Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dislocation SMT For FinFET Device
    Publication number: 20150179771
    Abstract: A method for performing a stress memorization technique (SMT) a FinFET and a FinFET having memorized stress effects including multi-planar dislocations are disclosed. An exemplary embodiment includes receiving a FinFET precursor with a substrate, a fin structure on the substrate, an isolation region between the fin structures, and a gate stack over a portion of the fin structure. The gate stack separates a source region of the fin structure from a drain region of the fin structure and creates a gate region between the two. The embodiment also includes forming a stress-memorization technique (SMT) capping layer over at least a portion of each of the fin structures, isolation regions, and the gate stack, performing a pre-amorphization implant on the FinFET precursor by implanting an energetic doping species, performing an annealing process on the FinFET precursor, and removing the SMT capping layer.
    Type: Application
    Filed: February 26, 2015
    Publication date: June 25, 2015
    Inventors: Wen-Cheng Lo, Sun-Jay Chang
  • NAIL GUN
    Publication number: 20150174749
    Abstract: A nail gun includes a main body defining an axis, a magazine, a connector body connected to the main body and the magazine, a fixed seat connected to one of the magazine and the connector body and having at least one abutment surface configured to abut against a workplace, and a pressing assembly loosenably fixing the fixed seat to the one of the magazine and the connector body. The pressing assembly is operable between a loosened state and a tightened state. When the pressing assembly is in the loosened state, the fixed seat is rotatable relative to the one of the magazine and the connector body such that an angle of the abutment surface of the fixed seat relative to the axis is selectively positionable.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 25, 2015
    Inventors: An-Gi LIU, Wen-Cheng LO
  • FLOORING NAILER HAVING AN INVERTABLE OBJECT ABUTMENT MEMBER
    Publication number: 20150165612
    Abstract: A nailer includes a base seat and at least one abutment member. The base seat has at least one engaging structure. The abutment member has at least two engaging portions that are spaced apart from each other, and a connecting portion that is connected between the engaging portions. The engaging structure engages detachably one of the engaging portions. Each of the engaging portions has an engaging surface that is connected to the connecting portion and that abuts against the engaging structure. The other one of the engaging portions further has an abutment surface that is opposite to the engaging surface thereof, and that is for abutting against the object.
    Type: Application
    Filed: December 15, 2014
    Publication date: June 18, 2015
    Inventors: Yao-Sheng Shen, An-Gi Liu, Wen-Cheng Lo
  • MEMS Device with Release Aperture
    Publication number: 20150166334
    Abstract: The present disclosure provides a micro-electro-mechanical systems (MEMS) device. In an embodiment, a device includes a substrate; a MEMS structure disposed above a sacrificial layer opening above the substrate; a release aperture disposed at substantially a same level above the sacrificial layer opening as the MEMS structure; a first cap over the MEMS structure and the sacrificial layer opening, a leg of the first cap disposed between the MEMS structure and the release aperture; and a second cap plugging the release aperture.
    Type: Application
    Filed: February 4, 2015
    Publication date: June 18, 2015
    Inventors: Chung-Hsien Lin, Chia-Hua Chu, Chun-Wen Cheng
  • SEMICONDUCTOR DEVICE
    Publication number: 20150166331
    Abstract: A method of forming a semiconductor device comprises bonding a capping wafer and a base wafer to form a wafer package. The base wafer comprises a plurality of chip package portions. The capping wafer comprises a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is configured to substantially align with a corresponding chip package portion of the plurality of chip package portions. The method also comprises separating the wafer package into a plurality of chip packages. Each chip package of the plurality of chip packages comprises at least one chip package portion of the plurality of chip package portions.
    Type: Application
    Filed: December 30, 2014
    Publication date: June 18, 2015
    Inventors: Chun-wen CHENG, Jung-Huei PENG, Shang-Ying TSAI, Hung-Chia TSAI, Yi-Chuan TENG
  • SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS
    Publication number: 20150166329
    Abstract: A method of forming a semiconductor device having through molding vias comprises eutectic bonding a capping wafer and a base wafer to form a wafer package. The base wafer comprises a first chip package portion, a second chip package portion, and a third chip package portion. The capping wafer comprises a plurality of isolation trenches and a plurality of separation trenches having a depth greater than the isolation trenches with respect to a same surface of the capping wafer. The method also comprises removing a portion of the capping wafer exposing a first chip package portion contact, a second chip package portion contact, and a third chip package portion contact. The method further comprises separating the wafer package to separate the wafer package into a first chip package, a second chip package, and a third chip package.
    Type: Application
    Filed: December 16, 2013
    Publication date: June 18, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-wen CHENG, Jung-Huei PENG, Shang-Ying TSAI, Hung-Chia TSAI, Yi-Chuan TENG
  • Method of forming a bond ring for a first and second substrate
    Patent number: 9056766
    Abstract: One method includes providing a first substrate; the first substrate may include a first MEMS device and a second MEMS device. A second substrate is also provided. The first substrate is bonded to the second substrate. The bonding may include forming a first bond ring around the first MEMS device and forming a second bond ring around the second MEMS device, wherein the second bond ring also encircles the first bond ring. In an embodiment, the eutectic point of the materials of the second bond ring is not reached during the bonding.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: June 16, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Hsueh-An Yang
  • SYSTEM FOR SPEECH KEYWORD DETECTION AND ASSOCIATED METHOD
    Publication number: 20150161989
    Abstract: The invention provides a system for speech keyword detection and associated method. The system includes a speech keyword detector, an activity predictor and a decision maker. The activity predictor obtains sensor data provided by a plurality of sensors, and processes the sensor data to provide an activity prediction result indicating a probability for whether a user is about to give voice keyword. The decision maker processes the activity prediction result and a preliminary keyword detection result of the speech keyword detection to provide a keyword detection result.
