Patents by Inventor Hsiang Wang

Hsiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664431
    Abstract: The present disclosure relates to a transistor device. The transistor device includes a plurality of first source/drain contacts disposed over a substrate. A plurality of gate structures are disposed over the substrate between the plurality of first source/drain contacts. The plurality of gate structures wrap around the plurality of first source/drain contacts in a plurality of closed loops. A second source/drain contact is disposed over the substrate between the plurality of gate structures. The second source/drain contact continuously wraps around the plurality of gate structures as a continuous structure.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 30, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Aurelien Gauthier Brun, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Yun-Hsiang Wang
  • Patent number: 11664389
    Abstract: A thin film transistor substrate includes a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The first conductive layer is disposed on the substrate and includes a trace portion extending along a first direction and a protrusive portion extending from the trace portion. The second conductive layer is disposed on the first conductive layer and includes a wiring portion extending along a second direction. The trace portion has a first edge and a second edge opposite to the first edge, and the protrusive portion has at least one curved edge connecting with the second edge. When viewed in a third direction perpendicular to the first direction and the second direction, an interface disposes between the trace portion and the protrusive portion, a virtual extending line overlaps the second edge and the interface, and the semiconductor layer extends beyond the virtual extending line.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: May 30, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Cheng-Hsiung Chen, Pei-Chieh Chen, Chao-Hsiang Wang, Yi-Ching Chen
  • Publication number: 20230154956
    Abstract: An image sensor includes a first pixel array. The first pixel array includes multiple photo diodes and a polyhedron structure. The polyhedron structure is located above the photo diodes, and the polyhedron structure includes a bottom facet, a top facet, and at least one side facet. The bottom facet is located between the side facet and the photo diodes, and an orthogonal projection of the polyhedron structure overlaps with photo diodes. The polyhedron structure is configured to divide an incident light into a plurality of light beams focused in the photo diodes.
    Type: Application
    Filed: June 7, 2022
    Publication date: May 18, 2023
    Inventors: Shin-Hong KUO, Yu-Chi CHANG, Zong-Ru TU, Ching-Chiang WU, Po-Hsiang WANG
  • Publication number: 20230145833
    Abstract: Raw material grains according to the present invention comprise, as components, 40 to 60% plant fiber powder, 20 to 30% starch, 10 to 20% vegetable gum powder obtained by fermenting starch, 2 to 15% water-soluble polymer glue, and 1 to 10% water-soluble cellulose derivative. The production process thereof primarily includes: a step of appropriately adjusting blending ratios in accordance with the production method, rotating and kneading for 10-40 minutes the fiber powder, starch, and vegetable gum powder, each in a separate kneader, and then batch stirring and kneading all of the blending components in a fourth kneader to thereby obtain a raw material; and a step of subsequently molding the mixed raw material into a plurality of strands in a molding device, cutting the strands into granular raw material grains via a cutting unit, cooling the raw material grains, and then packaging a raw material grain product.
    Type: Application
    Filed: March 1, 2021
    Publication date: May 11, 2023
    Applicants: Amica Terra Co., Ltd., House Foods Group Inc.
    Inventor: Cheng Hsiang Wang
  • Publication number: 20230138767
    Abstract: A control circuit of a power converter and a control method thereof are provided. The control circuit includes an error amplifier, a controller, a digital filter, and a digital pulse width signal modulator. The error amplifying circuit is coupled to an output terminal of the power converter and provides a digital error signal. The controller provides a first working parameter corresponding to the first external control command when receiving a first external control command. The digital filter generates a current digital compensation value. The digital pulse width signal modulator generates a pulse width modulation signal. The controller provides a second working parameter corresponding to the second external control command when receiving a second external control command. The controller calculates a transition value according to the second working parameter and the current digital compensation value. The controller provides the second working parameter and the transition value to the digital filter.
    Type: Application
    Filed: September 16, 2022
    Publication date: May 4, 2023
    Applicant: uPI Semiconductor Corp.
    Inventors: Yun-Kuo Lee, Wei-Hsiang Wang, Yen-Chih Lin, Wei-Hsiu Hung
  • Patent number: 11641720
    Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: May 2, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Wei Wang, Shao-Chien Lee, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang, Chin-Min Hu
  • Patent number: 11636795
    Abstract: A method of providing display signal, performed by a first processing device, and the method includes: triggered by a first detection signal to read first identification data of a display, obtaining second identification data according to a reading condition, outputting a second detection signal to a second processing device to obtain an identification data request signal from the second processing device, and outputting the second identification data to the second processing device according to the identification data request signal to instruct the second processing device to output a display signal to the display according to a resolution indicated by the second identification data. The present disclosure further provides a resolution setting device and a display system.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: April 25, 2023
    Assignee: WISTRON CORP.
