Abstract: A pixel matrix includes pixel units. The pixel units are arranged in a repeating pattern, in which each of the pixel units includes transparent pixels, reflective pixels, and switch components. Each of the transparent pixels includes a transparent electrode and a transparent color resist layer disposed on the transparent electrode. Each of the reflective pixels includes a reflective electrode. The switch components are connected to the transparent electrodes of the transparent pixels and the reflective electrodes of the reflective pixels respectively for driving the transparent pixels and the reflective pixels individually.

Abstract: A flexible positioning post includes a base, a metal post and a plurality of metal elastic pieces. The base has an upper surface. The metal post has a first end and a second end opposite to each other, and the first end is connected to the upper surface of the base. Each of the metal elastic pieces has a fixed end and a free end opposite to each other. The fixed end is securely assembled at the second end of the metal post, and the free end is adjacent to the upper surface of the base and bent toward the metal post to form a bending portion. Consequently, upon receiving a foreign force, the free end of each of the metal elastic pieces is moved toward the metal post; conversely, once the foreign force is removed, the free end of each of the metal elastic pieces is moved resiliently.

Abstract: A structure and a formation method of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a gate stack over the semiconductor substrate. The gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure also includes a dielectric structure over the semiconductor substrate and adjacent to the gate stack. The dielectric structure is in direct contact with the work function layer and the metal filling.

Abstract: A signal conversion method for a display image is provided. The signal conversion method includes: receiving an image data of the (N?1)th frame; converting the (N?1)th image data to obtain a luminance data; determining a signal tuning gain of an image data of Nth frame according to the image data of the (N?1)th frame, the luminance data and a backlight duty adjusting table; adjusting an image data of Nth frame according to the signal tuning gain of Nth frame so as to generate an output image data of Nth frame; and displaying pixels according to the output image data of Nth frame.

Abstract: An electronic device and a method for data copy between electronic devices are provided, and the method includes following steps. Data is added to a clipboard of an electronic device. It is determined whether the electronic device is connected to a network associated to a network unit, so as to determine to use the network unit or a wireless transmission unit to transmit the data. If the electronic device is not connected to the network, the data is directly transmitted to another electronic device by the wireless transmission unit, such that the data is added to another clipboard of another electronic device. If the electronic device is connected to the network, the data is indirectly transmitted to the another electronic device by the network unit via a sever in the network, such that the data is added to the another clipboard of the another electronic device.

Abstract: A signal processing apparatus for receiving a spectral line of an original signal includes a starting point determining module, a searching module and a symbol rate determining module. The starting point determining module finds a maximum energy in the spectral line and determines at least one search starting point according to the maximum energy. From the at least one search starting point, the searching module searches along the spectral line towards a region with a lower energy for at least one minimum energy satisfying a predetermined condition. The symbol rate determining module determines a symbol rate of the original signal according to the at least one minimum energy.

Abstract: A detection circuit is provided. A detection signal corresponding to an equivalent capacitance value of a micro-electro-mechanical system is generated by an oscillator, and the equivalent capacitance value of the micro-electro-mechanical system varies with a location of the micro-electro-mechanical system.

Abstract: Methods and apparatus for forming MEMS devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance. Methods are disclosed.

Abstract: A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.

Abstract: A vacuum sealed MEMS and CMOS package and a process for making the same may include a capping wafer having a surface with a plurality of first cavities, a first device having a first surface with a second plurality of second cavities, a hermetic seal between the first surface of the first device and the surface of the capping wafer, and a second device having a first surface bonded to a second surface of the first device. The second device is a CMOS device with conductive through vias connecting the first device to a second surface of the second device, and conductive bumps on the second surface of the second device. Conductive bumps connect to the conductive through vias and wherein a plurality of conductive bumps connect to the second device. The hermetic seal forms a plurality of micro chambers between the capping wafer and the first device.

