Abstract: A disadvantage is reduced in which a front panel of an optical disc unit tilts by a clearance (rattle) between the components and contacts with a body of a PC incorporating the unit to cause malfunction of insertion and ejection of discs. A disc tray is provided to move relative to rail guides attached to a bottom case of the optical disc unit via rails. The disc tray and rail guides have projection portions to contact with each other with stress. As a result, the clearance is reduced and the disadvantage due to the malfunction is reduced. The contact of the projection portions is close to point contact. The number of the contact positions is three or four. Support portions are provided to the rail guides to generate the stress.

Abstract: A disc drive apparatus comprises: a spindle motor 20 for hold a disc 2 and for rotate it; an optical head 7 for conducting either one of recording or reproducing of information onto/from the disc; a driver unit for moving the optical head in a radial direction of the disc; and a unit mechanism chassis 8 for supporting those thereon, fixedly, wherein the spindle motor is constructed with a rotational drive means made of a magnetic circuit, a rotor portion and a rotation shaft, which define a rotation body, and a spindle motor attachment plate to hold those thereon, and the spindle motor attachment plate has a semi-circular shaped plate configuration in a part thereof, nearly fitting to an outer diameter the rotor portion, in a direction where the optical head is provided, and has a step-like structure in thickness direction of the plate thereof, within a semi-circular shaped region with respect to a line connecting between corner portions on both ends of that semi-circular shape, and also bridging over that li

Abstract: Each pixel of a solid state imaging device comprises: a first semiconductor layer; a second semiconductor layer; a third semiconductor layer and fourth semiconductor layer formed on the lateral side of the upper region of the second layer not to be in contact with the top surface of the second semiconductor layer; a gate conductor layer formed on the lower side of the second semiconductor layer; a conductor electrode formed on the side of the fourth semiconductor layer via an insulating film; and a fifth semiconductor layer formed on the top surface of the second semiconductor layer, wherein at least the third semiconductor layer, upper region of the second semiconductor layer, fourth semiconductor layer, and fifth semiconductor layer are formed in the shape of an island. A specific voltage is applied to the conductor electrode to accumulate holes in the surface region of the fourth semiconductor layer.

Abstract: A method for producing a semiconductor device includes a step of forming a conductor layer and a first semiconductor layer containing a donor impurity or an acceptor impurity on a first semiconductor substrate; a step of forming a second insulating layer so as to cover the first semiconductor layer; a step of thinning the first semiconductor substrate to a predetermined thickness; a step of forming, from the first semiconductor substrate, a pillar-shaped semiconductor having a pillar-shaped structure on the first semiconductor layer; a step of forming a first semiconductor region in the pillar-shaped semiconductor by diffusing the impurity from the first semiconductor layer; and a step of forming a pixel of a solid-state imaging device with the pillar-shaped semiconductor into which the impurity has been diffused.

Abstract: An optical disc apparatus, presenting recording quality without degradation by an extreme temperature rise in an objective-lens drive mechanism in an optical pickup, includes a mechanical chassis on which a disc rotation mechanism, an optical pickup, and a transfer mechanism are mounted, a decorative plate that is a plate-shaped member located between the disc and the optical pickup and fixed on the mechanical chassis, a disc tray for loading and removing the disc, a circuit board for operation control, and an apparatus housing containing the components. A recess is formed in an indented shape in a portion of the mechanical chassis facing an outer peripheral region of the disc recording surface. An incline is formed in a position close to an opening of the disc tray for mounting the mechanical chassis and opposite the outer peripheral region of the disc recording surface, and slopes gently down to the recess.

Abstract: A pixel includes at least first to fourth semiconductor tiers. The first semiconductor tier includes a first semiconductor region that is electrically connected to a first external circuit, a second semiconductor region, and a third semiconductor region that is isolated from the first semiconductor region by the second semiconductor region and that is electrically connected to a second external circuit. The second semiconductor tier includes a MOS transistor that has insulating films and gate conductive electrodes that are electrically connected to a third external circuit. The third semiconductor tier includes a photodiode formed of the second and fourth semiconductor regions. A junction transistor is formed in which the fourth semiconductor region serves as a gate and in which one of the first and fifth semiconductor regions serves as a drain and the other serves as a source.

