Abstract: A detection device, including a light-emitting component, a light-detecting component, at least one reflective optical film element, and a control unit, is provided. The light-emitting component is used for providing an excitation beam, wherein a part of the excitation beam whose dominant wavelength falls within an excitation wavelength band generates a fluorescence beam after passing through a test specimen. The light-detecting component is used for receiving a part of the fluorescence beam whose dominant wavelength falls within a detection wavelength band. The control unit is coupled to the at least one reflective optical film element. The control unit controls the at least one reflective optical film element to filter out a part of a wavelength band of an incident beam. The incident beam is at least one of the excitation beam and the fluorescence beam. A detection method of the detection device is also provided.

Abstract: Multicast Broadcast Services (“MBS”) is a service provided to user equipment (“UE”) devices. As the UE moves through the network, it may switch between network cells. Some network cells include MBS service availability, which will be considered by the UE when selecting cells. MBS service continuity can be maintained when the UE considers MBS service availability for selecting network cells. The service availability of MBS can be determined by the UE while the UE is in an inactive or idle state.

Abstract: A foldable support, wherein the foldable support comprises two first supporting members, two second supporting members, two first assembly portions, and two second assembly portions. The first supporting members are able to be rotatably unfolded relative to the second supporting members or be drawn together and folded up. First linking members are respectively movable connected to the two first assembly portions close to the ends of a second supporting arm, and the other ends of the two second linking members are respectively correspondingly hinged to the two second supporting members. The two second assembly portions are respectively correspondingly hinged to the two second supporting members, and each of the second assembly portions, close to the ends of the first supporting arm, are movable connected to first linking members. The two first linking members are respectively correspondingly hinged to the two first supporting members.

Abstract: An optical device includes a substrate, a first electrode, a second electrode, and a first lens. The first electrode and the second electrode are over the substrate and configured to generate a first electric field. The first lens is between the first electrode and the second electrode and has a focal length that varies in response to the first electric field applied to the first lens.

Abstract: A current transmission assembly and a current transmission system are provided. The current transmission system includes the current transmission assembly and a circuit board structure. The current transmission assembly includes a pluggable component, at least one conductor component, and at least one electrically connecting component. The pluggable component includes a housing, two sets of electrically conductive arms, and two connecting members. Each of the two sets of electrically conductive arms is disposed inside the housing. Each of the conductor components includes an electrical insulator and a wire main body. The electrical insulator encircles the wire main body, so that a first terminal and a second terminal are exposed from the wire main body, and the first terminal is connected to one of the two connecting members. Each of the electrically connecting components includes a connecting portion, to which the second terminal of the wire main body is fixed.

Abstract: Systems, apparatus and methods are provided for temperature assisted non-volatile storage device management in a non-volatile storage system. In one embodiment, a non-volatile storage system may comprise a temperature sensor, a non-volatile storage device and a processor. The processor may be configured to obtain a read-out from the temperature sensor, generate a predicted real-time on-die temperature for the non-volatile storage device based on the read-out, generate an estimated threshold voltage for reading data stored in the non-volatile storage device based on the predicted real-time on-die temperature and conduct a local sweep of a reference voltage using the estimated threshold voltage as a starting point to obtain a final read reference voltage with a minimum read bit error rate.

Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.

Abstract: The present disclosure provides a method and a device for transaction clearing. The method includes receiving first clearing requests transmitted by a quantity N of terminals, where N>1; according to the first clearing requests, acquiring transaction data of the quantity N of terminals from a database; initializing a cache queue, and loading the transaction data into the cache queue; reading the transaction data in the cache queue, and performing a clearing process on the transaction data; and writing a clearing result into the database and feeding back the terminals with an execution result of the first clearing requests.

Abstract: The present disclosure belongs to the technical field of integrated circuit packaging, and specifically relates to a through silicon via structure for three-dimensional integrated circuit packaging and a manufacturing method thereof.

Abstract: Methods, systems, and devices for integrated access and backhaul (IAB) donor migration in mobile and cellular networks are described. An example method for wireless communication includes transmitting, by a first IAB donor to a second IAB donor, an Xn Application Protocol (XnAP) message comprising an Internet Protocol (IP) address request information, and receiving, from the second IAB donor, an IP address information. Another example method for wireless communication includes transmitting, by a first network node to a second network node, a message comprising a transmission action indicator information, wherein the transmission action indicator information configures the second network node to perform one or more transmission actions to a wireless device.

