Abstract: A robotic arm includes a first driving source and a second driving source mounted on a base frame, a first transmission link driven by the first driving source to turn around a first axis, a second transmission link driven by the second driving source to turn around a second axis that is parallel to the first axis, a third transmission link pivoted to the first transmission link, a first driven link pivoted to the second transmission link, a second driven link pivotally coupled between the first driven link and the base frame, a third driven link pivotally connected with the first and second driven link, and a fourth driven link pivotally coupled between the third driven link and the third transmission link. Thus, the robotic arm of the invention has a compact size and can achieve multi-degree of freedom motion.

Abstract: A triaxial motion device includes first, second and third bases, first and second power sources, and a workpiece positioning member. The first power source is disposed on the first base and has a first driving shaft. The second base is connected with the first driving shaft through a cannular rotary shaft in a way that the second base is rotatable about a first axis. The second power source is disposed on the first base and has a second driving shaft penetrating through the cannular rotary shaft. The third base is connected with the second driving shaft in a way that the third base is rotatable about a second axis perpendicular to the first axis. The workpiece positioning member is disposed on the third base and rotatable about a third axis perpendicular to the second axis. Therefore, the triaxial motion device has small volume and performs highly precise motion.

Abstract: A switch module includes a switch base, a common terminal, a normally open terminal, a resilient piece, an upper cover and a soft element. The resilient piece includes a first portion and a second portion. The first portion of the resilient piece is disposed on the common terminal. The second portion of the resilient piece is located over the normally open terminal. The upper cover is disposed on the switch base to cover the common terminal, the normally open terminal and the resilient piece. The soft element is arranged between the upper cover and the second portion of the resilient piece. When an external force exerted on the resilient piece is eliminated, the second portion of the resilient piece is moved in a direction away from the switch base in response to an elastic restoring force of the resilient piece.

Abstract: A method and a system of performing layout enhancement include: providing a first design layout comprising a plurality of cells; updating a first cell in the plurality of cells using optical proximity correction to provide a first updated cell and a data set; updating a second cell from remaining cells in the first design layout based on the data set to provide a second updated cell; and manufacturing a mask based on the first updated cell and the second updated cell in the first design layout.

Abstract: A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.

Abstract: Pharmaceutical preparations containing polypeptides having particular sialylation patterns, and methods for the treatment of immune-related thrombocytopenia with such preparations, are described.

Abstract: A mouse device includes a button, a switch, a linkage element, a plate body, a supporting element and an adjusting element. A triggering part of the plate body is arranged between the linkage element and the switch. When the adjusting element is moved, the supporting element is correspondingly moved. Consequently, the supporting element is selectively contacted with the first fulcrum or the second fulcrum. While the button is pressed down and the linkage element is moved downwardly toward the triggering part, the triggering part is swung around a first fulcrum or a second fulcrum of the plate body to push the switch. Consequently, the switch is triggered.

Abstract: A heat dissipation structure of electronic device includes a main body having a first heat pipe set and a second heat pipe set. The first heat pipe set includes at least one first heat pipe normal to the main body. A first thermal module and a first fan are disposed on the first heat pipe. The second heat pipe set includes at least one second heat pipe having a first section normal to the main body and a second section extending from the first section in parallel to the main body. A second thermal module and a second fan are disposed on the second section. The first fan creates a first airflow flowing through the first and second thermal modules in a first direction. The second fan creates a second airflow flowing through the second thermal module in a second direction.

Abstract: A transmitter circuit includes an amplifier configured to output a radio frequency (RF) signal on an output node, a power detection circuit coupled with the output node and configured to generate an output voltage having a first component based on a power level of the RF signal, and a reference voltage generator configured to generate a reference voltage. A comparator is configured to receive the output voltage and the reference voltage, an analog-to-digital converter (ADC) is coupled between the comparator and the amplifier, and the amplifier is configured to adjust the power level of the RF signal responsive to an output of the ADC.

Abstract: A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.

Abstract: An IC structure includes a substrate, a deep n-well (DNW), a first device, a second device, a first electrical path and a second electrical path. The DNW is in the substrate. The first device is formed inside the DNW and connected to a first lower reference voltage and a first higher reference voltage. The second device is formed in the substrate and outside the DNW, and connected to a second lower reference voltage and a second higher reference voltage. The first electrical path is electrically connected between the first device and the second device. The second electrical path is electrically connected between the first lower reference voltage and the second lower reference voltage. A second metal layer that includes the second electrical path is located in an area outside of an area above a first metal layer in which the first electrical path is located.

