Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9000578
    Abstract: A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: April 7, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Pao Shu, Chun-wen Cheng, Kuei-Sung Chang
  • Publication number: 20150092963
    Abstract: The present invention discloses a piezoelectric loudspeaker. The piezoelectric loudspeaker comprises a sound producing plate, a resonant sound-box, a surround and a reflective sound-box. The sound producing plate comprises a piezoelectric ceramic element. The resonant sound-box includes a first opening comprising a first carrying part. The sound producing plate is disposed on the first carrying part. A cavity resonator is formed between the sound producing plate and the resonant sound-box. The surround is disposed between the first carrying part and the sound producing plate. The reflective sound-box includes a second opening and a reflective output opening. The second opening comprises a second carrying part. The resonant sound-box is disposed on the second carrying part. A reflective cavity body is formed between the resonant sound-box and the reflective sound-box, and the reflective cavity body is connected the reflective output opening.
    Type: Application
    Filed: January 27, 2014
    Publication date: April 2, 2015
    Applicant: Miezo Inc.
    Inventors: Yuan-Ping LIU, Chang-Heng TSAI, Kai-Wen CHENG, Chung-chun HO
  • Publication number: 20150091153
    Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng
  • Patent number: 8995102
    Abstract: A display and an electrostatic discharge protection apparatus are disclosed, wherein the display includes a display module, a flex flat cable, a motherboard, and an electrostatic discharge protection apparatus. The flex flat cable is electrically connected with the display module and the motherboard; the electrostatic discharge protection apparatus is disposed between the flex flat cable and the display module. The electrostatic discharge protection apparatus has an isolation board and at least one isolation pad, the isolation board includes a first surface and a second surface, and at least one part of the first surface is attached to the flex flat cable; the isolation pad comprises a first isolation surface, and the first isolation surface is combined with the second surface.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: March 31, 2015
    Assignee: Wistron Corporation
    Inventors: Kuo-Cheng Lu, Wen-Cheng Chang
  • Publication number: 20150076710
    Abstract: The present disclosure provides one embodiment of a stacked semiconductor device. The stacked semiconductor device includes a first substrate; a first bond pad over the first substrate; a second substrate including a second electrical device fabricated thereon; a second bond pad over the second electrical device over the second substrate, the second bond pad electrically connecting to the second electrical device; a second insulation layer over the second bond pad having a top surface, the second insulation layer being bonded toward the first bond pad of the first substrate; and a through-substrate-via (“TSV”) extending from a surface opposite to the first bond pad through the first substrate and through the top surface of the second insulation layer to the second bond pad.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventors: Kuei-Sung Chang, Chun-wen Cheng, Alexander Kalnitsky, Chia-Hua Chu
  • Publication number: 20150075426
    Abstract: The present invention relates to a pulsed laser deposition system, and particularly relates to a pulsed laser deposition system capable of using several different targets. In the pulsed laser deposition system, a beam-splitting device is provided to split a UV laser beam into several UV laser beams and to introduce these UV laser beams to different targets simultaneously. Therefore, the pulsed laser deposition system can use several different targets and can be used to form doped epitaxial layer (III-V semiconductor film) and ternary or quaternary epitaxial layer (III-V semiconductor film).
    Type: Application
    Filed: January 17, 2014
    Publication date: March 19, 2015
    Applicant: National Taiwan University
    Inventors: CHING-FUH LIN, Yu-Wen CHENG, Hao-Yu WU
  • Publication number: 20150081945
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to manage cache memory in multi-cache environments. A disclosed apparatus includes a remote cache manager to identify a remote cache memory communicatively connected to a bus, a delegation manager to constrain the remote cache memory to share data with a host cache memory via the bus, and a lock manager to synchronize the host cache memory and the remote cache memory with a common lock state.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 19, 2015
    Inventors: Shiow-Wen Cheng, Robert Joseph Woodruff
  • Publication number: 20150076505
    Abstract: The present invention relates to a patterned opto-electrical substrate, comprising a substrate, the substrate has a first patterned structure, a spacer region and a second patterned structure, wherein the second patterned structure is formed on one or both of the first patterned structure and the spacer region, and the first patterned structure is a micron-scale protruding structure or a micron-scale recessing structure, while the second patterned structure is a submicron-scale recessing structure. The present invention also relates to a method for manufacturing the aforementioned patterned opto-electrical substrate and light emitting diodes having the aforementioned patterned opto-electrical substrate.