Abstract: A display device and a backlight control method of the display device are provided. When a duration of an image occlusion period is shorter than a preset duration, a backlight driving circuit is controlled to respectively provide a first pulse current and a second pulse current in a first light emitting period and a second light emitting period in each frame period, so as to drive a backlight unit to provide a first backlight and a second backlight. Here, the first pulse current is greater than the second pulse current.

Abstract: An IC package comprises a substrate; a semiconductor die with a top surface, wherein the semiconductor die is stacked over the substrate; a vapor chamber stacked over the semiconductor die, wherein the vapor chamber comprises a proximal portion and a distal portion, the proximal portion covers the top surface of the semiconductor die; and an encapsulating case encapsulating the substrate, the semiconductor die and the vapor chamber, wherein the proximal portion of the vapor chamber is within the encapsulating case, and the distal portion of the vapor chamber extends from a wall of the encapsulating case.

Abstract: A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.

Abstract: Disclosed is an SOI active interposer for three-dimensional packaging and a fabrication method thereof. An SOI substrate is used as the substrate, and a CMOS inverter is formed on the top silicon of the SOI by using standard integrated circuit manufacturing processes, so that short channel effect and latch-up effect can be suppressed. A via hole structure is etched on the SOI substrate between the PMOS and NMOS transistors of the CMOS inverter, which on the one hand can be used as a conductive channel between the chips in a vertical direction, and on the other hand, can be used as an electrical isolation layer between the PMOS and NMOS transistors.

Abstract: The invention concerns a 3D pop-up card having a foldable base card which has an inner side and an outer side, the base card being foldable along a fold and being reversibly transferable from a folded, closed state to an unfolded, open state, wherein a foldable figure is fixed to the inner side of the base card and the foldable figure unfolds autonomously into a three-dimensional structure when the base card is transferred into an open state, wherein the base card is double-layered, the layer which is on the inside in the closed state having at least one slit on each of the two sides of the fold the base card and the foldable figure being connected to one another via L-shaped connecting pieces, and the first leg of an L-shaped connecting piece engaging in a slit and the second leg of an L-shaped connecting piece being attached to the foldable figure.

Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.

Abstract: Lactobacillus johnsonii is provided. The Lactobacillus johnsonii is Lactobacillus johnsonii TCI369 with an accession number of DSM 34008. Also, a method for increasing the level of unsaturation in fatty acids is provided. The method includes administering to a subject in need thereof a composition including Lactobacillus johnsonii or metabolites thereof. The Lactobacillus johnsonii is the Lactobacillus johnsonii TCI369 with an accession number of DSM 34008.

Abstract: Techniques are described to perform a wireless communication method, comprising receiving, by a communication node, a first information that indicates to a communication node to operate in a point-to-multipoint (PTM) mode to receive multicast and broadcast service (MBS) data; receiving, by the communication node, a second information that indicates to the communication node to not operate in a point-to-point (PTP) mode to receive MBS data; and receiving MBS data by operating the communication node in the PTM mode and not in the PTP mode in response to the first information and the second information.

Abstract: The present disclosure provides to a processing device and a processing method for a ray tracing acceleration structure. The processing device includes a machine-readable storage medium and a processor. The processor executes a descriptor to simulate the interaction between the ray with the scene, and the descriptor includes a first pointer and a second pointer. The processor obtains the TLAS by using the first pointer. The processor traverses the TLAS to find a leaf node in the TLAS that intersects the ray, and the intersected leaf node includes an instance identifier. The processor obtains the intersected instance record from the instance buffer pointed to by the second pointer by using the instance identifier, and the intersected instance record includes a third pointer. The processor obtains the BLAS by using the third pointer. The processor traverses the BLAS to find a primitive node in the BLAS that intersects the ray.

Abstract: A grid structure in a pixel array may be at least partially angled or tapered toward a top surface of the grid structure such that the width of the grid structure approaches a near-zero width near the top surface of the grid structure. This permits the spacing between color filter regions in between the grid structure to approach a near-zero spacing near the top surfaces of the color filter regions. The tight spacing of color filter regions provided by the angled or tapered grid structure provides a greater surface area and volume for incident light collection in the color filter regions. Moreover, the width of the grid structure may increase at least partially toward a bottom surface of the grid structure such that the wider dimension of the grid structure near the bottom surface of the grid structure provides optical crosstalk protection for the pixel sensors in the pixel array.