Patents by Inventor Wei Feng

Wei Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11765881
    Abstract: A semiconductor structure with a capacitor landing pad includes a substrate. A capacitor contact plug is disposed on the substrate. A capacitor landing pad contacts and electrically connects the capacitor contact plug. A bit line is disposed on the substrate. A dielectric layer surrounds the capacitor landing pad. The dielectric layer includes a bottom surface lower than a top surface of the bit line.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: September 19, 2023
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Li-Wei Feng, Shih-Fang Tzou, Chien-Ting Ho, Ying-Chiao Wang, Yu-Ching Chen, Hui-Ling Chuang, Kuei-Hsuan Yu
  • Publication number: 20230289494
    Abstract: A method for emulating an automated guided vehicle (AGV) system includes: obtaining sensor data of a virtual AGV in an emulation environment; determining a device state of a virtual device interacting with the virtual AGV in the emulation environment; sending the sensor data and the device state to the AGV system, and receiving AGV motion control information and device operation information from the AGV system. The AGV motion control information and the device operation information are generated by the AGV system based on the sensor data and the device state. The motion of the virtual AGV and the virtual device is controlled in the emulation environment based on the AGV motion control information and the device operation information, respectively. Time and effort spent by a deployment engineer on deployment and debugging are reduced, factory downtime is decreased, and an entire AGV system and an AGV sensor can be validated.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 14, 2023
    Inventors: Wei Feng Xu, Zachi Mann, Rahav Madvil, Jing Li
  • Publication number: 20230278610
    Abstract: The present disclosure relates to a rail transit signal system with multi-network integration, including: a wayside train control subsystem for simultaneously supporting mixed tracking operation of a China train control system (CTCS)-based national railway train and a communication based train control (CBTC)-based urban rail transit train; a compatible carbome subsystem for realizing cross-line operation of a national railway line network, an intercity railway network, a municipal railway network, and an urban rail transit network; a networked intelligent dispatching subsystem for realizing intelligent dispatching management of rail transit line networks and cooperation of line network operation plans between different rail transit line networks; an interlocking subsystem being respectively communicatively connected to and interacting with the wayside train control subsystem, the compatible carbome subsystem, and the networked intelligent dispatching subsystem; and a wireless train-ground communication subsys
    Type: Application
    Filed: September 22, 2021
    Publication date: September 7, 2023
    Inventors: Yanyang XING, Xiaoyong WANG, Haigui XU, Huaxiang LIU, Liang PAN, Ye XU, Yiran LU, Wei FENG
  • Patent number: 11744062
    Abstract: The present disclosure relates to a semiconductor device and a fabricating method thereof, the semiconductor device includes a substrate, a plurality of gate structures, a plurality of isolation fins, and at least one bit line. The gate structures are disposed in the substrate, with each of the gate structures being parallel with each other and extending along a first direction. The isolation fins are disposed on the substrate, with each of the isolation fins being parallel with each other and extending along the first direction, over each of the gate structures respectively. The at least one bit line is disposed on the substrate to extend along a second direction being perpendicular to the first direction. The at least one bit line comprises a plurality of pins extending toward the substrate, and each of the pins is alternately arranged with each of the isolation fins along the second direction.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 29, 2023
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Li-Wei Feng, Yu-Cheng Tung
  • Publication number: 20230263177
    Abstract: A method for extending shelf life of germ remained rice includes evenly spreading the germ remained rice on a sheet tray, and moderately moistening the germ remained rice, packing the germ remained rice moistened, and irradiating the germ remained rice with an electron beam.