Abstract: A method for producing a semiconductor device includes the steps of forming first and second pillar-shaped semiconductors on a substrate at the same time so as to have the same height; forming a first semiconductor layer by doping a bottom region of the first pillar-shaped semiconductor with a donor or acceptor impurity to connect the first semiconductor layer to the second pillar-shaped semiconductor; forming a circuit element including an upper semiconductor region formed by doping an upper region of the first pillar-shaped semiconductor with a donor or acceptor impurity; forming a first conductor layer in the second pillar-shaped semiconductor; forming first and second contact holes that are respectively connected to the first and second pillar-shaped semiconductors; and forming a wiring metal layer that is connected to the upper semiconductor region and the first conductor layer through the first and second contact holes, respectively.

Abstract: In a solid-state imaging device, a pixel has a first island-shaped semiconductor (P11) formed on a substrate (1) and a drive output circuit has second island-shaped semiconductors (4a to 4c) formed on the substrate at the same height as that of the first island-shaped semiconductor (P11). The first island-shaped semiconductor (P11) has a first gate insulating layer (6b) formed on an outer periphery thereof and a first gate conductor layer (105a) surrounding the first gate insulating layer (6b). The second island-shaped semiconductors (4a to 4c) have a second gate insulating layer (6a) formed on an outer periphery thereof and a second gate conductor layer (7a) surrounding the second gate insulating layer (6a). The first gate conductor layer (105a) and the second gate conductor layer (7a) have bottom portions located on the same plane.

Abstract: An island-shaped semiconductor constituting a pixel includes a first semiconductor N+-region formed on a substrate, a second semiconductor P-region formed on the region, third semiconductor N-regions formed on upper lateral sides of the region, insulating layers formed on the outer periphery of the regions and lower lateral sides of the region, gate conductive layers formed on the outer periphery of the insulating layers and functioning as gate electrodes forming a channel in a lower area of the region, light-reflection conductive layers formed on the outer periphery of the N regions and a portion of the insulating layers where the gate conductive layers are not formed, a fifth semiconductor P+-region formed on the region and the regions, and a microlens formed on the region and whose focal point is located near the upper surface of the region.

Abstract: A method for producing a semiconductor device includes a step of forming a conductor layer and a first semiconductor layer containing a donor impurity or an acceptor impurity on a first semiconductor substrate; a step of forming a second insulating layer so as to cover the first semiconductor layer; a step of thinning the first semiconductor substrate to a predetermined thickness; a step of forming, from the first semiconductor substrate, a pillar-shaped semiconductor having a pillar-shaped structure on the first semiconductor layer; a step of forming a first semiconductor region in the pillar-shaped semiconductor by diffusing the impurity from the first semiconductor layer; and a step of forming a pixel of a solid-state imaging device with the pillar-shaped semiconductor into which the impurity has been diffused.

Abstract: There are provided a disk motor arranged on a chassis, an optical pickup that performs recording and reproducing of a signal from an information recorded surface of an optical disk, a pair of guide shafts arranged on the optical pickup to guide the optical pickup radially of the optical disk, adjustment screw that move at least one ends of the guide shafts in a direction substantially perpendicular to a surface of the chassis, a leaf spring arranged on a frame body to bias the one end of the guide shaft toward the surface of the chassis, and the leaf spring includes a support surface that supports the one end of the guide shaft, and a stopper portion projecting from the support surface to define a clearance between the support surface and the surface of the chassis.

Abstract: The present application relates to an optical disc apparatus for carrying out at least one of recording and reproduction of signals onto or from a data recording surface of an optical disc loaded in the optical disc apparatus. The optical disc apparatus is capable of being thinned and lightened while ensuring a mechanical strength and a stiffness, and also capable of restraining sticking of a flexible printed circuit (FPC) connected to the optical pickup and reducing the sliding resistance of the FPC during movement of the optical pickup.

Abstract: An island-shaped semiconductor constituting a pixel includes a first semiconductor N+-region formed on a substrate, a second semiconductor P-region formed on the region, third semiconductor N-regions formed on upper lateral sides of the region, insulating layers formed on the outer periphery of the regions and lower lateral sides of the region, gate conductive layers formed on the outer periphery of the insulating layers and functioning as gate electrodes forming a channel in a lower area of the region, light-reflection conductive layers formed on the outer periphery of the N regions and a portion of the insulating layers where the gate conductive layers are not formed, a fifth semiconductor P+-region formed on the region and the regions, and a microlens formed on the region and whose focal point is located near the upper surface of the region.

