Abstract: Systems and methods are disclosed for fabricating a semiconductor light-emitting diode (LED) device by forming an n-doped gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.

Abstract: The present invention is related to methods and apparatus that allow a chalcogenide glass such as germanium selenide (GexSe1-x) to be doped with a metal such as silver, copper, or zinc without utilizing an ultraviolet (UV) photodoping step to dope the chalcogenide glass with the metal. The chalcogenide glass doped with the metal can be used to store data in a memory device. Advantageously, the systems and methods co-sputter the metal and the chalcogenide glass and allow for relatively precise and efficient control of a constituent ratio between the doping metal and the chalcogenide glass. Further advantageously, the systems and methods enable the doping of the chalcogenide glass with a relatively high degree of uniformity over the depth of the formed layer of chalcogenide glass and the metal. Also, the systems and methods allow a metal concentration to be varied in a controlled manner along the thin film depth.

Abstract: Several aspects of an in-line welding gun are disclosed. In one aspect, the welding gun has a variable profile insulating boot disposed over the torch barrel of the gun. The variable profile insulating boot may include a molded material having varying thickness to provide the desired insulating properties. In another aspect of the welding gun, a speed control mechanism for the motor driving the wire feed assembly is positioned in a recess in the housing such that it reduces the risk of being unintentionally adjusted during operation of the welding gun. In another aspect of the welding gun, the wire feed mechanism features a feeder roller and an idler roller that may be separated without opening the housing of the welding gun. To separate the rollers, the user may depress a portion on the exterior of the housing to press on a pivotable lever on which the idler roller is disposed.

Abstract: Techniques for attaching a retaining ring to a carrier head so that the bottom surface of the retaining ring is orthogonal to a central rotational axis of the carrier head are described.

Abstract: The present disclosure describes apparatus and methods for processing microfeature workpieces, e.g., by depositing material on a microelectronic semiconductor using atomic layer deposition. Some of these apparatus include microfeature workpiece holders that include gas distributors. One exemplary implementation provides a microfeature workpiece holder adapted to hold a plurality of microfeature workpieces. This workpiece holder includes a plurality of workpiece supports and a gas distributor. The workpiece supports are adapted to support a plurality of microfeature workpieces in a spaced-apart relationship to define a process space adjacent a surface of each microfeature workpiece. The gas distributor includes an inlet and a plurality of outlets, with each of the outlets positioned to direct a flow of process gas into one of the process spaces.

Abstract: Method, apparatus and system embodiments to schedule user-level OS-independent “shreds” without intervention of an operating system. For at least one embodiment, the shred is scheduled for execution by a scheduler routine rather than the operating system. The scheduler routine may receive compiler-generated hints from a compiler. The compiler hints may be generated by the compiler without user-provided pragmas, and may be passed to the scheduler routine via an API-like interface. The interface may include a scheduling hint data structure that is maintained by the compiler. Other embodiments are also described and claimed.

Abstract: An improved method of forming a semiconductor device structure is disclosed, comprising insertion of a semiconductor wafer into a high-pressure heated chamber and the deposition of a low melting-point aluminum material into a contact hole or via and over an insulating layer overlying a substrate of the wafer. The wafer is heated up to the melting point of the aluminum material and the chamber is pressurized to force the aluminum material into the contact holes or vias and eliminate voids present therein. A second layer of material, comprising a different metal or alloy, which is used as a dopant source, is deposited over an outer surface of the deposited aluminum material layer and allowed to diffuse into the aluminum material layer in order to form a homogenous aluminum alloy within the contact hole or via. A semiconductor device structure made according to the method is also disclosed.

Abstract: The invention includes a method for treating a plurality of discrete semiconductor substrates. The discrete semiconductor substrates are placed within a reactor chamber. While the substrates are within the chamber, they are simultaneously exposed to one or more of H, F and Cl to remove native oxide. After removing the native oxide, the substrates are simultaneously exposed to a first reactive material to form a first mass across at least some exposed surfaces of the substrates. The first reactive material is removed from the reaction chamber, and subsequently the substrates are exposed to a second reactive material to convert the first mass to a second mass. The invention also includes apparatuses which can be utilized for simultaneous ALD treatment of a plurality of discrete semiconductor substrates.

Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

Abstract: A method for depositing a rough polysilicon film on a substrate is disclosed. The method includes introducing the reactant gases argon and silane into a deposition chamber and enabling and disabling a plasma at various times during the deposition process.

Abstract: A process chamber component comprises a first surface, which in use is exposed to an energized gas in the chamber, the first surface comprising a parylene coating, and second surface, which in use is not exposed to the energized gas. The interior surfaces of a process chamber can be coated, in situ, with the polymer coating. A portable fixture can be used to form the polymer coating in the process chamber. A previously coated chamber component can also be refurbished by stripping the polymer with ozone and/or oxygen and recoating with a polymer.

Abstract: A user agent residing within a remote client and configured to enforce message protocol policy is disclosed. The user agent includes a communication monitoring element and a communication controller element. The communications monitoring element is configured to examine a communications connection between the remote client and an external message server to determine if the external message server matches a restricted server attribute. The communications controller element is configured to work in conjunction with the communications monitoring element to block communications between the remote client and the external message server when the external message server matches a restricted server attribute unless the communications between the remote client and the external message server are monitored by a protocol inspection gateway.

Abstract: A computer implemented method, system, and computer usable program code for correcting a received electronic mail having an erroneous header. Responsive to a recipient receiving an e-mail indicating the erroneous header, the recipient corrects the erroneous header to form a corrected header. Responsive to the recipient correcting the erroneous header to form the corrected header, a received e-mail is updated for other recipients and a sender of the received e-mail with the corrected header.

Abstract: A computer implemented method, system, and computer usable program code for correcting information in a received electronic mail. Responsive to a correction of information in the received e-mail by a recipient of the received e-mail, a correction note is generated that contains the correction. The correction note is sent to any other recipients and a sender of the received e-mail, wherein the correction note is used by a correcting user agent to correct information in the received e-mail for the any other recipients and the sender of the received e-mail.

Abstract: Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.

Abstract: The present invention relates to methods of use of aminodiphosphonate to modulate apolipoprotein E levels and the use of such compounds in therapy, including cardiovascular and neurological disease states.

Abstract: The present invention is related to methods and apparatus that allow a chalcogenide glass such as germanium selenide (GexSe1-x) to be doped with a metal such as silver, copper, or zinc without utilizing an ultraviolet (UV) photodoping step to dope the chalcogenide glass with the metal. The chalcogenide glass doped with the metal can be used to store data in a memory device. Advantageously, the systems and methods co-sputter the metal and the chalcogenide glass and allow for relatively precise and efficient control of a constituent ratio between the doping metal and the chalcogenide glass. Further advantageously, the systems and methods enable the doping of the chalcogenide glass with a relatively high degree of uniformity over the depth of the formed layer of chalcogenide glass and the metal. Also, the systems and methods allow a metal concentration to be varied in a controlled manner along the thin film depth.

Abstract: Method, apparatus and system embodiments to schedule user-level OS-independent “shreds” without intervention of an operating system. For at least one embodiment, the shred is scheduled for execution by a scheduler routine rather than the operating system. The scheduler routine resides in user space and may be part of a runtime library. The library may also include monitoring logic that monitors execution of a shredded program and provides scheduling hints, based on shred dependence information, to the scheduler. In addition, the scheduler may further optimize shred scheduling by taking into account information about a system's configuration of thread execution hardware. Other embodiments are also described and claimed.

Abstract: A vertical light emitting diode (LED) includes a metal substrate; a p-electrode coupled to the metal substrate; a p-contact coupled to the p-electrode; a p-GaN portion coupled to the p electrode; an active region coupled to the p-GaN portion; an n-GaN portion coupled to the active region; and a phosphor layer coupled to the n-GaN.

Abstract: The invention is directed to a wireless handheld device that securely accesses one or more remote devices subject to locally authenticating a user via biometrics. The device may be implemented as a wireless mouse with a biometric sensor incorporated with a scroll wheel that captures a biometric from the user and authenticates the user to the device using the captured biometric. More specifically, the captured biometric is compared to a template stored in memory. The device transmits a wireless signal, such as a command stream including the user's user name and password, to access the remote devices when the captured biometric matches the template. However, the device does not operate when the user is not authenticated. Accordingly, the invention may be particularly useful to log-on and log-off a user who frequently leaves and returns to a personal computer or various remote devices during the course of a day.