Abstract: The present disclosure relates to a micro-fluidic probe card that deposits a fluidic chemical onto a substrate with a minimal amount of fluidic chemical waste, and an associated method of operation. In some embodiments, the micro-fluidic probe card has a probe card body with a first side and a second side. A sealant element, which contacts a substrate, is connected to the second side of the probe card body in a manner that forms a cavity within an interior of the sealant element. A fluid inlet, which provides a fluid from a processing tool to the cavity, is a first conduit extending between the first side and the second side of the probe card body. A fluid outlet, which removes the fluid from the cavity, is a second conduit extending between the first side and the second side of the probe card body.

Abstract: A bearing device includes a body, a circular cover, and a through hole commonly defined through both the body and the cover. The body is an injection molded piece made from metal powder and molten binder. The cover is an injection molded piece made from metal powder and molten binder. Two passages are defined between the body and the cover, and each passage communicates the through hole with an exterior of the bearing device, whereby lubricant can flow from the through hole to the passages. A bearing assembly having the bearing device is also provided, and a method of manufacturing the bearing device is further provided.

Abstract: A method for adjusting saturation degree and a color adjusting system are provided. The method for adjusting saturation degree includes the following steps. A hue circle is divided into a plurality of hue regions, and each of the hue regions is divided into a plurality of saturation regions according to at least one saturation threshold. A plurality of first input saturation degrees of a first saturation region of a first hue region of the hue regions are weighted by a first weighting formula for obtaining a plurality of first output saturation degrees. A plurality of second input saturation degrees of a second saturation region of the first hue region of the hue regions are weighted by a second weighting formula for obtaining a plurality of second output saturation degrees. The first weighting formula is different from the second weighting formula.

Abstract: Embodiments of mechanisms of forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a gate stack structure formed on the substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stacks. The semiconductor device structure includes doped regions formed in the substrate. The semiconductor device structure also includes a strained source and drain (SSD) structure adjacent to the gate spacers, and the doped regions are adjacent to the SSD structure. The semiconductor device structure includes SSD structure has a tip which is closest to the doped region, and the tip is substantially aligned with an inner side of gate spacers.

Abstract: A voice verifying system, which comprises: a microphone, which is always turned on to output at least one voice signal; a speech determining device, for determining if the voice signal is valid or not according to a reference value, wherein the speech determining device passes the voice signal if the voice signal is valid; and a verifying module, for verifying a speech signal generated from the voice signal and for outputting a device activating signal to activate a target device if the speech signal matches a predetermined rule; and a reference value generating device, for generating the reference value according to speech signal information from the verifying module.

Abstract: The present invention is related to a method for cancer treatment comprising a step of administering to a subject in need thereof a therapeutically effective amount of a pharmaceutical composition comprising ferrous amino acid chelate and a pharmaceutically acceptable carrier. By means of amino acid chelating to ferrous and maintaining chelating state through the stomach, the pharmaceutical composition in accordance with the present invention would not cause any weight variation, and is suitable for inhibiting or treating cancer.

Abstract: A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device.

Abstract: An optoelectronic semiconductor device comprises a substrate, at least one solid via plug, at least one optoelectronic semiconductor chip, a phosphor layer and a molding body. The at least one solid via plug penetrates through the substrate. The at least one optoelectronic semiconductor chip has a first electrode aligned to and electrically connected with the solid via plug. The phosphor layer covers at least one surface of the optoelectronic semiconductor chip. The molding body encapsulates the substrate, the optoelectronic semiconductor chip and the phosphor layer. The number of solid valid plugs, substrate surfaces, electrodes, bonding pad on each surface of the substrate for forming each optoelectronic semiconductor device can be, for example, two, respectively.

Abstract: A lamp stand with faux flame is provided, including a lamp base, a support frame, a flame holder, a flame flake, a light-emitting body and a power supply, wherein power supply disposed inside lamp base; support frame fixedly standing upon lamp base; flame holder fixedly connected to top of support frame and having a vertical via hole; flame flake penetrating via hole and protruding beyond top of flame holder; light-emitting body fixed to flame holder and emitting light towards the direction of flame flake. The light-emitting body is electrically connected to power supply. The lamp stand further includes a motor, an actuator and a pusher. The motor is fixed to lamp base and electrically connected to power supply. The actuator is connected to output of motor. The pusher is disposed on top of actuator. The present invention can replace conventional candle to achieve visual effect of flickering flame.

Abstract: The present disclosure relates to a top-down method of forming a nanowire structure extending between source and drain regions of a nanowire transistor device, and an associated apparatus. In some embodiments, the method provides a substrate having a device layer disposed over a first dielectric layer. The device layer has a source region and a drain region separated by a device material. The first dielectric layer has an embedded gate structure abutting the device layer. One or more masking layers are selectively formed over the device layer to define a nanowire structure. The device layer is then selectively etched according to the one or more masking layers to form a nanowire structure at a position between the source region and the drain region. By forming the nanowire structure through a masking and etch process, the nanowire structure is automatically connected to the source and drain regions.