    Type: Application
    Filed: September 26, 2022
    Publication date: August 24, 2023
    Inventors: Ren WANG, Yudan JIN, Haibo LI, Wei FENG, Tao WANG, Hao ZHANG
  • Patent number: 11737257
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a substrate, at least one bit line is disposed on the substrate, a rounding hard mask is disposed on the bit line, and the rounding hard mask defines a top portion and a bottom portion, and at least one storage node contact plug, located adjacent to the bit line, the storage node contact structure plug includes at least one conductive layer, from a cross-sectional view, the storage node contact plug defines a width X1 and a width X2. The width X1 is aligned with the top portion of the rounding hard mask in a horizontal direction, and the width X2 is aligned with the bottom portion of the rounding hard mask in the horizontal direction, X1 is greater than or equal to X2.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: August 22, 2023
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Li-Wei Feng, Yu-Hsiang Hung, Ming-Te Wei
  • Publication number: 20230262310
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN
  • Patent number: 11729813
    Abstract: Technologies directed to providing multimedia service over an extended range Wireless Local Area Network (WLAN) (e.g., IEEE 802.11ah) are described. In one method, a first wireless device identifies a first portion of media data as having a first priority value and a second portion of the media data as having a second priority value that is less than the first priority value. The first wireless device modulates the first portion to obtain first modulated data using a first modulation and coding scheme (MCS) that has symbol repetition and modulates the second portion to obtain second modulated data using a second MCS in which there is no symbol repetition. The first wireless device sends the first modulated data to a second wireless device in the wireless network and sends the second modulated data to the second wireless device after sending the first modulated data.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: August 15, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Haopeng Li, Chunho Lee, Wei Feng
  • Publication number: 20230249727
    Abstract: The present disclosure relates to a train autonomous control system (TACS) based method for train interval protection control, and an apparatus for the method. The method includes: step one: receiving, by a carborne controller (CC), a train operation command sent by an automatic train supervision (ATS) system to obtain a movement mission; step two: calculating, by the CC, a train guaranteed zone in real time according to information of train localization, car characteristics, and carborne controller characteristics; step three: calculating, by the CC, track resources required to be used in combination with current mission information according to the train guaranteed zone, and requesting to a wayside information control (WSIC) for information of collided trains occupying these track resources; and step four: sending, by the WSIC, a list of the collided trains on the track resources required to be used to the CC according to information of the track resources required to be occupied by a train on a whole line.
    Type: Application
    Filed: September 22, 2021
    Publication date: August 10, 2023
    Inventors: Yiran Lu, Haigui Xu, Wei Feng, Xiaoyong Wang, Yanyang Xing
  • Patent number: 11712143
    Abstract: There is provided a cleaning robot system including a charging station and a cleaning robot. The charging station includes multiple positioning beacons. The cleaning robot includes an image sensor and a processor. The image sensor is used to acquire light generated by the multiple positioning beacons on the charging station and generate an image frame. The processor is electrically connected to the image sensor, and used to calculate a relative position with respect to the charging station according to beacon images of the multiple positioning beacons in the image frame to determine a recharge path accordingly.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: August 1, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Chu-Hung Nien, Chao-Chien Huang, Shu-Sian Yang, Wei-Feng Wei
  • Patent number: 11706911
    Abstract: The present disclosure relates to a semiconductor memory device and a method of fabricating the same, and the semiconductor memory device includes a substrate, an active structure and a shallow trench isolation. The active structure is disposed within the substrate and includes a first active region and a second active region. The first active region includes a plurality of active region units, and the second active region is disposed at an outer side of the first active region to directly connect to a portion of the active region units. The second active region includes a plurality of first openings disposed an edge of the second active region. The shallow trench isolation is disposed within the substrate, to surround the active structure.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: July 18, 2023
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Enping Cheng, Li-Wei Feng, Yu-Cheng Tung
  • Patent number: 11697833
    Abstract: A method of performing antimicrobial susceptibility testing (AST) on a sample uses a reader device that mounts on a mobile phone having a camera. A microtiter plate containing wells preloaded with the bacteria-containing sample, growth medium, and drugs of differing concentrations is loaded into the reader device. The wells are illuminated using an array of illumination sources contained in the reader device. Images of the wells are acquired with the camera of the mobile phone. In one embodiment, the images are transmitted to a separate computing device for processing to classify each well as turbid or not turbid and generating MIC values and a susceptibility characterization for each drug in the panel based on the turbidity classification of the array of wells. The MIC values and the susceptibility characterizations for each drug are transmitted or returned to the mobile phone for display thereon.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 11, 2023
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Aydogan Ozcan, Omai Garner, Dino Di Carlo, Steve Wei Feng
  • Publication number: 20230216001
    Abstract: A pixel structure is provided. The pixel structure includes a substrate and a conductive line electrically connected to the substrate. The ratio of the height to the width of the conductive line is between 0.5 and 6. The pixel structure also includes an electrode electrically connected to the conductive line and a conversion element electrically connected to the conductive lines through the electrode.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventors: Yu-Chang LIN, Tai-Jui WANG, Chieh Wei FENG, Wei-Chung CHEN
  • Publication number: 20230216252
    Abstract: A universal serial bus (USB) cable contains: a body. The body includes a first cap, a second cap, and at least one locating disc. An accommodation case includes a first cover, a roller, a printed circuit board (PCB), an engagement sheet, and a second cover. The roller is connected with a retractable cable, and the retractable cable is connected with a charger connector. The PCB is connected with a first end of a wire, and a second end of the wire is connected with an electric connector. The second cover has an accommodating chamber for receiving the roller, the PCB, and the engagement sheet. The first cover is connected with the second cover. A protection member has a detachable adapter received therein. The charger connector of the retractable cable is accommodated in the protection member, and the accommodation case is received in the receiving space of the body.