Abstract: The present invention provides a scroll wheel module with a touch sensing mechanism, where the scroll wheel module includes a scroll wheel body, a touch sensing element, and an encoding element; the scroll wheel body is pivotally connected to a housing, and the middle of the scroll wheel body is provided with a cavity; the touch sensing element is installed in the cavity; the touch sensing element includes a connecting portion and a fixing portion; the connecting portion is pivotally connected to the scroll wheel body; the fixing portion is connected to the housing; and the encoding element is connected to the scroll wheel body. In this way, an effect of arbitrarily switching different function modes to be adjusted is achieved.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a first well, a second well, and first and second doped regions. The substrate has heavily doped and lightly doped regions. The lightly doped region is disposed over the heavily doped region. The first well is disposed in the lightly doped region. The first well has a conductive type complementary to a conductive type of the heavily doped and lightly doped regions. The second well is disposed in the substrate over the lightly doped region. A location of the first well overlaps a location of the second well. The first and the second doped regions are located in the second well within the active region, and spaced apart from each other. The first and the second doped regions have a same conductive type complementary to a conductive type of the second well.

Abstract: The present invention relates to a mouse, including a base, a cover plate provided with a hole, a circuit board, a button switch, an elastic cover, and an upper cover. The cover plate covers the base, and the circuit board is disposed on the base and located between the base and the cover plate. The button switch is disposed on the circuit board. The elastic cover covers the button switch, and extends into the hole together with the button switch, so as to prevent the button switch from being exposed out of the hole. The upper cover covers the cover plate, and the upper cover is capable of oscillating relative to the cover plate to abut against the elastic cover, so as to trigger the button switch.

Abstract: A medical instrument includes an instrument body and an operating mechanism. The instrument body has a window portion having a light permeable segment. The operating mechanism includes an indicator unit and an operating unit. The indicator unit is disposed in the window portion, and is changeable between a detectable state where the indicator unit is detectable through the light permeable segment of the window portion and a non-detectable state where the indicator unit is non-detectable through the light permeable segment. The operating unit is connected to the indicator unit and operable to change the indicator unit between the detectable and non-detectable states. An endoscopy system including the medical instrument is also disclosed.

Abstract: A package structure includes at least one semiconductor chip, an insulating encapsulation, and a redistribution circuit structure. The semiconductor chip has an active surface and connecting pads distributed thereon. The insulating encapsulation encapsulates the semiconductor chip. The redistribution circuit structure is disposed on and has at least one metallization layer with metal segments, wherein the redistribution circuit structure is electrically connected to the semiconductor chip through the at least one metallization layer and the connecting pads electrically connected thereto. A projection location of a first gap between any two most adjacent connecting pads of the connecting pads is partially overlapped with a projection location of a second gap between any two most adjacent metal segments of the metal segments of the at least one metallization layer in a vertical projection on the active surface of the at least one semiconductor chip.

Abstract: A package structure includes at least one semiconductor chip, an insulating encapsulation, and a redistribution circuit structure. The semiconductor chip has an active surface and connecting pads distributed thereon. The insulating encapsulation encapsulates the semiconductor chip. The redistribution circuit structure is disposed on and has at least one metallization layer with metal segments, wherein the redistribution circuit structure is electrically connected to the semiconductor chip through the at least one metallization layer and the connecting pads electrically connected thereto. A projection location of a first gap between any two most adjacent connecting pads of the connecting pads is partially overlapped with a projection location of a second gap between any two most adjacent metal segments of the metal segments of the at least one metallization layer in a vertical projection on the active surface of the at least one semiconductor chip.

Abstract: The present invention provides a scroll wheel module with a touch sensing mechanism, where the scroll wheel module includes a scroll wheel body, a touch sensing element, and an encoding element; the scroll wheel body is pivotally connected to a housing, and the middle of the scroll wheel body is provided with a cavity; the touch sensing element is installed in the cavity; the touch sensing element includes a connecting portion and a fixing portion; the connecting portion is pivotally connected to the scroll wheel body; the fixing portion is connected to the housing; and the encoding element is connected to the scroll wheel body. In this way, an effect of arbitrarily switching different function modes to be adjusted is achieved.

Abstract: A transmission frontend includes a modulator configured to generate a modulated signal. A first selectable path is electrically coupled to the modulator and is configured to generate a first signal having a first power level. A second selectable path is electrically coupled to the modulator and is configured to generate a second signal having a second power level. The first power level is greater than the second power level. A transformer is electrically coupled to each of the first selectable path and the second selectable path. An antenna is electrically coupled to the transformer.

Abstract: The present invention provides a mouse device, including a housing, a flexible film, a support structure, a linking structure, and a motor. The flexible film covers an opening of the housing. The linking structure is connected between the motor and the support structure. The motor is configured to enable the linking structure to move to change an abutting state that the support structure abuts against the flexible film, thereby enabling the flexible film to deform.