving voltage. An output terminal of the output buffer outputs an output signal adapted to drive the display panel. The slew rate adjustment circuit dynamically adjusts a slew rate of a rising edge of the output signal according to a first setting and dynamically adjusts a slew rate of a falling edge of the output signal according to a second setting independent of the first setting, such that the adjustment to the slew rate of the rising edge of the output signal is independent of the adjustment to the slew rate of the falling edge of the output signal.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device. The semiconductor device includes a channel layer disposed over a base substrate, and an active layer disposed on the channel layer. A source contact and a drain contact are over the active layer and are laterally spaced apart from one another along a first direction. A gate electrode is arranged on the active layer between the source contact and the drain contact. A passivation layer is arranged on the active layer and laterally surrounds the source contact, the drain contact, and the gate electrode. A conductive structure is electrically coupled to the source contact and is disposed laterally between the gate electrode and the source contact. The conductive structure extends along an upper surface and a sidewall of the passivation layer.

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

Abstract: A circuit for parameter PSRR measurement includes a filter, a first regulator and a second regulator. The filter may be configured for receiving an AC input signal and a DC input signal, and for outputting a combined output signal according to the AC input signal and the DC input signal. The first regulator may be configured for receiving the combined output signal, and for outputting a first output signal having a first AC component signal and a first DC component signal. The second regulator may be configured for receiving the first output signal, and for outputting a second output signal having a second AC component signal and a second DC component signal. A parameter PSRR of the second regulator may be obtained according to the first AC component signal and the second AC component signal.

Abstract: The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.

Abstract: The present invention provides a profile editing system, including: a plurality of devices; a plurality of device control modules, configured to respectively control the devices; and a profile control module, configured to record control settings that are preset by the device control modules for the devices as a profile, so that a user may enable the profile to make the devices work by using the control settings recorded in the profile, to form environmental conditions preset by the user.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

Abstract: A control system includes a plurality of driving circuits coupled in series, which includes a first driving circuit and a second driving circuit. The first driving circuit includes a first receiver, a first transmitter and a replica receiver. The first transmitter is coupled to the first receiver, and the replica receiver is coupled to an output terminal of the first transmitter. The second driving circuit, coupled to the first driving circuit, includes a second receiver and a second transmitter. The second receiver is coupled to the first transmitter, and the second transmitter is coupled to the second receiver.