    Inventors: Po-Yen Huang, Kuang Wei Wang, Tzu-Chieh Lee, Yen-Hsiang Wang, Ching-Ting Huang
  • Publication number: 20230122849
    Abstract: The present invention relates to a method of treating moderate or severe symptoms of COVID-19 using a plant composition. The plant composition comprises Prepared Monkshood Daughter Root (Aconitum carmichaelii), Fragrant Solomonseal Rhizome (Polygonatum odoratum), Indian Bread (Poria cocos), Pinellia tuber (Pinellia ternata), Oriental Wormwood Herb (Artemisia scoparia), Scutellaria Root (Scutellaria baicalensis), Mongolian Snakegourd Fruit (Trichosanthes kirilowii), Magnolia Bark (Magnolia officinalis), Heartleaf Houttuynia Herb (Houttuynia cordata), and Baked Licorice Root and Rhizome (Glycyrrhiza glabra), which is used as a traditional Chinese medicine composition.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 20, 2023
    Inventors: YI-CHANG SU, WEN-HUI CHIOU, YUH-CHIANG SHEN, WEN-CHI WEI, KENG-CHANG TSAI, CHIA-CHING LIAO, YU-HWEI TSENG, CHUN-TANG CHIOU, YU-CHI LIN, LI-HSIANG WANG, CHIEN-HSIEN HUANG, CHIA-MO LIN, CHI-KUEI LIN, YI-CHIA HUANG, CHIEN-JUNG LIN, JUI-SHAN LIN, YA-SUNG YANG, CHUN-HSIANG CHIU, SHUN-PING CHENG, HSIEN-HWA KUO, WU-PU LIN, CHEN-SHIEN LIN, BO-CHENG LAI, YUAN-NIAN HSU, TSUNG-LUNG TSAI, WEI-CHEN HSU, TIENG-SIONG FONG, YI-WEN HUANG, CHIA-I TSAI, YA-CHEN YANG, MING-CHE TSAI, MING-HUEI CHENG, SHIH-WEI HUANG
  • Publication number: 20230124965
    Abstract: The present invention relates to a plant composition, a traditional Chinese medicine composition and use thereof. The plant composition comprises Prepared Monkshood Daughter Root (Aconitum carmichaelii), Fragrant Solomonseal Rhizome (Polygonatum odoratum), Indian Bread (Poria cocos), Pinellia tuber (Pinellia ternata), Oriental Wormwood Herb (Artemisia scoparia), Scutellaria Root (Scutellaria baicalensis), Mongolian Snakegourd Fruit (Trichosanthes kirilowii), Magnolia Bark (Magnolia officinalis), Heartleaf Houttuynia Herb (Houttuynia cordata) and Baked Licorice Root and Rhizome (Glycyrrhiza glabra), which is used as a traditional Chinese medicine composition. In addition, the traditional Chinese medicine composition can be used to treat pulmonary embolism or pulmonary fibrosis.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 20, 2023
    Inventors: YI-CHANG SU, WEN-HUI CHIOU, YUH-CHIANG SHEN, WEN-CHI WEI, KENG-CHANG TSAI, CHIA-CHING LIAO, YU-HWEI TSENG, CHUN-TANG CHIOU, YU-CHI LIN, LI-HSIANG WANG
  • Patent number: 11631626
    Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: April 18, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Ra-Min Tain, Po-Hsiang Wang, Chi-Chun Po
  • Publication number: 20230097129
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 30, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Publication number: 20230086456
    Abstract: The application discloses a light-emitting device including a carrier which includes an insulating layer, an upper conductive layer formed on the insulating layer, a plurality of conducting vias passing through the insulating layer, and a lower conductive layer formed under the insulating layer; four light-emitting elements arranged in rows and columns flipped on the carrier; and a light-passing unit formed on the carrier and covering the four light-emitting elements; wherein each of the light-emitting elements including a first light-emitting bare die emitting a first dominant wavelength, a second light-emitting bare die emitting a second dominant wavelength, and a third light-emitting bare die emitting a third dominant wavelength; and wherein two adjacent first light-emitting bare die in a row has a first distance W1, two adjacent first light-emitting bare die in a column has a second distance W2, and W1 is the same as W2.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Inventors: Min-Hsun HSIEH, Tzu-Hsiang WANG
  • Patent number: 11608675
    Abstract: A safety gate has a gate body and two first locking units. The gate body has two first connecting elements. The two first locking units are respectively mounted on two opposite sides of a door frame. Each first locking unit has a second connecting element and a blocking element. When the safety gate is closed, each of the first connecting elements is connected with a respective one of the second connecting elements. Each blocking element has a blocking position for blocking a corresponding first connecting element to prevent the corresponding first connecting element from being disengaged from the second connecting element and a pressed position to allow-the corresponding first connecting element to detach from the second connecting element of the first locking unit.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 21, 2023
    Assignee: DEMBY DEVELOPMENT CO., LTD.