Abstract: In a prior art slim-type high speed rotation optical disk apparatus, the side wall of the bottom chassis is bent at a bending point toward the side of the optical disk according to the configuration of the corner air window section of the chassis. According to the present invention, this bent side wall is formed so as to have a first vertical wall which is adjacent to the bending point and a second vertical wall which is adjacent to and lower than the first vertical wall. This constitutes an L-shaped vertical wall in the air window section of the bottom chassis, resulting in reduced noise.

Abstract: For the purpose of suppressing an increase of temperature of a laser element, in an optical disc drive, even in case when recording/reproducing at such a low double speed that almost no expectation can be made upon the effect of the convection cooling due to circulating flow of an air, which is generated by rotation of a disc, and in particular, the structure for fixing both end portions of a main shaft, which is engaged with a transfer mechanism for moving an optical pickup into the disc radial direction, through the optical pickup, between two (2) pieces of shafts for supporting the optical pickup, one of which forms the main shaft, onto connector portions to be engaged with the both end portions of the main shaft, upon a mechanical chassis, on which is mounted at least a disc rotation mechanism, etc.

Abstract: A pixel includes at least first to fourth semiconductor tiers. The first semiconductor tier includes a first semiconductor region that is electrically connected to a first external circuit, a second semiconductor region, and a third semiconductor region that is isolated from the first semiconductor region by the second semiconductor region and that is electrically connected to a second external circuit. The second semiconductor tier includes a MOS transistor that has insulating films and gate conductive electrodes that are electrically connected to a third external circuit. The third semiconductor tier includes a photodiode formed of the second and fourth semiconductor regions. A junction transistor is formed in which the fourth semiconductor region serves as a gate and in which one of the first and fifth semiconductor regions serves as a drain and the other serves as a source.

Abstract: Disclosed is a slim-type high speed rotation optical disk apparatus having a turn table for loading an optical disk thereon. As compared with conventional ones, a brake pad is located near to the front end so that the brake pad comes into tight contact with a side of the tray's front portion when the tray is inserted. This reduces the noise and vibration of the optical disk apparatus.

Abstract: Each pixel of a solid state imaging device comprises: a first semiconductor layer; a second semiconductor layer; a third semiconductor layer and fourth semiconductor layer formed on the lateral side of the upper region of the second layer not to be in contact with the top surface of the second semiconductor layer; a gate conductor layer formed on the lower side of the second semiconductor layer; a conductor electrode formed on the side of the fourth semiconductor layer via an insulating film; and a fifth semiconductor layer formed on the top surface of the second semiconductor layer, wherein at least the third semiconductor layer, upper region of the second semiconductor layer, fourth semiconductor layer, and fifth semiconductor layer are formed in the shape of an island. A specific voltage is applied to the conductor electrode to accumulate holes in the surface region of the fourth semiconductor layer.

Abstract: Each pixel of a solid state imaging device comprises a first semiconductor layer formed on a substrate, having a first-conductive type; a second semiconductor layer formed thereon, having a second-conductivity type; a third semiconductor layer formed in the upper side of the second semiconductor layer, having the first-conductivity type; a fourth semiconductor layer formed in the outer side of the third semiconductor layer, having the second-conductivity type; a gate conductor layer formed on the lower side of the second semiconductor layer via an insulating film; and a fifth semiconductor layer formed on the top surfaces of the second semiconductor layer and third semiconductor layer, having the second-conductivity type, wherein the fifth semiconductor layer and fourth semiconductor layer are connected to each other, and at least the third semiconductor layer, upper region of the second semiconductor layer, fourth semiconductor layer, and fifth semiconductor layer are formed in an island.

Abstract: In an optical disc drive, a degradation of traveling performance of an optical pickup under hard acceleration or hard deceleration in a random access operation or the like results in a degradation of recording/reproducing performance. Groove structure is provided between two gears of a guide feed provided in an optical pickup, and the groove forms bending structure. Thus, the engagement state between a screw gear and the gears of the guide feed is stabilized. This makes it possible to prevent tooth jumping and step-out from occurring in the gears during the traveling of the optical pickup, achieving stable traveling. In consequence, the recoding/reproducing performance of the optical disc drive can be improved.