Abstract: A method for evaluating the therapeutic efficacy of interferon (IFN)/ribavirin (RBV) for hepatitis C is disclosed. The method includes the steps of providing a specimen; mixing the specimen, a primer of a miRNA Let-7g and a poly-chain reaction (PCR) reagent together; and evaluating the efficacy of IFN/RBV on inhibiting a hepatitis C virus according to the expressing level of the miRNA Let-7g in the specimen detected by the PCR reagent.

Abstract: A manufacturing method of a chip package structure includes following steps. A substrate including a first metal layer, a second metal layer, and an insulation layer located between the first and the second metal layers is provided. A first groove is formed in the first metal layer to form a chip pad and bonding pads. The bonding pads are respectively located in recesses of the chip pad. A second groove is formed in the second metal layer to form a heat-dissipation block and terminal pads. The terminal pads are respectively located in recesses of the heat-dissipation block. Conductive vias are formed to connect the corresponding terminal pads and electrically connect the bonding pads with the terminal pads. A chip is disposed on the chip pad and electrically connected to the bonding pads. An encapsulant covering the chip is formed.

Abstract: A waterproof paint formula and a pen device for using the same. The concentration of the formula may be adjusted by changing the weight percentage of the aqueous solution and cooperate with different outlet diameter of the nibs to make the waterproof paint smoothly flow out for painting on the writings. Simultaneously, the weight percentage of Ethyl Alcohol may be adjusted to control the air-dried speed of the waterproof paint to achieve the effects of waterproof and preventing the inks or colors from diffusion.

Abstract: A multi-chip package structure includes a first chip, a second chip, a circuit layer, a plurality of first conductive bumps, a plurality of second conductive bumps and an underfill. The first chip has a chip bonding region, a plurality of first inner pads and first outer pads. The circuit layer is disposed on the first chip and includes a plurality of insulating layers and at least one metal layer. The insulating layers have a groove disposed between the first inner pads and the first outer pads and surrounding the first inner pads. The first conductive bumps are disposed on the first outer pads. The second chip is flipped on the chip bonding region. Each first inner pad is electrically connected to a second pad of the second chip through the second conductive bump. The underfill is disposed between the first and second chips and covers the second conductive bumps.

Abstract: A multi-chip package structure includes a first chip, at least one blocking structure, a plurality of first conductive bumps, a second chip, a plurality of second conductive bumps and an underfill. The first chip has a chip connecting zone, a plurality of first inner pads in the chip connecting zone and a plurality of first outer pads outside of the chip connecting zone. The blocking structure is disposed between the first inner pads and the first outer pads and surrounds the first inner pads. The first conductive bumps are disposed on the first outer pads. The second chip is flipped on the chip connecting zone and has a plurality of second pads. The second conductive bumps are disposed between the first inner pads and the second pads. The underfill is disposed between the first chip and the second chip so as to cover the second conductive bumps.

Abstract: A multi-chip package structure includes a first chip, at least one blocking structure, a plurality of first conductive bumps, a second chip, a plurality of second conductive bumps and an underfill. The first chip has a chip connecting zone, a plurality of first inner pads in the chip connecting zone and a plurality of first outer pads outside of the chip connecting zone. The blocking structure is disposed between the first inner pads and the first outer pads and surrounds the first inner pads. The first conductive bumps are disposed on the first outer pads. The second chip is flipped on the chip connecting zone and has a plurality of second pads. The second conductive bumps are disposed between the first inner pads and the second pads. The underfill is disposed between the first chip and the second chip so as to cover the second conductive bumps.

Abstract: A headphone wireless expansion device for switching among multiple targets is connected to an information device to receive audio data which is then transmitted to a headphone for playing. The headphone wireless expansion device includes multi-target connection data and an audio control mechanism. The multi-target connection data includes a plurality of device identification codes, a plurality of device authorization codes corresponding to a plurality of information devices respectively, and a plurality of audio tags corresponding to the device identification codes and the device authorization codes respectively. The audio control mechanism searches the audio tag having audio features same as that of the unrecognized audio signal, and reads the corresponding device identification code and device authorization code.

Abstract: A waterproof piezoelectric ceramic speaker includes a ceramic composite and a vibration membrane. The ceramic composite includes a ceramic plate and a driving electrode assembly arranged on the ceramic plate and supplying a driving voltage to the ceramic plate to generate vibration for the ceramic plate. The vibration membrane includes a first vibration layer and a second vibration layer respectively adhered to two opposite surfaces of the ceramic composite. The first vibration layer and the second vibration layer respectively have a resonance member adhered to the ceramic plate and resonating with the ceramic plate synchronously, a waterproof member connecting with the resonance member to seal the driving electrode assembly, and a bonding member extending from a perimeter of the resonance member to seal the resonance member.