    Type: Application
    Filed: December 12, 2013
    Publication date: March 19, 2015
    Applicant: Kinik Company
    Inventors: Wen-Cheng KE, Wei-Kuo CHEN, Fwu-Yih HOUNG, Chia-Che HO
  • Publication number: 20150079704
    Abstract: The present disclosure relates to a micro-fluidic probe card that deposits a fluidic chemical onto a substrate with a minimal amount of fluidic chemical waste, and an associated method of operation. In some embodiments, the micro-fluidic probe card has a probe card body with a first side and a second side. A sealant element, which contacts a substrate, is connected to the second side of the probe card body in a manner that forms a cavity within an interior of the sealant element. A fluid inlet, which provides a fluid from a processing tool to the cavity, is a first conduit extending between the first side and the second side of the probe card body. A fluid outlet, which removes the fluid from the cavity, is a second conduit extending between the first side and the second side of the probe card body.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Jung-Huei Peng, Yi-Shao Liu, Fei-Lung Lai, Shang-Ying Tsai
  • Patent number: 8979377
    Abstract: A bearing device includes a body, a circular cover, and a through hole commonly defined through both the body and the cover. The body is an injection molded piece made from metal powder and molten binder. The cover is an injection molded piece made from metal powder and molten binder. Two passages are defined between the body and the cover, and each passage communicates the through hole with an exterior of the bearing device, whereby lubricant can flow from the through hole to the passages. A bearing assembly having the bearing device is also provided, and a method of manufacturing the bearing device is further provided.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: March 17, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Wen-Cheng Chen, Ming-Hsiu Chung
  • Publication number: 20150069466
    Abstract: Embodiments of mechanisms of forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a gate stack structure formed on the substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stacks. The semiconductor device structure includes doped regions formed in the substrate. The semiconductor device structure also includes a strained source and drain (SSD) structure adjacent to the gate spacers, and the doped regions are adjacent to the SSD structure. The semiconductor device structure includes SSD structure has a tip which is closest to the doped region, and the tip is substantially aligned with an inner side of gate spacers.
    Type: Application
    Filed: September 10, 2013
    Publication date: March 12, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Cheng CHANG, Tung-Wen CHENG, Yi-Jen CHEN, Yung-Jung CHANG
  • Publication number: 20150070404
    Abstract: A method for adjusting saturation degree and a color adjusting system are provided. The method for adjusting saturation degree includes the following steps. A hue circle is divided into a plurality of hue regions, and each of the hue regions is divided into a plurality of saturation regions according to at least one saturation threshold. A plurality of first input saturation degrees of a first saturation region of a first hue region of the hue regions are weighted by a first weighting formula for obtaining a plurality of first output saturation degrees. A plurality of second input saturation degrees of a second saturation region of the first hue region of the hue regions are weighted by a second weighting formula for obtaining a plurality of second output saturation degrees. The first weighting formula is different from the second weighting formula.
    Type: Application
    Filed: February 17, 2014
    Publication date: March 12, 2015
    Applicant: Au Optronics Corporation
    Inventors: Hui Chu Ke, Sheng-Wen Cheng
  • Publication number: 20150073799
    Abstract: A voice verifying system, which comprises: a microphone, which is always turned on to output at least one voice signal; a speech determining device, for determining if the voice signal is valid or not according to a reference value, wherein the speech determining device passes the voice signal if the voice signal is valid; and a verifying module, for verifying a speech signal generated from the voice signal and for outputting a device activating signal to activate a target device if the speech signal matches a predetermined rule; and a reference value generating device, for generating the reference value according to speech signal information from the verifying module.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: Mediatek Inc.