Abstract: The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (MEMS) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the MEMS structure. The method further includes forming a second sacrificial layer above the MEMS structure and within the release aperture, and forming a first cap over the second sacrificial layer and the MEMS structure, wherein a leg of the first cap is disposed between the MEMS structure and the release aperture. The method further includes removing the first sacrificial layer, removing the second sacrificial layer through the release aperture, and plugging the release aperture. A MEMS device formed by such a method is also provided.

Abstract: A lamp stand with faux flame is provided, including a lamp base, support frame, flame holder, flame flake, light-emitting body, power supply, driving device, impact arm and driving circuit; wherein power supply disposed inside lamp base; support frame standing upon lamp base; flame holder connected to support frame and having a vertical via hole; flame flake penetrating via hole and protruding beyond top of flame holder; light-emitting body fixed to flame holder and emitting light towards direction of flame flake; light-emitting body connected to power supply; driving device fixed to lamp base; one end of impact arm connected to driving device output. The driving circuit and power supply are connected and drive output end of the driving device to suck in or bounce out to generate a propulsion, making impact arm to hit flame flake. The present invention can replace conventional candle to achieve visual effect of flickering flame.

Abstract: A detection circuit is provided. A detection signal corresponding to an equivalent capacitance value of a micro-electro-mechanical system is generated by an oscillator, and the equivalent capacitance value of the micro-electro-mechanical system varies with a location of the micro-electro-mechanical system.

Abstract: The present disclosure provides methods of fabricating a biochip. The biochip includes a fluidic part, having through-substrate holes as inlets and outlets, and a sensing part bonded together using a bonding material. One or both of the parts has microfluidic channel patterns and one or more patterned surface modification layers formed using different methods to provide surface property for binding bioreceptors and for flowing analytes. The patterning includes lithography, etching, washing, selective depositing using printing or self-assembly of surface chemistry.

Abstract: MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.

Abstract: A method for forming a MEMS device is provided. The method includes the following steps of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate; and fabricating a bulk silicon sensor on the second portion of the substrate.

Abstract: A wireless intraocular pressure monitoring device includes reflecting and detecting modules. The reflecting module includes a soft contact lens having a curvature corresponding to that of a cornea while worn. A metal layer is embedded in and deformable with the soft contact lens. The detecting module includes two waveguides, an oscillator, and a converting unit. The oscillator is operable to generate oscillation signals having a frequency dependent on an equivalent impedance of the waveguides such that the equivalent impedance corresponds to intraocular pressure. The converting unit is operable for receiving and converting the oscillation signals into an output signal corresponding to the intraocular pressure.

Abstract: A method of forming a semiconductor device comprises forming a base wafer comprising a first chip package portion, a second chip package portion, and a third chip package portion. The method also comprises forming a capping wafer comprising a plurality of isolation trenches, each of the plurality of isolation trenches being configured to substantially align with one of the first chip package portion, the second chip package portion or the third chip package portion. The method further comprises eutectic bonding the capping wafer and the base wafer to form a wafer package. The method additionally comprises dicing the wafer package into a first chip package, a second chip package, and a third chip package. The method also comprises placing the first chip package, the second chip package, and the third chip package onto a substrate.

Abstract: A method for forming thin film solar cell materials introducing a first inert gas mixture that includes hydrogen selenide into a chamber at a first pressure value until the chamber reaches a second pressure value and at a first temperature value, wherein the second pressure value is a predefined percentage of the first pressure value. The temperature in the chamber is increased to a second temperature value for a selenization process so that the pressure in the chamber increases to a third pressure value. Residual gas that is generated during the selenization process can be removed from the chamber. A second inert gas mixture that includes hydrogen sulfide is added into the chamber until the chamber reaches a fourth pressure value. The temperature in the chamber is increased to a third temperature value for a sulfurization process. The chamber is cooled after the sulfurization process.

Abstract: A method for forming an integrated semiconductor device includes providing a first wafer, providing a second wafer, and bonding the first wafer over the second wafer. The first wafer includes a first substrate having a microelectromechanical system (MEMS) device layer. The second wafer includes a second substrate having at least one active device, and at least one interconnect layer over the second substrate. The MEMS device layer is connected with the at least one interconnect layer. The method further includes forming at least one conductive plug through the first substrate and the MEMS device layer and inside the at least one interconnect layer, etching the second substrate and the at least one interconnect layer to form a cavity extending from a surface of the second substrate to the MEMS device layer, and etching the first substrate and the MEMS device layer to form a MEMS device interfacing with the cavity.