Abstract: An extensible curtain rail includes a rail main body, more than one connection seat and a decorative panel. The decorative panel and the rail main body are assembled and connected with each other by means of the connection seat. The connection seat can be inward contracted or outward extended to adjust the gap between the decorative panel and the rail main body in accordance with different sizes of curtain assemblies to facilitate installation thereof. The decorative panel is detachable from the rail main body to provide larger installation space and more quickly install the curtain assembly.

Abstract: An operating device and an electronic device using the same are provided. The operating device includes a base, an electronic circuit board, a lever and a slider. The base includes a bearer. The electronic circuit board is disposed on the base. The lever is disposed on the electronic circuit board. The slider is movably disposed on the sliding portion for triggering the lever.

Abstract: A roller curtain includes two suspending curtain sheets controlled by a curtain-controlling reel to move up and down, several layers of transverse curtain sheets interconnected between the suspending curtain sheets at intervals, and two weights disposed at lower ends of the suspending curtain sheets. Each transverse curtain sheet includes an upper sheet and a lower sheet. Two sides of the upper and lower sheets are bent to form different shading areas of sunlight shading fabric faces. The upper sheet is overlaid on the lower sheet and the sunlight shading fabric faces are sown on the two suspending curtain sheets at different heights to define a receiving space for placing therein a nontransparent sunlight shading fabric layer. When shading the sunlight, the suspending curtain sheets get closer to and attach to each other and the transverse curtain sheets become upright to shade the sunlight.

Abstract: An adaptive duo-gate MOSFET includes a trench MOSFET and an adaptive element. The trench MOSFET includes a source, a drain, a first gate, a second gate, and a dielectric layer between the first and second gates. Herein, the first gate may generate charge-coupling in blocking operation, and the second gate may form channel in the trench MOSFET when in conduction operation. The adaptive element is electrically coupled to the first gate, the second gate, and the source respectively. When a potential difference between the second gate and the source is larger than a predetermined value, the first gate and the source are electrically disconnected and then the first gate and the second gate are electrically connected. After a predetermined time, the first gate and the second gate are electrically disconnected and then the first gate and the source are electrically connected.

Abstract: A waterproof paint formula and a pen device for using the same are disclosed. The concentration of the formula may be adjusted by changing the weight percentage of the aqueous solution and cooperate with different outlet diameter of the nibs to make the waterproof paint smoothly flow out for painting on the writings. Simultaneously, the weight percentage of Ethyl Alcohol may be adjusted to control the air-dried speed of the waterproof paint to achieve the effects of waterproof and preventing the inks or colors from diffusion.

Abstract: A touch panel including a substrate, a plurality of first and second sensing series, and a plurality of conductive repairing pattern layers is provided. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and second bridge lines, and the second bridge lines serially connect two adjacent second sensing pads. Each conductive repairing pattern layer electrically floating locates around the crossover region of the first and second sensing series. Two adjacent sensing pads are connected by the conductive repairing pattern layer after a repair procedure is finished.

Abstract: A sun-shading adjustment structure of zebra shade includes a shade sheet winding unit, a shade sheet adjustment unit, a shade component fixing unit, a support unit, a decorative board locating unit and a lower weight unit. The shade component fixing unit is mounted under upper wall face on inner side of a window. The shade sheet winding unit and the shade sheet adjustment unit are back and forth side by side arranged under the shade component fixing unit. The support unit serves to support the shade sheet adjustment unit and keep it straight. When the shade sheet is wound up by the shade sheet winding unit, in the case that a gap exists on the shade sheet to allow sunlight to get in, the shade sheet adjustment unit is used to adjust the alignment error of the transparent faces and the nontransparent faces of the shade sheet so as to eliminate the gap.

Abstract: An adaptive duo-gate MOSFET includes a trench MOSFET and an adaptive element. The trench MOSFET includes a source, a drain, a first gate, a second gate, and a dielectric layer between the first and second gates. Herein, the first gate may generate charge-coupling in blocking operation, and the second gate may form channel in the trench MOSFET when in conduction operation. The adaptive element is electrically coupled to the first gate, the second gate, and the source respectively. When a potential difference between the second gate and the source is larger than a predetermined value, the first gate and the source are electrically disconnected and then the first gate and the second gate are electrically connected. After a predetermined time, the first gate and the second gate are electrically disconnected and then the first gate and the source are electrically connected.

Abstract: A multi-chip package structure includes a first chip, a second chip, a circuit layer, a plurality of first conductive bumps, a plurality of second conductive bumps and an underfill. The first chip has a chip bonding region, a plurality of first inner pads and first outer pads. The circuit layer is disposed on the first chip and includes a plurality of insulating layers and at least one metal layer. The insulating layers have a groove disposed between the first inner pads and the first outer pads and surrounding the first inner pads. The first conductive bumps are disposed on the first outer pads. The second chip is flipped on the chip bonding region. Each first inner pad is electrically connected to a second pad of the second chip through the second conductive bump. The underfill is disposed between the first and second chips and covers the second conductive bumps.