    Inventor: Tsung-Hsiang Wang
  • Patent number: 11606089
    Abstract: A decoupling capacitance (decap) system which includes: a decap circuit electrically coupled between a first or second reference voltage rail and a first node; and a biasing circuit coupled between the first node and correspondingly the second or first reference voltage rail. Due to the series connection between the decap circuit and the biasing circuit, the voltage drop across the biasing circuit effectively reduces the voltage drop across the decap circuit so that the voltage drop across the decap circuit is less than a voltage drop across the decap system as whole.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: March 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Szu-Lin Liu, Yi-Hsiang Wang, Jaw-Juinn Horng
  • Patent number: 11588084
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: February 21, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 11581861
    Abstract: An operational amplifier includes a first differential input pair, a first switch and a second switch. The first differential input pair includes a first input transistor and a second input transistor. The first input transistor has a gate terminal coupled to an output terminal of the operational amplifier. The second input transistor has a gate terminal. The first switch is coupled between the gate terminal of the first input transistor and the gate terminal of the second input transistor. The second switch is coupled between a first input terminal of the operational amplifier and the gate terminal of the second input transistor.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: February 14, 2023
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Ying-Hsiang Wang, Tsung-Hau Chang, Jung-Hsing Liao
  • Patent number: 11573585
    Abstract: A device is disclosed. The device includes an operational amplifier, an output circuit and a first feedback circuit. The operational amplifier includes an input terminal that is configured to receive a feedback signal. The output circuit is coupled to an output terminal of the operational amplifier and is configured to generate an output signal in response to an output of the operational amplifier. The first feedback circuit is coupled to the output circuit and is configured to couple at least one first ripple signal in the output signal to the input terminal of the operational amplifier that is configured to receive the feedback signal, for adjusting the output signal. A method also is disclosed herein.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: February 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Hsiang Wang, Jaw-Juinn Horng
  • Publication number: 20230021342
    Abstract: Methods, apparatus and systems for enhanced wireless monitoring of vital signs are described. In one example, a described system comprises: a transmitter configured to transmit a wireless signal through a wireless channel of a venue; a receiver configured to receive the wireless signal through the wireless channel; and a processor. The received wireless signal differs from the transmitted wireless signal due to the wireless channel that is impacted by a periodic motion of a vital sign of an object in the venue. The processor is configured for: obtaining a time series of channel information (CI) of the wireless channel based on the received wireless signal, computing a two dimensional (2D) decomposition of the time series of CI (TSCI), enhancing the 2D decomposition, and monitoring the periodic motion of the vital sign based on the enhanced 2D decomposition.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Inventors: Beibei Wang, Sakila Sandeepani Jayaweera Samaranayake Arachchige Dona, Xiaolu Zeng, Wei-Hsiang Wang, K. J. Ray Liu, Oscar Chi-Lim Au
  • Publication number: 20230027031
    Abstract: An atmospheric turbulence detection method includes: providing a temperature difference measuring device including a thermocouple element and two sensing probes, wherein the thermocouple element has two opposite end portions, the two sensing probes are respectively disposed at the two end portions, and there is an ambient distance between the two end portions; placing the temperature difference measuring device in an atmospheric environment to generate an electromotive force by a temperature difference between the two end portions; analyzing the electromotive force to convert the electromotive force into an ambient temperature difference of an environment where the two end portions of the thermocouple element are located, an atmospheric refractive index structure constant is calculated according to the ambient temperature difference and the ambient distance, and a value of the atmospheric refractive index structure constant corresponds to an ambient disturbance of an atmospheric turbulence.
    Type: Application
    Filed: September 3, 2021
    Publication date: January 26, 2023
    Inventors: Sheng-Hsiang Wang, Kun-Hsu Wu, Sheng-Fu Hu
  • Publication number: 20230012780
    Abstract: A humidifier has a base and a housing. The housing has a steam exhaust vent and a vaporizer. The vaporizer includes a heating element surrounded by a removable porous sleeve that protrudes downwardly into water within a reservoir of the base. The sleeve wicks the water including its minerals and impurities into contact with the heating element wherein energization of the heating element causes the wicked water to convert to steam that rises through the exhaust vent and from the housing during a humidification mode.
    Type: Application
    Filed: March 29, 2022
    Publication date: January 19, 2023
    Inventors: Chi Hsiang Wang, Hao Han Wang