Abstract: Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.

Abstract: The present disclosure relates to an integrated chip having an integrated bio-sensor with horizontal and vertical sensing surfaces. In some embodiments, the integrated chip has a sensing device disposed within a substrate, and a lower metal wire over the substrate and electrically coupled to the sensing device. First and second metal vias are arranged on the lower metal wire at locations set back from sidewalls of the lower metal wire, and first and second upper metal wires respectively cover top surfaces of the first and second metal vias. A dielectric structure surrounds the lower metal wire, the first and second metal vias, and the first and second upper metal wires. A sensing well has sensing surfaces that extend along an upper surface of the lower metal wire and along sidewalls of the first and second metal vias and the first and second upper metal wires.

Abstract: An exemplary fan includes a hub and an impeller. The hub is made of metal, and includes a flange. The impeller is made of plastic. The impeller is formed around the hub and has the flange embedded therein. A method for manufacturing the fan is also provided.

Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.

Abstract: An embodiment of the invention provides a method of preparing for speaker authentication. The method includes: receiving speech data that represents an utterance made by a user; extracting side information; examining the side information to determine whether to allow speaker model training using the speech data; and generating a feedback message for the user based on the side information if speaker model training using the speech data is not allowed; wherein the feedback message contains a message indicating at least a condition of the side information comprising calendar data to the user.

Abstract: A pixel matrix includes pixel units. The pixel units are arranged in a repeating pattern, in which each of the pixel units includes transparent pixels, reflective pixels, and switch components. Each of the transparent pixels includes a transparent electrode and a transparent color resist layer disposed on the transparent electrode. Each of the reflective pixels includes a reflective electrode. The switch components are connected to the transparent electrodes of the transparent pixels and the reflective electrodes of the reflective pixels respectively for driving the transparent pixels and the reflective pixels individually.

Abstract: A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode and the first moving element is between the top electrode and the bottom electrode.

Abstract: An image outputting device for transmitting an output image to a remote screen is provided, including a display engine, a display, a position detection device, a processor and a transmission interface. The display engine provides a display frame. The display displays the display frame. The position detection device detects position information of an object corresponding to the display. The object is physically separated from the display. The processor generates the output image according to the position information and the display frame. The transmission interface transmits the output image to the remote screen.

Abstract: The present disclosure provides a CMOS-MEMS device structure. The CMOS-MEMS device structure includes a sensing substrate and a CMOS substrate. The sensing substrate includes a bonding mesa structure. The CMOS substrate includes a top dielectric layer. The sensing substrate and the CMOS substrate are bonded through the bonding mesa structure, and the bonding mesa structure defines a bonding gap between the CMOS substrate and the sensing substrate.

Abstract: Present disclosure provides a semiconductor structure, including a substrate having a center portion and an edge portion, an isolation layer over the substrate; a semiconductor fin with a top surface and a sidewall surface, partially positioning in the isolation layer, a first gate covering a portion of the top surface and a portion of the sidewall surface of the semiconductor fin, positioning at an edge portion of the substrate, and a second gate covering a portion of the top surface and a portion of the sidewall surface of the semiconductor fin, positioning at a center portion of the substrate. A lower width of the first gate in proximity to the isolation layer is smaller than an upper width of the first gate in proximity to top surface of the semiconductor fin.

Abstract: Presented herein are techniques to reduce error probability and eliminate the lingering signal that causes problems during audio signal data transmission. An electroacoustic transducer of a first electronic device receives a data encoded audio signal that includes modulated digital data therein. The data encoded audio signal is demodulated to produce a present input signal that includes a target frequency and a lingering effect of a previously received data encoded audio signal. Lingering cancellation is performed on the present input signal to produce a present output signal from which the lingering effect of the previously received data encoded audio signal has been removed.

Abstract: A display device includes a display panel, an image signal input module, and a sub-pixel rendering (SPR) means. The display panel includes a plurality of units. Each of the units includes at least 24 sub-pixels arranged in rows and columns. At least four first color sub-pixels, at least four second color sub-pixels, eight third color sub-pixels, and eight fourth color sub-pixels constitute each of the units. The image signal input module is configured to receive image signals. The SPR means is configured to perform a sub-pixel rendering process on the image signals thereby each of the sub-pixels of the display panel produces a performance value.

Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.

Abstract: A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises a shielding layer on the carrier and coupled to ground, a plurality of vias coupled between the shielding layer and a bottom electrode of the MEMS substrate and a moving element over the bottom electrode and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the moving element is between the top electrode and the bottom electrode.

Abstract: A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.

Abstract: A method for controlling an antenna array is provided, which includes following steps. Associations with a plurality of mobile devices are established, and at least one characteristic parameter table corresponding to the mobile devices is generated. When a plurality of transmission request signals are received simultaneously and the mobile devices are divided into a user group, a multi-user antenna index of the antenna array is generated based on the at least one characteristic parameter table, and a plurality of data streams corresponding to the mobile devices are transmitted simultaneously through the antenna array. When the transmission request signals are received simultaneously and the mobile devices are not divided into the user group, a single-user antenna index of the antenna array is generated based on the at least one characteristic parameter table, and the data streams corresponding to the mobile devices are transmitted one-by-one through the antenna array.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract: The present disclosure provides a biological field effect transistor (BioFET) device testing and processing methods, system and apparatus. A wafer-level bio-sensor processing tool includes a wafer stage, an integrated electro-microfluidic probe card, and a fluid supply and return. The integrated electro-microfluidic probe card includes a fluidic mount that may be transparent, a microfluidic channels in the fluidic mount, at least one microfluidic probe and a number of electronic probe tips at the bottom of the fluidic mount, fluidic and electronic input and output ports on the sides of the fluidic mount, and at least one handle lug on the fluidic mount. The method includes aligning a wafer, mounting the integrated electro-microfluidic probe card, flowing a test fluid, and measuring electrical properties. The tool may also be used for stamping or printing a fluid in the device area on the wafer.

Abstract: The present invention discloses a piezoelectric loudspeaker. The piezoelectric loudspeaker comprises a sound producing plate, a resonant sound-box, a surround and a reflective sound-box. The sound producing plate comprises a piezoelectric ceramic element. The resonant sound-box includes a first opening comprising a first carrying part. The sound producing plate is disposed on the first carrying part. A cavity resonator is formed between the sound producing plate and the resonant sound-box. The surround is disposed between the first carrying part and the sound producing plate. The reflective sound-box includes a second opening and a reflective output opening. The second opening comprises a second carrying part. The resonant sound-box is disposed on the second carrying part. A reflective cavity body is formed between the resonant sound-box and the reflective sound-box, and the reflective cavity body is connected the reflective output opening.

Abstract: The present disclosure relates to a structure and method of forming a MEMS-CMOS integrated circuit with an outgassing barrier and a stable electrical signal path. An additional poly or metal layer is embedded within the MEMS die to prevent outgassing from the CMOS die. Patterned conductors formed by a damascene process and a direct bonding between the two dies provide a stable electrical signal path.