    Inventors: Liang-Che Sun, Yiou-Wen Cheng, Ting-Yuan Chiu
  • Publication number: 20150060954
    Abstract: A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Kai-Chih Liang, Chia-Hua Chu
  • Publication number: 20150065569
    Abstract: The present invention is related to a method for cancer treatment comprising a step of administering to a subject in need thereof a therapeutically effective amount of a pharmaceutical composition comprising ferrous amino acid chelate and a pharmaceutically acceptable carrier. By means of amino acid chelating to ferrous and maintaining chelating state through the stomach, the pharmaceutical composition in accordance with the present invention would not cause any weight variation, and is suitable for inhibiting or treating cancer.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 5, 2015
    Inventors: Tsun-Yuan Lin, Mu-Kuei Chen, Tsang-Tse Chen, Chai-Hui Fu, Hsun-Jin Jan, Wen-Cheng Chiu
  • Publication number: 20150060911
    Abstract: An optoelectronic semiconductor device comprises a substrate, at least one solid via plug, at least one optoelectronic semiconductor chip, a phosphor layer and a molding body. The at least one solid via plug penetrates through the substrate. The at least one optoelectronic semiconductor chip has a first electrode aligned to and electrically connected with the solid via plug. The phosphor layer covers at least one surface of the optoelectronic semiconductor chip. The molding body encapsulates the substrate, the optoelectronic semiconductor chip and the phosphor layer. The number of solid valid plugs, substrate surfaces, electrodes, bonding pad on each surface of the substrate for forming each optoelectronic semiconductor device can be, for example, two, respectively.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Applicant: Unistars Corporation
    Inventors: Wen-Cheng CHIEN, Tien-Hao HUANG, Shang-Yi WU
  • Publication number: 20150055331
    Abstract: A lamp stand with faux flame is provided, including a lamp base, a support frame, a flame holder, a flame flake, a light-emitting body and a power supply, wherein power supply disposed inside lamp base; support frame fixedly standing upon lamp base; flame holder fixedly connected to top of support frame and having a vertical via hole; flame flake penetrating via hole and protruding beyond top of flame holder; light-emitting body fixed to flame holder and emitting light towards the direction of flame flake. The light-emitting body is electrically connected to power supply. The lamp stand further includes a motor, an actuator and a pusher. The motor is fixed to lamp base and electrically connected to power supply. The actuator is connected to output of motor. The pusher is disposed on top of actuator. The present invention can replace conventional candle to achieve visual effect of flickering flame.
    Type: Application
    Filed: August 23, 2013
    Publication date: February 26, 2015
    Inventor: Wen-Cheng Lai
  • Publication number: 20150053925
    Abstract: The present disclosure relates to a top-down method of forming a nanowire structure extending between source and drain regions of a nanowire transistor device, and an associated apparatus. In some embodiments, the method provides a substrate having a device layer disposed over a first dielectric layer. The device layer has a source region and a drain region separated by a device material. The first dielectric layer has an embedded gate structure abutting the device layer. One or more masking layers are selectively formed over the device layer to define a nanowire structure. The device layer is then selectively etched according to the one or more masking layers to form a nanowire structure at a position between the source region and the drain region. By forming the nanowire structure through a masking and etch process, the nanowire structure is automatically connected to the source and drain regions.
    Type: Application
    Filed: August 23, 2013
    Publication date: February 26, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Shao Liu, Fei-Lung Lai, Chun-Wen Cheng
  • Patent number: 8962367
    Abstract: The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (MEMS) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the MEMS structure. The method further includes forming a second sacrificial layer above the MEMS structure and within the release aperture, and forming a first cap over the second sacrificial layer and the MEMS structure, wherein a leg of the first cap is disposed between the MEMS structure and the release aperture. The method further includes removing the first sacrificial layer, removing the second sacrificial layer through the release aperture, and plugging the release aperture. A MEMS device formed by such a method is also provided.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 24, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hsien Lin, Chia-Hua Chu, Chun-Wen Cheng
  • Publication number: 20150049472
    Abstract: A lamp stand with faux flame is provided, including a lamp base, support frame, flame holder, flame flake, light-emitting body, power supply, driving device, impact arm and driving circuit; wherein power supply disposed inside lamp base; support frame standing upon lamp base; flame holder connected to support frame and having a vertical via hole; flame flake penetrating via hole and protruding beyond top of flame holder; light-emitting body fixed to flame holder and emitting light towards direction of flame flake; light-emitting body connected to power supply; driving device fixed to lamp base; one end of impact arm connected to driving device output. The driving circuit and power supply are connected and drive output end of the driving device to suck in or bounce out to generate a propulsion, making impact arm to hit flame flake. The present invention can replace conventional candle to achieve visual effect of flickering flame.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 19, 2015
    Inventor: Wen-Cheng LAI