Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.

Abstract: Some embodiments provide a method for a network controller that manages a logical network spanning multiple physical locations. For each physical location hosting data compute nodes (DCNs) belonging to the logical network, the method defines a centralized routing component for processing data messages between the DCNs hosted at the physical location and networks external to the logical network, assigns an active instance of the centralized routing component to operate at the physical location, and assigns a standby instance of the centralized routing component to operate at one of the other physical locations.

Abstract: Techniques for accelerating compaction include compaction accelerator. The compaction accelerator includes a compactor separate from a processor performing read and write operations for a database or a data store. The compactor includes a plurality of compaction resources. The compactor is configured to receive a compaction request and data to be compacted, compact the data via a compaction pipeline to generate compacted data, and forward the compacted data to the processor, the database, or the data store. The compaction pipeline has a first portion of the plurality of compaction resources.

Abstract: An adapter and adapter system for coupling a female end of a first chimney portion to a male end of a second chimney portion. The adapter includes a first radial adapter portion, wherein a first inner surface and a first outer surface of the first radial adapter portion are coaxial. The adapter further includes a first locking interface protruding outward from the first outer surface and configured to engage with a first locking interface of the first chimney portion. The adapter further includes a second radial adapter portion with a second inner surface and a second outer surface extending along the first axis and a second locking interface protruding inward from the second inner surface and configured to engage with a second interlocking interface of the second chimney.

Abstract: A software upgrade to be deployed by a cloud extension agent is received by a remote network management platform, the cloud extension agent running locally on a network and initiating an outbound connection to the remote network management platform through a firewall of the network. A command is generated for the software upgrade, the command comprising an identification of a source of the software upgrade. The command is provided to the cloud extension agent, wherein providing the command causes the cloud extension agent to acquire the software upgrade from the identified source and deploy the software upgrade.

Abstract: A first cloud extension agent that facilitates internet-based management of a first set of local computing resources of a network is provided by a remote network management platform. A first connection is established to the first cloud extension agent. A second cloud extension agent that facilitates internet-based management of a second set of local computing resources of a network is provided by the remote network management platform. A second connection is established to the second cloud extension agent. A first set of instructions is provided to the first cloud extension via the first connection and a second set of instructions is provided to the second cloud extension via the second connection.

Abstract: A method of monitoring status information of devices is described. The method includes establishing a first connection to a hardware resource executing a cloud extension agent on a local network, over a wide area network external from the local network and separated by at least one firewall, using a standard internet protocol. The method further includes sending, via the first connection, a first set of instructions to manage a first set of mobile devices by one or more local servers on the local network; and receiving status information via the secure network connection, wherein the status information is from the one or more local servers on the local network associated with a plurality of devices that access the one or more local servers.

Abstract: An adapter and adapter system for connecting a female end of a first chimney portion to a male end of a second chimney portion. The adapter includes a first radial adapter portion with a first inner surface and a first outer surface extending along a first axis and wherein the first inner surface and the first outer surface are substantially coaxial. The adapter further includes a first locking interface protruding outward from the first outer surface and configured to engage with a first locking interface of the first chimney portion and a second locking interface protruding inward from the first inner surface and configured to engage with a second interlocking interface of the second chimney. The first outer surface of the adapter is configured to be received within the female end of the first chimney portion and the inner surface is configured to receive the male end of the second chimney.

Abstract: Aspects of the present disclosure include a damper control system having a casing configured to detachably couple from a conventional air register having a damper assembly movably controllable by a manual lever, a motor assembly mounted to the casing, an actuating linkage assembly movably attached to the motor assembly and configured to detachably couple with the manual lever that controls the damper assembly, wherein one or more dampers of the damper assembly are in a closed position when the actuating linkage assembly is in a first position and in an open position when the actuating linkage assembly is in a second position, a memory mounted within the casing, and one or more processors communicatively coupled with the memory and mounted within the casing, the one or more processors being configured to cause the motor assembly to drive the actuating linkage assembly between the first position and the second position.

Abstract: A system is disclosed that includes a memory and a processor configured to perform operations stored in the memory. The processor performs the operations to select a master clock for a plurality of clocks in a design logic circuit. The processor further performs the operations to align a clock edge of a clock of the plurality of clocks with a corresponding nearest clock transition of the master clock. The aligned clock edge of the clock limits a number of emulation cycles for the design logic to a fixed number of emulation cycles required for the master clock The processor further performs the operation to determine a clock period for measuring power required for the design logic circuit and estimate, at the aligned clock edge, the power required for the design logic circuit corresponding to the determined clock period, which corresponds to a clock selected from the plurality of clocks and the master clock.

Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.

Abstract: A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.

Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

Abstract: Example methods are provided a network device to perform service insertion in a public cloud environment that includes a first virtual network and a second virtual network. In one example method, in response to receiving a first encapsulated packet from a first virtualized computing instance located in the first virtual network, the network device may generate a decapsulated packet by performing decapsulation to remove, from the first encapsulated packet. The method may also comprise identifying a service path specified by a service insertion rule, and sending the decapsulated packet to the service path to cause the service path to process the decapsulated packet according to one or more services. The method may further comprise: in response to the network device receiving the decapsulated packet processed by the service path, sending the decapsulated packet, or generating and sending a second encapsulated packet, towards a destination address.

Abstract: Example methods and systems are provided a network device to perform tunnel-based service insertion in a public cloud environment. An example method may comprise establishing a tunnel between the network device and a service path. The method may also comprise: in response to receiving a first encapsulated packet, identifying the service path specified by a service insertion rule; generating and sending a second encapsulated packet over the tunnel to cause the service path to process an inner packet according to one or more services. The method may further comprise: in response to receiving, from the service path via the tunnel, a third encapsulated packet that includes the inner packet processed by the service path, sending the inner packet processed by the service path, or a fourth encapsulated packet, towards a destination address of the inner packet.

Abstract: In one aspect, a computerized method of automated solution for periodic journey planning comprising includes the step of creating a set of salesbeats using a set of outlet data and a set of customer level data. The method includes the step of allocating each of the salesbeats to one or more sales executives. A salesbeat includes a plan that defines who to visit; when to visit; an identity of a sales executives to send and a day level route plan made for field sales/marketing personnel to make visits to a number of stores at a predefined frequency. The method includes the step of allocating the sales executives are allocated to a specified set of days. The method includes the step of implements sequencing of outlets within the salesbeats established using a capacitated vehicle routing problem (CVRP) algorithm such that a distance traveled and a time window of the salesbeat is optimized for the sales executives.

Abstract: This document discusses, among other things, a waveguide including a first metal having an outer surface proximate a dielectric material and an inner surface defining a path of the waveguide, a method of receiving an optical signal at the inner surface of the waveguide and transmitting the optical signal along at least a portion of the path of the waveguide. A method of integrating a waveguide in a substrate includes depositing sacrificial metal on a first surface of a carrier substrate to form a core of the waveguide, depositing a first metal over the sacrificial metal and at least a portion of the first surface of the carrier substrate, forming an outer surface of the waveguide and a conductor separate from the sacrificial metal, and depositing dielectric material over the first surface of the carrier substrate about the conductor.

Abstract: Systems, methods, and computing platforms for context identifier allocation for data packet header compression are provided. Exemplary implementations may: obtain a first packet of a stream to be sent using a header compression protocol; determine a context identifier (CID) to associate with the stream based, at least in part, on a packet type of the first packet; generate a compressed header for the first packet according to the header compression protocol and based on the determined CID; and transmit the first packet with the compressed header.