Abstract: The present disclosure relates to an integrated chip having an integrated bio-sensor having horizontal and vertical sensing surfaces. In some embodiments, the integrated chip has a sensing device disposed within a semiconductor substrate. A back-end-of the line (BEOL) metallization stack with a plurality of metal interconnect layers electrically coupled to the sensing device is arranged within an inter-level dielectric (ILD) layer overlying the semiconductor substrate. A sensing well is located within a top surface of the ILD layer. The sensing well has a horizontal sensing surface extending along a top surface of a first one of the plurality of metal interconnect layers and a vertical sensing surface extending along a sidewall of a second one of the plurality of metal interconnect layers overlying the first one of the plurality of metal interconnect layers. The use of both horizontal and vertical sensing surfaces enables more accurate sensing.

Abstract: A manufacturing method of a thin film transistor includes the following steps. A substrate is provided first. A semiconductor layer is then formed on the substrate. Next, a photoresist pattern including a middle portion and two peripheral portions is formed on the semiconductor layer. The middle portion is disposed between two peripheral portions, and the thickness of the middle portion is greater than each of the peripheral portions. Next, an etching process is performed on the semiconductor layer for forming a patterned semiconductor layer. A photoresist ashing process is then performed to remove at least the peripheral portions of the photoresist pattern to form a channel defining photoresist pattern and expose two portions of the patterned semiconductor layer. Next, the patterned semiconductor layer is treated to form a semiconductor portion and two conductor portions. The channel defining photoresist pattern is then removed.

Abstract: A voice wakeup detecting device for an electronic product includes a digital microphone and an application processor. The digital microphone has a function of judging whether a digital voice signal contains a subword according to subword model parameters. If the digital microphone confirms that the digital voice signal contains the subword, the digital microphone generates a first interrupt signal and outputs the digital voice signal. The application processor is enabled in response to the first interrupt signal. The application processor judges whether the digital voice signal contains a keyword according to keyword model parameters. If the application processor confirms that the digital voice signal contains the keyword, the electronic product is waked up from a sleep state to a normal working state under control of the application processor.

Abstract: A voice wakeup detecting device for an electronic product includes a front end detecting circuit, a speech recognition processor and a main processor. The front end detecting circuit judges whether a voice signal contains a sub-keyword according to sub-keyword model parameters. If the front end detecting circuit confirms that the voice signal contains the sub-keyword, then it generates a first interrupt signal. In response to the first interrupt signal, the speech recognition processor is enabled to judge whether the voice signal contains a keyword according to keyword model parameters. If the speech recognition processor confirms that the voice signal contains the keyword, then it generates a second interrupt signal. In response to the second interrupt signal, the main processor is enabled. Consequently, the electronic produce is waked up from a sleep state to a normal working state.

Abstract: A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

Abstract: Disclosed is a planar door stopper installed to a floor with respect to a moving path of a door panel, such that when the door panel is opened, the bottom of the door panel is attracted by the planar door stopper, and the planar door stopper is turned and moved upward and framed around the corners and the periphery of the door panel or extended cross an outer side of the bottom of the door panel, so as to limit the door panel at an opening position and overcome the drawbacks of a conventional door stopper which hinders walkway and causes inconvenient to construction.

Abstract: Provided are a eukaryotic expression system and its applications. The eukaryotic expression system has a recombinant plant cell. The recombinant plant cell includes a first vector and a second vector. The first vector expresses a fusion protein containing an Asia tospoviral common epitope. The fusion protein containing Asia tospoviral common epitope consists of an amino acid sequence as set forth in SEQ ID NO. 1, and a predetermined protein fragment connecting to the Asia tospoviral common epitope. The above eukaryotic expression system is useful for monitoring the interaction between proteins via use of a specific peptide to tag the predetermined protein and demonstrates high sensitivity and stability.

