Abstract: A system for supplying power transcutaneously to an implantable device implanted within a subject is provided. The system includes an external connector including one of a microneedle array and a microwire holder. The system further includes a power cable electrically coupled to the external connector and configured to supply power to the one of the microneedle array and the microwire holder, and an internal connector configured to be implanted within the subject and electrically coupled to the implantable device, the internal connector including the other of the microneedle array and the microwire holder. The microneedle array includes a plurality of electrically conductive microneedles, the microwire holder includes a plurality of electrical contacts, and the microwire holder is configured to engage the microneedle array such that the plurality of electrically conductive microneedles extend through the skin of the subject and electrically couple to the plurality of electrical contacts.

Abstract: A system is described for automatically calibrating a display device based at least on information relating to a user of the display device. The system obtains visual acuity information or pupillary information of the user. The system then determines a value of a display parameter of the display device based at least on the visual acuity information or the pupillary information of the user. The determined value is then provided for application to the display device. Other information may also be used in determining the value of the display parameter, such as user input, demographic information of the user, display device specific information, user environment information, displayed content information, or application context information. An algorithm may be used that determines the display parameter based on such information. The algorithm may comprise a model obtained through machine learning.

Abstract: Controllers and methods for heart treatments are disclosed herein. The controller can include a communication module that can send and receive data from heart therapy devices. The controller can include memory including stored instruction. The controller can include a processor. The processor can receive a signal of an impending electrical treatment at a processor. The processor can determine a current operating parameter of a blood pump communicatingly coupled with the processor. The processor can determine an adjustment to the operating parameter of the blood pump to affect an impedance of heart tissue to be affected by the impending electrical treatment. The processor can control the blood pump according to the adjustment to the operating parameter of the blood pump.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

Abstract: Various molded semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a routing substrate and a semiconductor chip mounted on and electrically connected to the routing substrate. The semiconductor chip has plural side surfaces. A molding layer at least partially encases the semiconductor chip. The molding layer has a tread and a riser, the riser abutting at least some of the side surfaces.

Abstract: Presented herein are techniques that automate data replication in a cluster by defining and managing logical availability zones. Nodes belonging to a same logical availability zone may be brought down together without impacting data availability. Thus, logical availability zones enable easier data management for events such as when nodes must be brought offline for troubleshooting or upgrading, while also providing resiliency against regional outages. Further, present embodiments define logical availability zones and assign nodes to zones in a manner that reduces the amount of data movement that is necessary, thereby requiring fewer computational resources.

Abstract: Detecting patterns and sequences associated with an anomaly in predictions made a predictive system. The predictive system makes predictions by learning spatial patterns and temporal sequences in an input data that change over time. As the input data is received, the predictive system generates a series of predictions based on the input data. Each prediction is compared with corresponding actual value or state. If the prediction does not match or deviates significantly from the actual value or state, an anomaly is identified for further analysis. A corresponding state or a series of states of the predictive system before or at the time of prediction are associated with the anomaly and stored. The anomaly can be detected by monitoring whether the predictive system is placed in the state or states that is the same or similar to the stored state or states.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: In an embodiment, a computer-implemented method comprises, in response to receiving lead data identifying an entity associated with a health care claim relating to suspected fraud, determining one or more data sources that were used to identify the entity or the suspected fraud; determining a subset of a plurality of data display elements, based on the determined one or more data sources, wherein each of the plurality of data display elements is configured to cause displaying health care claims data associated with the entity in a designated format; automatically obtaining, from a data repository, specific health care claims data associated with the entity for each of the plurality of data display elements in the subset; generating a lead summary report associated with the entity using a report template, the subset, and the obtained specific health care claims data.

Abstract: Various semiconductor chip devices and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that has a reconstituted semiconductor chip package that includes an interposer that has a first side and a second and opposite side and a metallization stack on the first side, a first semiconductor chip on the metallization stack and at least partially encased by a dielectric layer on the metallization stack, and plural semiconductor chips positioned over and at least partially laterally overlapping the first semiconductor chip.

Abstract: A data processor is implemented as an integrated circuit. The data processor includes a processor die. The processor die is connected to an integrated voltage regulator die using die-to-die bonding. The integrated voltage regulator die provides a regulated voltage to the processor die, and the processor die operates in response to the regulated voltage.

Abstract: Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

Abstract: Various multi-die arrangements and methods of manufacturing the same are disclosed. In some embodiments, a method of manufacture includes a face-to-face process in which a first GPU chiplet and a second GPU chiplet are bonded to a temporary carrier wafer. A face surface of an active bridge chiplet is bonded to a face surface of the first and second GPU chiplets before mounting the GPU chiplets to a carrier substrate. In other embodiments, a method of manufacture includes a face-to-back process in which a face surface of an active bridge chiplet is bonded to a back surface of the first and second GPU chiplets.

Abstract: Systems, apparatuses, and methods for routing traffic through vertically stacked semiconductor dies are disclosed. A first semiconductor die has a second die stacked vertically on top of it in a three-dimensional integrated circuit. The first die includes a through silicon via (TSV) interconnect that does not traverse the first die. The first die includes one or more metal layers above the TSV, which connect to a bonding pad interface through a bonding pad via. If the signals transferred through the TSV of the first die are shared by the second die, then the second die includes a TSV aligned with the bonding pad interface of the first die. If these signals are not shared by the second die, then the second die includes an insulated portion of a wafer backside aligned with the bonding pad interface.

Abstract: An integrated circuit product includes a redistribution layer, an integrated circuit die disposed above the redistribution layer, a row of discrete devices disposed laterally with respect to the integrated circuit die, and encapsulant mechanically coupling the redistribution layer, integrated circuit die, and the row of discrete devices. In at least one embodiment, the row of discrete devices is a row of decoupling capacitors disposed proximate to the integrated circuit die and coupled to the integrated circuit die and a power distribution network. In at least one embodiment, a second integrated circuit die is disposed above the redistribution layer and disposed laterally with respect to the integrated circuit die and the row of discrete devices. The second integrated circuit die is mechanically coupled to the redistribution layer, integrated circuit die, and the row of discrete devices and is partially surrounded by the row of discrete devices.

Abstract: A sensor data forecasting system for urban environment using deep learning model is provided.

Abstract: A model management system provides a centralized repository for storing and accessing models. The model management system receives an input to store a model object in a first model state generated based on a first set of known variables. The model management system generates a first file including a first set of functions defining the first model state and associates the first file with a model key identifying the model object. The model management system receives an input to store the model object in a second model state having been generated based on the first model state and a second set of known variables. The model management system generates a second file including a second set of functions defining the second model state and associates the second file with the model key. The model management system identifies available versions of the model object based on the model key.