Abstract: A master-slave type battery management system for accurate capacity gauge of battery packs is disclosed. It includes several battery management units linked to each other via a communication line. Each battery management unit is linked to a specified rechargeable battery set to manage the specified rechargeable battery set, detect a physical measurement data from the specified rechargeable battery set and calculates battery set capacity related value based on the physical measurement data. Each battery management unit has a unique battery ID. By assigning a battery management unit having a specified battery ID as a master battery management unit, the rest battery management units become slave battery management units. Each slave battery management unit sends the physical measurement data and battery set capacity related value to the master battery management unit via the communication line. The master battery management unit is in charge of calculating related values and transmitting them.

Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.

Abstract: A control circuit according to an embodiment of the present invention is configured to control a switching element of a switching power supply. The control circuit includes a comparator having a first input terminal configured to receive an output voltage of the switching power supply. The comparator has a second input terminal that is connectable to a positive terminal of a reference voltage source. The comparator has an output. The output brings the reference voltage to a first voltage while the output signal takes a first voltage level. The output brings the reference voltage to a second voltage while the output signal takes a second voltage level. The constant voltage source has a positive terminal connected to a negative terminal of the reference voltage source and a ground of the comparator.

Abstract: A method and apparatus for loop filter processing of reconstructed video data for a video coding system are disclosed. The system receives reconstructed video data for an image unit. The loop filter processing is applied to reconstructed pixels above a deblocking boundary of the current CTU. In order to reduce line buffer requirement and/or to reduce loop filter switching for image units, the sample adaptive offset (SAO) parameter boundary and spatial-loop-filter restricted boundary for the luma and chroma components are determined by global consideration. In one embodiment, the SAO parameter boundary and the spatial-loop-filter restricted boundary are aligned for the luma and chroma components respectively. In another embodiment, the SAO parameter boundary and the spatial-loop-filter restricted boundary for the luma and chroma components are all aligned.

Abstract: In a method and apparatus for loop filter processing, a sample adaptive offset (SAO) process is applied to DF (deblocking filter)-processed pixels of current image unit according to one or more SAO parameters. Pixels within SAO parameter boundary of current image unit share the same SAO parameters. SAO parameter boundary is shifted according to a respective goal to reduce both line buffer requirement and parameter switching, where the vertical SAO parameter boundary of current image unit is shifted-left by xs lines from a vertical boundary of current image unit and the horizontal SAO parameter boundary of current image unit is shifted-up by ys lines from a horizontal boundary of current image unit. To reduce the requirement of line buffer, xs is always greater than m that corresponds to the number of pixels at each side of a horizontal edge modified by DF, ys is greater than or equal to 0.

Abstract: A display module including a display panel, an optical film, a cover plate and an optical clear adhesive (OCA) layer is provided. The display panel has a display surface. The optical film is disposed on the display surface, wherein the optical film has a first surface back to the display panel, and the first surface has a plurality of edges and a plurality of corners formed by any adjacent two of the edges crossing each other. The cover plate is disposed on the first surface of the optical film and covers the first surface. The OCA layer is disposed between the cover plate and the optical film and connected with the cover plate and the optical film, wherein the OCA layer covers the edges of the first surface and exposes the corners and a part of regions adjacent to the corners.

Abstract: The present invention relates to a method for granulation of an absorbent and adsorbent granules prepared by the same. The method comprises the steps of blending sodium metasilicate, metakaoline and an inorganic ion exchange material in water to form a slurry; decanting the resulted slurry onto a nylon cloth of 300 to 400 meshes and natural drying at ambient temperature to solidification; then breaking the solidified final product and sieving it by a screen having a mesh size of from 0.2 to 2.5 mm to provide the absorbent granules having excellent absorbability.

Abstract: A safe package of micro battery with used battery recycling function, which can prevent the children from taking the micro battery easily and swallowed by mistake, comprising a lower cover plate, a folding portion, and an upper cover plate, the same side edge of said lower cover plate and said upper cover plate respectively connected with corresponding side of folding portion; said folding portion configure to fold the upper cover plate in the lower cover plate for fixing integrally and matched mutually; the lower cover plate including a concave part, a insertion slot, an exit slot, and two projecting parts; the upper cover plate including a insertion slit, two sides slits, and an exit slit thereby taking the new micro battery and recycled the used battery via double hands.