    Type: Application
    Filed: January 29, 2014
    Publication date: June 11, 2015
    Applicant: MEDIATEK Inc.
    Inventors: Chao-Ling Hsu, Yiou-Wen Cheng, Liang-Che Sun, Yuanyuan Wang
  • Biosensor Calibration System and Related Method
    Publication number: 20150160323
    Abstract: A device includes a first biosensor of a biosensor array; a second biosensor of a biosensor array; a readout circuit electrically connected to the biosensor array; a decoder electrically connected to the biosensor array; a voltage generator electrically connected to the biosensor array; and a decision system electrically connected to the voltage generator and the readout circuit.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wen, Jui-Cheng Huang, Yi-Shao Liu, Chun-Wen Cheng, Tung-Tsun Chen
  • METHOD FOR CONTROLLING OBESITY USING Antrodia camphorata
    Publication number: 20150157673
    Abstract: A method for controlling obesity by using Antrodia camphorata is disclosed. A composition of Antrodia camphorata prepared from dried fruiting bodies of Antrodia camphorata is used to reduce lipid accumulation in adipocytes for controlling obesity, and the method includes steps of: providing a composition of Antrodia camphorata prepared from dried fruiting bodies of Antrodia camphorata; and applying the composition to reduce lipid accumulation for improving symptoms of obesity.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 11, 2015
    Applicant: National Taiwan Normal University
    Inventors: Po-Jung TSAI, Chih-Ling Wang, Cheng-Jen Chou, Wen-Cheng Huang
  • THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150162489
    Abstract: A TFT substrate includes: a substrate; and a plurality of TFTs, wherein each of the TFTs comprises: a gate electrode, disposed on the substrate; a gate insulating layer, disposed on the substrate and covering the gate electrode; a metallic oxide active layer, disposed on the gate insulating layer; a metallic oxide protection layer, disposed on the metallic oxide active layer; an etching stop layer, disposed on the metallic oxide protection layer, wherein a first through hole and a second through hole penetrate through the etching stop layer and the metallic oxide protection layer; and a source electrode and a drain electrode, disposed in the first through hole and the second through hole respectively, and electrically connected to the metallic oxide active layer.
    Type: Application
    Filed: December 30, 2013
    Publication date: June 11, 2015
    Inventors: Chin-Tzu KAO, Wen-Cheng LU
  • MEMS structures and methods for forming the same
    Patent number: 9054121
    Abstract: A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: June 9, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao, Chia-Shiung Tsai, Chun-Wen Cheng
  • Radio frequency interference shield
    Patent number: 9054779
    Abstract: Examples provide various systems and method associated with intercepting radio frequency interference. In various examples, a wireless integrated circuit module comprises radio frequency connectors. An RF interference shield covers the RF connectors to intercept and ground interference.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 9, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chang-Cheng Hsieh, Leo Joseph Gerten, Hung-Wen Cheng
  • Hand Puller with Rope Reel
    Publication number: 20150151664
    Abstract: A hand puller with a rope reel contains a body and a reel. The body includes a fixing holder, a first rotary shaft, a rotating handle, two ratchet wheels, and at least one stopping piece. The rotating handle having a pushing plate, and the first rotary shaft has two driving gears. The reel includes a seat, a second rotary shaft, two driven gears, and a chain roller. The body includes a first connecting portion with plural holes, and the seat has a second connecting portion and a plurality of apertures. The reel and the body are movably coupled together, the second connecting portion of the reel is aligned and overlapped with the first connecting portion of the body, and at least one pin is inserted into at least one opening of the first connecting portion and the plurality of apertures of the second connecting portion.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 4, 2015
    Inventor: Wen Cheng Chang
  • Semiconductor memory storage array device and method for fabricating the same
    Patent number: 9041129
    Abstract: A semiconductor memory storage array device comprises a first electrode layer, an oxide layer, a second electrode layer, a memory material layer and a first insulator layer. The oxide layer is disposed on the first electrode layer. The second electrode layer is disposed on the oxide layer. The memory material layer is disposed on the second electrode layer. The first insulator layer is disposed adjacent to two sidewalls of the first electrode layer, the oxide layer, the second electrode layer and the memory material layer, so to define a gap either between the first electrode layer and the oxide layer or between the second electrode layer and the oxide layer.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: May 26, 2015
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Chia-Hua Ho, Ming-Daou Lee, Wen-Cheng Chiu, Cho-Lun Hsu
  • Part of LED lamp
    Patent number: D731092
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: June 2, 2015
    Assignee: TAIWAN-N LIGHTING CORPORATION LTD.
    Inventors: Tai-Kuang Wang, Yu-Wen Cheng, Shih-Hsuan Yang
  • Part of LED lamp
    Patent number: D731093
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: June 2, 2015
    Assignee: TAIWAN-N LIGHTING CORPORATION LTD.
    Inventors: Tai-Kuang Wang, Yu-Wen Cheng, Shih-Hsuan Yang
  • Part of LED lamp
    Patent number: D731094
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: June 2, 2015
    Assignee: TAIWAN-N LIGHTING CORPORATION LTD.
    Inventors: Tai-Kuang Wang, Yu-Wen Cheng, Shih-Hsuan Yang
  • Parts of LED lamps
    Patent number: D731683
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: June 9, 2015
    Assignee: Taiwan-N Lighting Corporation Ltd.
    Inventors: Tai-Kuang Wang, Yu-Wen Cheng, Shih-Hsuan Yang
  • Parts of LED lamps
    Patent number: D731684
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: June 9, 2015
    Assignee: Taiwan-N Lighting Corporation Ltd.
    Inventors: Tai-Kuang Wang, Yu-Wen Cheng, Shih-Hsuan Yang