Patents by Inventor Mitsuo Ishii

Mitsuo Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10649147
    Abstract: An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: May 12, 2020
    Assignees: NTT ELECTRONICS CORPORATION, NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Tomohiro Nakanishi, Teruaki Sato, Motohaya Ishii, Satoru Konno, Yuichi Suzuki, Shigeo Nagashima, Shinji Mino, Shuichiro Asakawa, Hiroshi Fukuda, Shin Kamei, Shunichi Soma, Ken Tsuzuki, Mitsuo Usui, Takashi Saida
  • Publication number: 20190353844
    Abstract: An optical module which is connectable to an optical fiber array and which can be packaged in a high density. Two 30 mm square package modules are mounted on a board, and optical waveguides in a 20 mm square Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block (15×10 mm). Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. In the embodiment, the optical waveguides in the Si photonic lightwave circuit are tilted at an appropriate angle, for example, 20 degrees with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted at 20 degrees with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 21, 2019
    Inventors: Tomohiro Nakanishi, Teruaki Sato, Motohaya Ishii, Satoru Konno, Yuichi Suzuki, Shigeo Nagashima, Shinji Mino, Shuichiro Asakawa, Hiroshi Fukuda, Shin Kamei, Shunichi Soma, Ken Tsuzuki, Mitsuo Usui, Takashi Saida
  • Patent number: 10353024
    Abstract: A magnetic resonance imaging apparatus according to an embodiment includes a plurality of first coil elements and a connector. The first coil elements are embedded in a couchtop on which a subject is placed. The connector is provided in such a region of the couchtop that is positioned on the inside of the loop of at least one of the first coil elements. It is possible to attach and detach a second coil element different from the first coil elements to and from the connector.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: July 16, 2019
    Assignee: Toshiba Medical Systems Corporation
    Inventors: Sadanori Tomiha, Kazuya Okamoto, Manabu Ishii, Satoshi Imai, Mitsuo Takagi, Miyuki Ota
  • Patent number: D723398
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: March 3, 2015
    Assignee: Kabushiki Kaisha Topcon
    Inventor: Mitsuo Ishii
  • Patent number: D723953
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: March 10, 2015
    Assignee: Kabushiki Kaisha Topcon
    Inventor: Mitsuo Ishii
  • Patent number: D766753
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: September 20, 2016
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventors: Mitsuo Ishii, Takeo Aoki
  • Patent number: D766755
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: September 20, 2016
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventors: Mitsuo Ishii, Takashi Shishido
  • Patent number: D777588
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: January 31, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventors: Takeo Aoki, Mitsuo Ishii
  • Patent number: D778745
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: February 14, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventor: Mitsuo Ishii
  • Patent number: D781730
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: March 21, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventors: Mitsuo Ishii, Satoshi Nakamura
  • Patent number: D781731
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: March 21, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventors: Mitsuo Ishii, Satoshi Nakamura
  • Patent number: D783426
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: April 11, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventor: Mitsuo Ishii
  • Patent number: D783427
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: April 11, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventor: Mitsuo Ishii
  • Patent number: D787345
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: May 23, 2017
    Assignee: KABUSHIKI KAISHA TOPCON
    Inventor: Mitsuo Ishii
  • Patent number: D795720
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: August 29, 2017
    Assignee: TOPCON CORPORATION
    Inventors: Mitsuo Ishii, Kazuhiro Morita
  • Patent number: D795721
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: August 29, 2017
    Assignee: TOPCON CORPORATION
    Inventor: Mitsuo Ishii
  • Patent number: D834968
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: December 4, 2018
    Assignee: TOPCON CORPORATION
    Inventor: Mitsuo Ishii
  • Patent number: D834969
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: December 4, 2018
    Assignee: TOPCON CORPORATION
    Inventor: Mitsuo Ishii
  • Patent number: D835532
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: December 11, 2018
    Inventor: Mitsuo Ishii
  • Patent number: D859185
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: September 10, 2019
    Inventor: Mitsuo Ishii