Abstract: Methods and systems for selectively displaying a portion of an electronic desktop to a remote display are provided. A user interface such as a mouse or touchpad is used to select a region on the electronic desktop of a first computer to be displayed remotely. A signal including the content displayed in the region is sent to a second computer for remotely displaying the defined portion of the first computer's electronic desktop.

Abstract: Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device; and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.

Abstract: A memory device is described that is capable of expanding an amount of storage capacity available to a host computer without requiring a user to purchase a new, higher capacity memory device that may be bulky and expensive. The memory device includes a host connector that allows a host computer access to a memory within the memory device. The memory device also includes a first set of electrical contacts accessible through a top major surface of a memory device housing and a second set of electrical contacts accessible through a bottom major surface of the memory device housing. The first and second sets of electrical contacts allow a device, such as another memory device, to couple to the host computer through the memory device. In this way, the amount of memory available to the host computer can be increased while maintaining a small form factor for each of the devices.

Abstract: The invention includes a method for treating a plurality of discrete semiconductor substrates. The discrete semiconductor substrates are placed within a reactor chamber. While the substrates are within the chamber, they are simultaneously exposed to one or more of H, F and Cl to remove native oxide. After removing the native oxide, the substrates are simultaneously exposed to a first reactive material to form a first mass across at least some exposed surfaces of the substrates. The first reactive material is removed from the reaction chamber, and subsequently the substrates are exposed to a second reactive material to convert the first mass to a second mass. The invention also includes apparatuses which can be utilized for simultaneous ALD treatment of a plurality of discrete semiconductor substrates.

Abstract: A method and apparatus for running a whipstock into a well bore attached to a combination mill and drill bit, releasing the mill/bit from the whipstock, milling a window in the casing, and drilling a lateral well bore, all in one trip. The mill/bit is provided with a primary cutting structure better suited for milling through the casing, and a secondary cutting structure, better suited for drilling through the earth formation. The secondary cutting structure is initially smaller in diameter than the primary cutting structure. The whipstock can be attached to the mill/bit with a shear bolt supported by a boss on the whipstock, with the boss designed to arrest axial motion of the mill/bit after shearing of the bolt.

Abstract: Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of electrode (“bottom electrodes”) of the container capacitor structure. The etch provides a recess between proximal pairs of container capacitor structures, which recess is available for forming additional capacitance. Accordingly, a capacitor dielectric and a top electrode are formed on and adjacent to, respectively, both an interior surface and portions of the exterior surface of the first electrode. Advantageously, surface area common to both the first electrode and second electrodes is increased over using only the interior surface, which provides additional capacitance without a decrease in spacing for clearing portions of the capacitor dielectric and the second electrode away from a contact hole location.

Abstract: A method of fabricating a chip-scale or wafer-level package having passivation layers on substantially all surfaces thereof to form a hermetically sealed package. The package may be formed by disposing a first passivation layer on the passive or backside surface of a semiconductor wafer. The semiconductor wafer may be attached to a flexible membrane and diced, such as by a wafer saw, to separate the semiconductor devices. Once diced, the flexible membrane may be stretched so as to laterally displace the individual semiconductor devices away from one another and substantially expose the side edges thereof. Once the side edges of the semiconductor devices are exposed, a passivation layer may be formed on the side edges and active surfaces of the devices. A portion of the passivation layer over the active surface of each semiconductor device may be removed so as to expose conductive elements formed therebeneath.

Abstract: A method of making a vertical diode is provided, the vertical diode having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

Abstract: This date mechanism comprises a calendar mobile (1), a driving mobile (3) an instantaneous-jump cam (7), a finger (9b) kinematically connected to this cam (7) in order to drive the calendar mobile (1). The driving finger (9b) is borne by a release member (9) which is mounted pivotably about two axes (3a, 7a), one (3a) of which is that of the driving mobile (3), this release member (9) having an opening (9a) configured to allow an angular displacement about the second of these two axes (7a), whereby the driving finger (9b) can be released from the toothing (1a) of the calendar ring while the calendar is corrected. A return spring (8) tends to rotate the driving finger (9b) about the second pivot axis (7a) in order to bring it to butt against an edge of the opening (9b), a position in which the driving finger is engaged with the toothing of the calendar ring (1).

Abstract: A method of making a vertical diode is provided, the vertical dioxide having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

Abstract: An entertainment system comprising a base unit with a transceiver for interacting, at times, with a control unit via a communications link, and a control unit for controlling the base unit, the control unit being dockable with the base unit to establish direct electrical connection between them, and including a transceiver for interacting with the control unit via said link when undocked. The control unit is a separate aspect of the invention or system. The base unit may contain a tuner, preferably with bandless tuning capability, and may be designed to receive into a universal docking arrangement a digitally controllable auxiliary audio source such as a portable MP3 player or other device. The base unit may further provide alarm clock functionality with numerous features including a “fail-safe” volume control system and fail-safe alarm time setting capability.

Abstract: Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of electrode (“bottom electrodes”) of the container capacitor structure. The etch provides a recess between proximal pairs of container capacitor structures, which recess is available for forming additional capacitance. Accordingly, a capacitor dielectric and a top electrode are formed on and adjacent to, respectively, both an interior surface and portions of the exterior surface of the first electrode. Advantageously, surface area common to both the first electrode and second electrodes is increased over using only the interior surface, which provides additional capacitance without a decrease in spacing for clearing portions of the capacitor dielectric and the second electrode away from a contact hole location.

Abstract: A light emitting diode (LED) device having a substantially conformal wavelength-converting layer for producing uniform white light and a method of making said LED at both the wafer and individual die levels are provided. The LED device includes a metal substrate, a p-type semiconductor coupled to the metal substrate, an active region coupled to the p-type semiconductor, an n-type semiconductor coupled to the active region, and a wavelength converting layer coupled to the n-type semiconductor.

Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

Abstract: This date mechanism comprises a calendar mobile (1), a driving mobile (3) an instantaneous-jump cam (7), a finger (9b) kinematically connected to this cam (7) in order to drive the calendar mobile (1). The driving finger (9b) is borne by a release member (9) which is mounted pivotably about two axes (3a, 7a), one (3a) of which is that of the driving mobile (3), this release member (9) having an opening (9a) configured to allow an angular displacement about the second of these two axes (7a), whereby the driving finger (9b) can be released from the toothing (1a) of the calendar ring while the calendar is corrected. A return spring (8) tends to rotate the driving finger (9b) about the second pivot axis (7a) in order to bring it to butt against an edge of the opening (9b), a position in which the driving finger is engaged with the toothing of the calendar ring (1).

Abstract: Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply.

Abstract: A technique for classifying a packet in a deterministic number of lookup operations. The technique builds a single “super class” that contains the match criteria for all the rules associated with packet classification. The “super class” is then compiled to produce a series of lookup tables and equivalence sets, including a final lookup table and equivalence set. The final equivalence set is then “post-processed” to associate the entries in the final lookup table with a particular result.

Abstract: The invention is directed to a memory card that includes a device connector conforming to the memory card standard, and a host connector conforming to a host connection standard and comprising a retractable shieldless tab compatible with the host connection standard. The presence of the two connectors adds versatility to the memory card. The host connector facilitates direct coupling of the memory card to a computing device without an adapter or reader. The memory card maintains a form factor of the memory card standard when the shieldless tab is retracted, which allows the memory card to be used similar to a conventional memory card of the memory card standard. In order to fit within the memory card standard form factor, the shieldless tab may be an altered version of a conventional connector interface conforming to the host connection standard.