Abstract: A technique to monitor software thread performance and update software that issues or uses the thread(s) to reduce performance-inhibiting events. At least one embodiment of the invention uses hardware and/or software timers or counters to monitor various events associated with executing user-level threads and report these events back to a user-level software program, which can use the information to avoid or at least reduce performance-inhibiting events associated with the user-level threads.

Abstract: An apparatus, program product and method propagate errors detected in an IO fabric element from an IO fabric that is used to couple a plurality of endpoint IO resources to processing elements in a computer. In particular, such errors are propagated to the endpoint IO resources affected by the IO fabric element in connection with recovering from the errors in the IO fabric element. By doing so, a device driver or other program code used to access each affected IO resources may be permitted to asynchronously recover from the propagated error in its associated IO resource, and often without requiring the recovery from the error in the IO fabric element to wait for recovery to be completed for each of the affected IO resources. In addition, an IO fabric may be dynamically configured to support both recoverable and non-recoverable endpoint IO resources.

Abstract: A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, aNd conductors on a backside of the substrate. A method for fabricating the component includes the steps of providing the semiconductor substrate with the contacts on the circuit side, forming conductive vias from the back side in electrical contact with the contacts, and forming conductors on the backside.

Abstract: A glass-to-meal seal for use in high temperature and high pressure environments is described. The glass-to-metal seals includes an optical fiber having a metallized portion, the metallized portion having an outer dimension; an object having a high strength, corrosion-resistant alloy, the object having an outer surface and an inner surface defining a bore, the bore having a dimension larger than the outer dimension of the metallized portion of the optical fiber; and a hardened solder material disposed between the metallized portion of the optical fiber and the inner surface of the bore, such that a hermetic seal is provided between the metallized portion of the optical fiber and the inner surface of the bore; wherein the solder includes a substance having a melting temperature greater than about 250° C.

Abstract: A deposition method may include, at a first temperature, contacting a substrate with a first precursor and chemisorbing a first layer at least one monolayer thick over the substrate. At a second temperature different from the first temperature, the first layer may be contacted with a second precursor, chemisorbing a second layer at least one monolayer thick on the first layer. Temperature may be altered by adding or removing heat with a thermoelectric heat pump. The altering the substrate temperature may occur from the first to the second temperature. The second layer may be reacted with the first layer by heating to a third temperature higher than the second temperature. A deposition method may also include atomic layer depositing a first specie of a substrate approximately at an optimum temperature for the first specie deposition.

Abstract: A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated semiconductor die is disposed on a semiconductor die site of a semiconductor wafer and a first plurality of conductive bumps electrically couples the first plurality of bond pads of the singulated semiconductor die with a first set of bond pads formed on the semiconductor die site. A second plurality of conductive bumps is disposed on a second set of bond pads of the semiconductor die site. A third plurality of conductive bumps is disposed on the singulated semiconductor die's second plurality of bond pads. The second and third pluralities of conductive bumps are configured for electrical interconnection with an external device.

Abstract: Disclosed are novel methods and apparatus for reorganizing data in a log file. In an embodiment, a method of reorganizing data in an original log file is disclosed. The method includes: obtaining a data record from the original log file; examining the data record; if the data record includes a single-value entry, inserting the data record in a single-value storage linked list; if the data record includes a multiple-values entry, inserting the data record in a multiple-values linked list; and utilizing data from the multiple-values and single-value linked lists to write data to a new log file.

Abstract: Methods and apparatus are provided for adapting television channel numbers at a home location to the corresponding television channels, if any, at a visited location. Television channel mapping information is stored in a portable channel mapping storage unit. The portable channel mapping storage unit may be connected to a television set in a visited location, and the visited television set maps its received channels to corresponding channels of the home set. The visited television can then display home channel numbers for its received channels which are the same, or correspond, to channels received at the home television set.

Abstract: An implementation in a computer controlled mouse for storing a plurality of data entries to be repetitively entered into any computer controlled display screen connected to the control mouse combined with means for displaying a menu of items representative of the plurality of stored data entries. There is also an implementation controlled by the mouse for selecting items from the menu combined with means in the mouse for controlling the entry of the selected items at selected positions in display panels on the display screen. The computer will include a function, responsive to the function in the mouse for controlling the entry of selected items, for entering these selected items in said display panels. The function for entering the selected items in said display panels is in the operating system of said computer.