Abstract: MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

Abstract: A signal auto-tuning system is provided, which comprises a host, a controller, an expander, and a storage unit, The expander comprises a first error counting unit, a second error counting unit, an error-count temporary table, an error-count evaluating unit, and an adjusting unit. The expander receives/transmits a first signal with relation to the controller, and the expander receives/transmits a second signal with relation to the storage unit. The adjusting unit determines whether to adjust either of the first signal and the second signal, based on a result determined by the error-count evaluating unit.

Abstract: A server system for monitoring working information includes a plurality of hard disks, a processing module and an expander. Each the hard disk having a first real-time working information is provided to transmit a first real-time information signal including the first real-time working information. The processing module having a second real-time working information is provided to transmit a second real-time information signal including the second real-time working information. The expander includes a firmware electrically connected to the hard disks and the processing module so as to store the first and second real-time working information. A monitor module electrically connected to the processing module is further provided to transmit a monitoring signal to the expander through the processing module to capture the first and second real-time working information stored in the firmware.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract: A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.

Abstract: A method for adjusting saturation degree and a color adjusting system are provided. The method for adjusting saturation degree includes the following steps. A hue circle is divided into a plurality of hue regions, and each of the hue regions is divided into a plurality of saturation regions according to at least one saturation threshold. A plurality of first input saturation degrees of a first saturation region of a first hue region of the hue regions are weighted by a first weighting formula for obtaining a plurality of first output saturation degrees. A plurality of second input saturation degrees of a second saturation region of the first hue region of the hue regions are weighted by a second weighting formula for obtaining a plurality of second output saturation degrees. The first weighting formula is different from the second weighting formula.

Abstract: A driving method for rendering subpixels of each pixel of a display is provided. The display has a plurality of first pixels and a plurality of second pixels. Each second pixel has a first color subpixel and a second color subpixel, but lacks a third color subpixel. Each first pixel has a second color subpixel and a third color subpixel, but lacks a first color subpixel. The first color subpixel, second color subpixel and third color subpixel are used to represent gray levels of a first color, a second color and a third color respectively. Processes of rendering the subpixels of each pixel are performed based on positions, saturations and brightness of neighboring pixels, such that quality of image displayed on the display could be ensured even though each first pixel lacks the first color subpixel and each second pixel lacks the third color subpixel.

Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure is provided. The FinFET device structure includes a substrate and a first fin structure and a second fin structure extending above the substrate. The FinFET device structure also includes a first transistor formed on the first fin structure and a second transistor formed on the second fin structure. The FinFET device structure further includes an inter-layer dielectric (ILD) structure formed in an end-to-end gap between the first transistor and the second transistor, and the end-to-end gap has a width in a range from about 20 nm to about 40 nm.

Abstract: A three-dimensional (3D) integrated circuit (IC) includes a first IC and a second IC. The first IC includes a MEMS device and a first bonding structure. The second IC includes a second bonding structure. The first and second bonding structures are bonded together to couple the first IC to the second IC. A conformal barrier layer is disposed over a surface of the second IC nearest the first IC. An etch isolation structure is arranged beneath the surface of the second IC and encloses a sacrificial region which is arranged on either side of the second bonding structure and which is arranged in the second IC.

Abstract: A method of using beta-ionone, E)-4-(2,6,6-trimethylcyclohex-1-en-1-yl)but-3-en-2-one, treats and prevents diseases otherwise induced by Propionibacterium acnes and thus effectively reduces inflammatory responses otherwise caused by Propionibacterium acnes.

Abstract: A software module on a client computer sends a query to a remote computer server operating a cloud service and receives a response, in order to determine latency. The latency is used with the total size of the packets sent and the packet size to determine the bandwidth available over the network connection at that time. Bandwidth available is calculated periodically and stored in a database of the client computer. Comparing a calculated bandwidth with predefined threshold values indicates whether the network status is good for initiating a cloud service with the computer server or poor. Any number of bandwidth available values are used to determine a slope and the slope is used to predict a bandwidth available value at a future time. A bandwidth available moving average is calculated by summing the bandwidth values for the previous days and dividing by the number of days; the moving average is calculated periodically.