Abstract: A method includes forming a bump on a lower surface of an interposer. A first insulation layer is formed to cover the lower surface and bump. A trench is formed extending from the lower towards an upper surface of the interposer. A polymer supporting adhesive layer is formed to surround the bump and couples between the interposer and a semiconductor chip. The semiconductor chip has at least a sensing component and a conductive pad electrically connected to the sensing component, and the bump is connected to the conductive pad. A via is formed extending from the upper towards the lower surface. A second insulation layer is formed to cover the upper surface and the via. A redistribution layer is formed on the second insulation layer and in the via. A packaging layer is formed to cover the redistribution layer and has a second opening.

Abstract: An LED headlight includes a lens, a heat sink, at least one LED module and a shelter. The lens includes a focal length and a focal plane, wherein the focal plane extends from a focal point of the lens and is perpendicular to an optical axis of the lens. The heat sink is arranged along the optical axis of the lens, and a distance between the heat sink and the lens is greater than a distance between the focal point and the lens. The at least one LED module is arranged along the optical axis of the lens and in contact with the heat sink, a distance between the LED module and the lens is greater than the distance between the focal point and the lens. The shelter is arranged along the focal plane and configured to block light emitted from the LED module.

Abstract: A near field communication module applied to an electronic device is provided. The near field communication module includes a flexible circuit board, a first sensing antenna and a second sensing antenna. The flexible circuit board includes a first part and a second part connected with each other. The first sensing antenna is disposed at the first part. The second sensing antenna is disposed at the second part. The first sensing antenna is connected to the second sensing antenna. After the flexible circuit board is bended, it is disposed at a side of the electronic device.

Abstract: Among other things, one or more image sensors and techniques for forming such image sensors are provided. An image sensor comprises a photodiode array configured to detect light. The image sensor comprises a calibration region configured to detect a color level for image reproduction, such as a black calibration region configured to detect a black level for an image detected by the photodiode array. The image sensor comprises a dielectric film that is formed over the photodiode array and the calibration region. The dielectric film is configured to balance stress between the photodiode and the calibration region in order to improve accuracy of the calibration region.

Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

Abstract: A molding package assembly is provided, which includes a substrate and first and second molding packages stacked on the substrate. Each of the first and second molding packages has a semiconductor element, an anti-warping structure disposed around a periphery of the semiconductor element, a molding material encapsulating the semiconductor element and the anti-warping structure, and a protection layer formed on the semiconductor element, the molding material and the anti-warping structure. The anti-warping structure facilitates to prevent warping of the molding package assembly during a molding process.

Abstract: An LED vehicle headlight includes a lens, a reflector, a first light source, and a second light source. The lens has a focal plane. The reflector is located at a side of the lens, and the reflector is equipped with a first focal point and a second focal point, wherein the second focal point is located on the focal plane. The first light source has a first light-emitting surface confronting the lens. The second light source has a second light-emitting surface confronting the reflector. The first focal point is located on the second light-emitting surface, and the reflector is configured to reflect and focus light beams emitted from the second light-emitting surface onto the second focal point.

Abstract: A method for decoding low-density parity check (LDPC) codes, includes computing an initial syndrome of an initial output, obtaining an initial number of unsatisfied checks based on the computed initial syndrome, and when the initial number of unsatisfied checks is greater than zero, computing a reliability value with a parity check, performing a bit flip operation, computing a subsequent syndrome of a subsequent output, and ending decoding when a number of unsatisfied checks obtained based on the computed subsequent syndrome is equal to zero.

Abstract: A fixture for welding fabrication of a golf club head features a golf club head's hitting surface facing up and placed on a platform for a welding process so that a reverse side opposite to the welded hitting surface of the golf club head is held in a V-shaped groove on a fifth clamping part and the golf club head's peripheral surface contacts a first clamping part and a second clamping part; the golf club head can be held among the first clamping part, the second clamping part, a third clamping part driven by a first stroke unit to move toward the first clamping part, and a fourth clamping part driven by a second stroke unit to move toward the second clamping part; the hitting surface can be welded because of the golf club head free from movement toward the reverse side, which is opposite to the welded hitting surface, by means of the fifth clamping part.

Abstract: A signal transmission board includes a substrate, a conductive via, a cavity and a connecting hole. The substrate has a first external surface and a second external surface. The conductive via penetrating through the substrate has a first end and a second end. The first end is disposed on the first external surface, and the second end is disposed on the second external surface. The cavity is disposed in the substrate and penetrated by the conductive via. The connecting hole disposed on the substrate has a third end and a fourth end. The third end is disposed on the first external surface, and the fourth end communicates with the cavity.

Abstract: A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.