Abstract: A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer filling in between the surface irregularities prior to the planarization of the surface through a chemical mechanical planarization process.

Abstract: The invention is directed to a data storage device that includes a host connector to facilitate attachment to a host computer so that the host computer can access one or more storage elements within the device. The data storage device includes a flexible member to mechanically and electrically couple the host connector of the device to a housing that holds the storage elements. The housing may comprise a receptacle for insertion of the host connector when the device is not coupled to a host computer. The flexible member may define a length and a flexibility sufficient to allow the host connector to be inserted into the receptacle in the housing. When the host connector is inserted into the receptacle in the housing, the data storage device forms a loop, allowing the device to be attached to items or objects or possibly worn as jewelry.

Abstract: A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die contacts, and conductive members formed by filled openings in the die contacts and the die. In addition, the pin contacts are formed by terminal portions of the conductive members. The fabrication method includes the steps of forming the openings and the conductive members, and then thinning and etching the die to form the pin contacts. An alternate embodiment female component includes female conductive members configured to physically and electrically engage pin contacts on a mating component of a stacked assembly.

Abstract: An apparatus, program product and method propagate errors detected in an IO fabric element from an IO fabric that is used to couple a plurality of endpoint IO resources to processing elements in a computer. In particular, such errors are propagated to the endpoint IO resources affected by the IO fabric element in connection with recovering from the errors in the IO fabric element. By doing so, a device driver or other program code used to access each affected IO resources may be permitted to asynchronously recover from the propagated error in its associated IO resource, and often without requiring the recovery from the error in the IO fabric element to wait for recovery to be completed for each of the affected IO resources. In addition, an IO fabric may be dynamically configured to support both recoverable and non-recoverable endpoint IO resources.

Abstract: A computer-implemented method for importing/attaching or exporting/detaching a file during a given e-mail operation. From a user's perspective, the method begins when the user elects to perform the import/attach or export/detach function with respect to a given file. If the file resides locally, the operation proceeds as usual by carrying out the function as if the file is on the local system and resides in a known place. If, however, the file does not reside locally, a panel or other user interface is displayed. Using this panel, the user may then attempt to log into a remote system on which the file is supported. Thus, for example, the user interface may require the user to enter a userid, password, hostname, or some combination thereof. If the user login is successful, the routine gets or puts the file (e.g., using an FTP operation) as required, preferably as a background process.

Abstract: A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate.

Abstract: The invention includes a method of forming a rugged semiconductor-containing surface. A first semiconductor layer is formed over a substrate, and a second semiconductor layer is formed over the first semiconductor layer. Subsequently, a third semiconductor layer is formed over the second semiconductor layer, and semiconductor-containing seeds are formed over the third semiconductor layer. The seeds are annealed to form the rugged semiconductor-containing surface. The first, second and third semiconductor layers are part of a common stack, and can be together utilized within a storage node of a capacitor construction. The invention also includes semiconductor structures comprising rugged surfaces. The rugged surfaces can be, for example, rugged silicon.

Abstract: The invention includes a process whereby a solvent is utilized to remove soluble portions of a resist, and subsequently the solvent can be removed with a gas-fortified liquid. In particular aspects, the gas-fortified liquid emits bubbles during the removal of the solvent. Additionally, the gas-fortified liquid can be utilized to remove residual resist scum, and in such aspects the gas-fortified liquid can emit bubbles during the scum removal.

Abstract: An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in a LOC arrangement. Alternately, a connector may contact a portion of the conductive trace to make contact therewith.

Abstract: A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential, and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate and disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid. The method can further include removing the portion of conductive material from the microelectronic substrate by moving at least one of the microelectronic and the polishing pad relative to the other.

Abstract: A system and method for synchronizing distributed data streams for automating real-time navigation through presentation slides in an electronic conference are provided. With the system and method, a participant in an electronic conference is permitted to navigate back and forth through a series of presentation slides while being able to automatically synchronize the participant's display to a current position within the series of presentation slides regardless of which slide the participant's computer is currently displaying. The present invention provides a background mechanism for monitoring the current live presentation by a presenter during an electronic conference while a participant navigates through a local copy of the presentation slides. Upon the selection of a synchronization option, the participant's display output of the presentation slides is synchronized with the current live presentation using the background mechanism.