Abstract: A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

Abstract: The present disclosure relates to a structure and method of forming a MEMS-CMOS integrated circuit with an outgassing barrier and a stable electrical signal path. An additional poly or metal layer is embedded within the MEMS die to prevent outgassing from the CMOS die. Patterned conductors formed by a damascene process and a direct bonding between the two dies provide a stable electrical signal path.

Abstract: A method embodiment for forming a micro-electromechanical (MEMS) device includes providing a MEMS wafer, wherein a portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer, and the carrier wafer is etched to expose the first membrane for the microphone device to an ambient environment. A MEMS substrate is patterned and portions of a first sacrificial layer are removed of the MEMS wafer to form a MEMS structure. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure. A second sealed cavity and a cavity exposed to an ambient environment on opposing sides of the second membrane for the pressure sensor device are formed.

Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.

Abstract: Provided is a method for fabricating a semiconductor device including the following steps. A silicon-containing conductive layer is formed on a substrate. Then, a dielectric layer is formed around the silicon-containing conductive layer. A portion of the dielectric layer is removed to expose a first sidewall of the silicon-containing conductive layer. A shielding structure is formed on a partial surface of the silicon-containing conductive layer, and the shielding structure exposes at least the first sidewall. A metal layer is formed on the substrate to cover the silicon-containing conductive layer not covered by the shielding structure. A salicide process is performed to form a silicide layer.

Abstract: Provide a set of first RGB (red, green, blue) brightness levels of a set of pixels in a display panel. Generate a set of saturation levels according to the set of first RGB brightness levels. Generate a set of mapping ratios according to the set of saturation levels and the set of first RGB brightness levels. Generate a set of second RGB brightness levels according to the set of first RGB brightness levels and a minimum mapping ratio of the set of mapping ratios. Generate a set of RGBW (red, green, blue, white) brightness levels according to the set of second RGB brightness levels and a set of brightness levels of white sub-pixels of the set of RGBW brightness levels. And convert the set of RGBW brightness levels to generate a set of RGBW gray levels of the set of pixels.

Abstract: A stacked semiconductor device includes a CMOS device and a MEMS device. The CMOS device includes a multilayer interconnect with metal elements disposed over the multilayer interconnect. The MEMS device includes metal sections with a first dielectric layer disposed over the metal sections. A cavity in the first dielectric layer exposes portions of the metal sections. A dielectric stop layer is disposed at least over the interior surface of the cavity. A movable structure is disposed over a front surface of the first dielectric layer and suspending over the cavity. The movable structure includes a second dielectric layer over the front surface of the first dielectric layer and suspending over the cavity, metal features over the second dielectric layer, and a flexible dielectric membrane over the metal features. The CMOS device is bonded to the MEMS device with the metal elements toward the flexible dielectric membrane.

Abstract: The present invention provides an audio-data transmission system including a channel encoder, a data modulator and a speaker. The channel encoder is utilized to receive and encode a bit signal and generates an encoding signal. The data modulator is utilized to receive the encoding signal and modulates it to an audio signal whose frequency is on a frequency band. The audio signal includes at least four different sub-audio signals. The frequency band includes at least four sub-frequency bands with different frequencies. The frequencies of the at least four sub-audio signals are respectively on the at least four sub-frequency bands. The speaker is utilized to transmit the audio signal including the at least four different sub-audio signals.

Abstract: Methods for preventing and/or reducing side effects of an anti-cancer agent in a subject in need thereof are disclosed. The method comprises administering to the subject, who is under an anti-cancer agent treatment, a composition comprising a therapeutically effective amount of isolated deoxyelephantopin and/or an analog thereof; and a pharmaceutically acceptable carrier.

Abstract: The present disclosure provides a semiconductor memory device. The device includes a pinning layer having an anti-ferromagnetic material and disposed over a first electrode; a pinned layer disposed over the pinning layer; a tunneling layer disposed over the pinned layer, a free layer disposed over the tunneling layer and a capping layer disposed over the free layer. The capping layer includes metal-oxide and metal-nitride materials.