Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

Abstract: A biochip includes a substrate, where the substrate includes at least one hole extending from a first surface of the substrate to a second surface of the substrate opposite the first surface, and where the substrate comprises a microfluidic channel pattern. The biochip further includes a surface modification layer over the substrate. Additionally, the biochip includes a sensing wafer bonded to the substrate, where the sensing wafer has one or more modified surface patterns having different surface properties from each other.

Abstract: A flexible positioning post includes a base, a metal post and a plurality of metal elastic pieces. The base has an upper surface. The metal post has a first end and a second end opposite to each other, and the first end is connected to the upper surface of the base. Each of the metal elastic pieces has a fixed end and a free end opposite to each other. The fixed end is securely assembled at the second end of the metal post, and the free end is adjacent to the upper surface of the base and bent toward the metal post to form a bending portion. Consequently, upon receiving a foreign force, the free end of each of the metal elastic pieces is moved toward the metal post; conversely, once the foreign force is removed, the free end of each of the metal elastic pieces is moved resiliently.

Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate, a cap substrate, and a MEMS substrate bonded between the CMOS substrate and the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first closed chamber and a second closed chamber, which are between the MEMS substrate and the cap substrate. The first movable element is in the first closed chamber, and the second movable element is in the second closed chamber. A first pressure of the first closed chamber is higher than a second pressure of the second closed chamber.

Abstract: MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.

Abstract: A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first enclosed space surrounded by the MEMS substrate and the cap substrate, and the first movable element is in the first enclosed space. The MEMS device further includes a second enclosed space surrounded by the MEMS substrate and the cap substrate, and the second movable element is in the second enclosed space. In addition, the MEMS device includes a pressure-changing layer in the first enclosed space.

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.

Abstract: A communication system is provided. The communication system includes a main electronic device and an auxiliary electronic device. The auxiliary electronic device would send a connection sound wave signal. When the main electronic device receives the connection sound wave signal, the main electronic device sends a positioning signal. When the auxiliary electronic device receives the positioning signal, the auxiliary electronic device sends a positioning sound wave signal to the main electronic device. Moreover, the main electronic device determines a relative position of the auxiliary electronic device and the main electronic device according to the positioning sound wave signal, and displays an operating icon on a display unit of the main electronic device according to the relative position.

Abstract: A device includes a biosensor, a sensing circuit electrically connected to the biosensor, a quantizer electrically connected to the sensing circuit, a digital filter electrically connected to the quantizer, a selective window electrically connected to the digital filter, and a decision unit electrically connected to the selective window.

Abstract: Presented herein are techniques to reduce error probability and eliminate the lingering signal that causes problems during audio signal data transmission. An electroacoustic transducer of a first electronic device receives a data encoded audio signal that includes modulated digital data therein. The data encoded audio signal is demodulated to produce a present input signal that includes a target frequency and a lingering effect of a previously received data encoded audio signal. Lingering cancellation is performed on the present input signal to produce a present output signal from which the lingering effect of the previously received data encoded audio signal has been removed.

Abstract: Provided are a eukaryotic expression system and its applications. The eukaryotic expression system has a recombinant plant cell. The recombinant plant cell includes a first vector and a second vector. The first vector expresses a fusion protein containing an Asia tospoviral common epitope. The fusion protein containing Asia tospoviral common epitope consists of an amino acid sequence as set forth in SEQ ID NO. 1, and a predetermined protein fragment connecting to the Asia tospoviral common epitope. The above eukaryotic expression system is useful for monitoring the interaction between proteins via use of a specific peptide to tag the predetermined protein and demonstrates high sensitivity and stability.

Abstract: The present disclosure provides a device, such as a FET sensing cell, which includes a first dielectric layer over a substrate, an active layer over the first dielectric layer, a source region in the active layer, a drain region in the active layer, a channel region in the active layer situated between the source region and the drain region, a sensing film over the channel region, a second dielectric layer over the active layer, wherein an opening is formed in the second dielectric layer and the sensing film is located within the opening, a first electrode located within the second dielectric layer and a fluidic gate region located over the second dielectric layer and extending into the opening. The present disclosure also provides a method for improving the sensitivity of a device by adjusting a sensing value.

Abstract: The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.

Abstract: A method for converting input RGB data signals to output RGBW data signals for use in an OLED display is disclosed. In the OLED display, each pixel has three color sub-pixels in RGB and one W sub-pixel. Input RGB data signals in signal space are normalized and converted into input data in luminance space. A baseline adjustment level is determined from the input data and is used to compute baseline adjusted data in luminance space. After being converted from luminance space into signal space, baseline adjusted data in RGBW are represented by N binary bits presented to the four sub-pixels. To suit the color characteristics of the display, color-temperature correction to the output signals is also carried out. In luminance space, the maximum color-temperature corrected output data fall within the range of 0.4/k and 0.5/k, with k being the ratio of W sub-pixel area to the color sub-pixel area.

Abstract: Cryogenic pump apparatuses include nanostructure material to achieve an ultra-high vacuum level. The nanostructure material can be mixed with either an adsorbent material or a fixed glue layer which is utilized to fix the adsorbent material. The nanostructure material's good thermal conductivity and adsorption properties help to lower working temperature and extend regeneration cycle of the cryogenic pumps.

Abstract: A method for setting addresses of slave devices in a communication network is provided. In the communication network, a master device identifies address-collided slave devices and requests the address-collided slave devices to return their unique identification data. The master device sets addresses of the address-collided slave devices so that each of the slave devices in the communication network has a different address from one another.

Abstract: Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the SOI substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a MEMS device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the MEMS device.

Abstract: A method for contacting MOS devices. First openings in a photosensitive material are formed over a substrate having a top dielectric in a first die area and a second opening over a gate stack in a second die area having the top dielectric, a hard mask, and a gate electrode. The top dielectric layer is etched to form a semiconductor contact while etching at least a portion the hard mask layer thickness over a gate contact area exposed by the second opening. An inter-layer dielectric (ILD) is deposited. A photosensitive material is patterned to generate a third opening in the photosensitive material over the semiconductor contact and a fourth opening inside the gate contact area. The ILD is etched through to reopen the semiconductor contact while etching through the ILD and residual hard mask if present to provide a gate contact to the gate electrode.

Abstract: A nail gun includes a body, a valve unit, a nail striking member and a detector. The body has a nail path, an air chamber, and an intake chamber guiding flow of air into the air chamber. The nail striking member is drivable by air pressure in the air chamber for striking a nail in the nail path. The valve unit is operable to switch between unblocking and blocking states to respectively permit and prevent fluid communication between the intake chamber and the air chamber. The detector is connected pivotally to the body, and is contactable with the valve unit such that, when there is no nail in the nail path, the valve unit is controlled by the detector to be in the blocking state.

Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate and a MEMS substrate bonded with the CMOS substrate. The CMOS substrate includes a semiconductor substrate, a first dielectric layer formed over the semiconductor substrate, and a plurality of conductive pads formed in the first dielectric layer. The MEMS substrate includes a semiconductor layer having a movable element and a second dielectric layer formed between the semiconductor layer and the CMOS substrate. The MEMS substrate also includes a closed chamber surrounding the movable element. The MEMS substrate further includes a blocking layer formed between the closed chamber and the first dielectric layer of the CMOS substrate. The blocking layer is configured to block gas, coming from the first dielectric layer, from entering the closed chamber.