    Type: Application
    Filed: January 6, 2022
    Publication date: July 6, 2023
    Inventor: Wei-Feng Zhou
  • Patent number: 11693552
    Abstract: A display processing method is provided, comprising: displaying, by an electronic device, a first display object and a second display object on a first screen based on a first positional relationship; in response to determining that a length of a to-be-displayed character string corresponding to the first display object is greater than a first width of the first display object on the first screen, stopping displaying the first screen; and displaying the first display object and the second display object on a second screen, where the first display object and the second display object on the second screen have a second positional relationship, the second positional relationship is different from the first positional relationship, and a second width of the first display object corresponding to the second positional relationship is greater than the first width.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: July 4, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yuanli Gan, Wei Feng
  • Patent number: 11694347
    Abstract: A plurality of tracking cameras is pointed towards a routine hovering area of an in-the-field sports participant who routinely hovers about that area. Spots within the hovering area are registered relative to a predetermined multi-dimensional coordinates reference frame (e.g., Xw, Yw, Zw, Tw) such that two-dimensional coordinates of 2D images captured by the tracking cameras can be converted to multi-dimensional coordinates of the reference frame. A body part recognizing unit recognizes 2D locations of a specific body part in the 2D captured images and a mapping unit maps them into the multi-dimensional coordinates of the reference frame. A multi-dimensional curve generator then generates a multi-dimensional motion curve describing motion of the body part based on the mapped coordinates (e.g., Xw, Yw, Zw, Tw). The generated multi-dimensional motion curve is used to discover cross correlations between play action motions of the in-the-field sports participant and real-world sports results.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: July 4, 2023
    Assignee: SPORTSMEDIA TECHNOLOGY CORPORATION
    Inventors: Mark Perry, Joshua Spivak, Ryan A. Zander, Graham Wei-Feng Goldbeck, James G. Painter
  • Publication number: 20230200057
    Abstract: The present disclosure relates to a semiconductor memory device including a substrate, a plurality of buried word lines, a plurality of bit lines, and a plurality isolation fins. The substrate includes a plurality of active areas and a shallow trench isolation. The buried word lines are disposed in the substrate. The bit lines are disposed on the substrate. The isolation fins are disposed on the substrate, over each of the buried word lines respectively, wherein a portion of the isolation fins is disposed under the bit lines and overlapped with the bit lines.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Li-Wei Feng, Yu-Cheng Tung
  • Publication number: 20230200056
    Abstract: The present disclosure relates to a semiconductor memory device and a fabricating method thereof, includes a substrate, a plurality of gate structures, a plurality of isolation fins, at least one bit line, and a plug. The gate structures are disposed in the substrate, being parallel with each other along a first direction. The isolation fins are disposed on the substrate, parallel with each other and extending along the first direction, over each of the gate structures respectively. The bit line is disposed on the substrate to extend along a second direction being perpendicular to the first direction. The bit line includes a plurality of pins extending toward the substrate, being alternately arranged with the isolation fins along the second direction. The plug is disposed on the substrate, being alternately with the bit line in the first direction.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Li-Wei Feng, Yu-Cheng Tung
  • Publication number: 20230188842
    Abstract: A picture shooting method and an electronic device are disclosed. The method includes: starting an under-display camera when a first picture is moved to a first region, where the first region is a screen region corresponding to a position of the under-display camera. In embodiments of this application, a user can start the under-display camera by performing a simple operation of moving a picture, which is flexible and convenient.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventor: Wei FENG
  • Patent number: 11676994
    Abstract: The present invention provides a manufacturing method of a semiconductor device and a semiconductor device. A semiconductor device is provided, the semiconductor device includes a substrate, a stacked structure disposed on the substrate, the substrate comprises a cell array region, a peripheral circuit region and a middle region between the cell array region and the peripheral circuit region, the stacked structure comprises a first support layer, a first trench located in the middle region, a second support layer located on an upper surface of the stacked structure, wherein parts of the second support layer is disposed in the first trench, a portion of a sidewall of the first support layer directly contacts a portion of a sidewall of the second support layer, and a capacitor structure located in the cell array region.
    Type: Grant
    Filed: May 29, 2022
    Date of Patent: June 13, 2023
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Li-Wei Feng, Yu-Cheng Tung