Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.

Abstract: An apparatus and method for physical vapor deposition includes a magnetron having a plurality of electromagnets disposed between a base and a magnetic conductive plate. The magnetron includes a plurality of individually controlled electromagnets between a base and an electromagnetic plate. The magnetron controls the polarity and strength of current supplied to the respective electromagnets to generate magnetic fields that confine electrons to areas near a target material within the deposition chamber.

Abstract: An electronic apparatus and an object information recognition method by using touch data thereof are provided. Touch sensing is performed in the case where no object touches a touch panel to obtain a specific background frame through the touch panel. A current touch sensing frame is obtained through the touch panel. Touch background data of a plurality of first frame cells in the specific background frame is respectively subtracted from touch raw data of a plurality of second frame cells in the current touch sensing frame to obtain a background removal frame including a plurality of cell values. The background removal frame is transformed into a touch sensing image. The touch sensing image is inputted to a trained neural network model to recognize object information of a touch object.

Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.

Abstract: A multi-shield plate includes a plurality of windows and a plurality of vapor shields mounted to the plurality of windows, wherein each window of the plurality of windows is formed in the plate and extends through an entirety of the plate in a thickness direction. The multi-shield plate further includes a plurality of apertures in the plate, wherein each of the plurality of apertures extends through the entirety of the plate in the thickness direction and, an aperture of the plurality of apertures is aligned with a corresponding window of the plurality of windows along radius of the multi-shield plate.

Abstract: An electronic apparatus and a data transmission method thereof are provided. The data transmission method is adapted to an electronic apparatus including a screen, and the data transmission method includes the following steps. An image frame is displayed through the screen. A selection marquee is displayed on the image frame through the screen, and the selection marquee is configured for selecting a partial image frame from the image frame. Connection information is displayed within the selection marquee through the screen, and feature information of data to be transmitted is recognized from the partial image frame selected by the selection marquee. A connection with another electronic apparatus is established according to the connection information. The data to be transmitted is sent to the another electronic apparatus via the connection according to the feature information.

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.

Abstract: A 3D display system and a 3D display method are provided. The 3D display system includes a 3D display, a memory, and a processor. The processor is coupled to the 3D display and the memory and is configured to execute the following steps. As a first type application program is executed, an image content of the first type application program is captured, and a stereo format image is generated according to the image content of the first type application program. The stereo format image is delivered to a runtime complying with a specific development standard through an application program interface complying with the specific development standard. A display frame processing associated with the 3D display is performed on the stereo format image through the runtime, and a 3D display image content generated by the display frame processing is provided to the 3D display for displaying.

Abstract: An electronic device including a backlight module is disclosed. The backlight module includes: a substrate; a plurality of light emitting diodes disposed on the substrate, wherein the plurality of light emitting diodes are blue light emitting diodes; a protection layer disposed on the substrate and covering the plurality of light emitting diodes; and a color conversion element, disposed on the plurality of light emitting diodes.

Abstract: A method for processing an image that can be played on a virtual device, including obtaining a super-resolution deep learning network model, which is trained to learn to reconstruct an image from low resolution to high resolution; wherein the super-resolution deep learning network model includes a plurality of feature filters to extract features of the image; modifying the resolution of the feature filters from a preset value to an established value, wherein the established value is higher than the preset value; inputting a low-resolution image into the super-resolution deep learning network model; and increasing the resolution of the low-resolution image to become a high-resolution image through the super-resolution deep learning network model.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and a tape. The frame includes a side wall and a back plate. The side wall has an outer surface. The back plate has a back plate surface. The extension direction of the back plate is different from the extension direction of the side wall. The working panel is disposed on the back plate. The working panel has a working panel surface, and the back plate surface faces away the working panel. The case is disposed on the back plate and having a case surface. The case surface is higher than the side wall. The tape is in contact with at least a portion of the outer surface and at least a portion of the working panel surface.

Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, a conductor layer over the substrate, wherein the conductor layer includes a conductive pattern including a plurality of openings, the openings being arranged in a repeating pattern, an insulating layer in the plurality of openings and over a top surface of the conductive pattern, wherein the conductive pattern is embedded in the insulating layer, and a gas sensing film over a portion of the insulating layer.

Abstract: An antenna assembly includes a ground plane, a radiator, and a resonant circuit. The ground plane has a slot with an open end. The radiator spans the slot and has a shape configured to radiate electromagnetic energy at a first frequency and at a second frequency. The resonant circuit spans the slot in parallel with the radiator and is positioned nearer the open end than an opposite end of the slot.

Abstract: An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

Abstract: A fiber product folding apparatus includes a first dashed-line cutting device used to form a plurality of first dashed lines on a first fiber product. Through control of the rotational speed of the first dashed-line roller, the interval between adjacent first dashed lines is adjusted. A first severing device receives the first fiber product with the first dashed lines by a predetermined length and cuts off the first fiber product. A second dashed-line cutting device is used to form a plurality of second dashed lines on a second fiber product. Through control of the rotational speed of the second dashed-line roller, the interval between adjacent second dashed lines can be adjusted. A second severing device receives the second fiber product that includes the second dashed lines by a predetermined length and cuts off the second fiber product. Finally, the first fiber product and the second fiber product are conducted to pass between a first folding roller and a second folding roller to proceed with folding.

Abstract: The present disclosure provides a semiconductor structure and a method for fabricating semiconductor structure. The semiconductor structure includes a first device, configured to be a complementary metal oxide semiconductor device, wherein the first device includes a substrate, a multi-layer structure disposed on the substrate, a first hole, defined between a first end with a first circumference and a second end with a second circumference, a second hole, aligned to the first hole and defined between the second end and a third end with a third circumference, wherein the third circumference is larger than the first circumference and the second circumference, and a second device, configured to be a micro-electro mechanical system device and bonded to the first device, wherein a first chamber is between the first device and the second device, and the first end links with the first chamber, and a sealing object configured to seal the second hole.

Abstract: A beverage manufacturing machine includes a heating mechanism, a brewing mechanism and a cooling mechanism. The heating mechanism heats up drinking water and sends the hot drinking water to the brewing mechanism. There are two brewing mechanisms for brewing a hot drink, and the hot drink in a primary cooling bushing exchanges heat with room temperature water to realize a first cooling. The drink after the first cooling reaches a secondary cooling bushing to exchange heat with a low temperature coolant to realize a second cooling to produce an iced drink. The coolant after the heat exchange enters into a coolant buffer and then reflows to a coolant container, and a compressor drives the heat exchanger to lower the temperature of the coolant. Without requiring high skill, this machine makes good-tasted beverages with appropriate concentration or original iced liquid beverage with great aroma.

Abstract: A semiconductor device comprises a first conductive feature on a semiconductor substrate, a bottom electrode on the first conductive feature, a magnetic tunnel junction (MTJ) stack on the bottom electrode, and a top electrode on the MTJ stack. A spacer contacts a sidewall of the top electrode, a sidewall of the MTJ stack, and a sidewall of the bottom electrode. A conductive feature contacts the top electrode.

Abstract: A titanium alloy product includes a titanium alloy substrate and a plurality of first holes defined in a surface of the titanium alloy substrate. The first holes have an opening on the surface of the titanium alloy substrate and an inner wall connecting with the opening, a diameter of the inner space is greater than a diameter of the opening. The product tensile strength of bonding between the titanium alloy product and a material part filled in the first holes is very high. A housing with the titanium alloy product and a method for manufacturing the titanium alloy product are also disclosed.

Abstract: An apparatus for manufacturing a semiconductor device may include a chamber, a chuck provided in the chamber, and a biased power supply physically connected with the chuck. The apparatus may include a target component provided over the chuck and the biased power supply, and a magnetron assembly provided over the target component. The magnetron assembly may include a plurality of outer magnetrons and a plurality of inner magnetrons, and a spacing between each adjacent magnetrons of the plurality of outer magnetrons may be different from a spacing between each adjacent magnetrons of the plurality of inner magnetrons.