Patents by Inventor Wen Hao

Wen Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11928416
    Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Chih Ou, Kuo-Fu Lee, Wen-Hao Chen, Keh-Jeng Chang, Hsiang-Ho Chang
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 11920237
    Abstract: The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Patent number: 11921855
    Abstract: An adaptor includes non-volatile memory that stores a scan engine. A removable storage device is connected to the adaptor, which in turn is connected to a host computer. Files being copied between the removable storage device and the host computer through the adaptor are scanned for malware using the scan engine.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: March 5, 2024
    Assignee: TXOne Networks Inc.
    Inventors: Wen-Hao Cheng, Hsiao-Pei Tien, Pao-Han Lee
  • Publication number: 20240071965
    Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Tung-Liang Shao, Yu-Sheng Huang, Wen-Hao Cheng, Chen-Hua Yu
  • Patent number: 11914275
    Abstract: Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: February 27, 2024
    Assignee: Coretronic Corporation
    Inventors: Jui-Cheng Tseng, Wen-Hao Chu
  • Publication number: 20240063297
    Abstract: A semiconductor device includes a substrate, a channel layer, an insulating layer, source/drain contacts, a gate dielectric layer, and a gate electrode. The channel layer over the substrate and includes two dimensional (2D) material. The insulating layer is on the channel layer. The source/drain contacts are over the channel layer. The gate dielectric layer is over the insulating layer and the channel layer. The gate electrode is over the gate dielectric layer and between the source/drain contacts.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tse-An CHEN, Lain-Jong LI, Wen-Hao CHANG, Chien-Chih TSENG
  • Publication number: 20240063728
    Abstract: An electronic transformer includes a first forward rectifier, a second forward rectifier, a third forward rectifier and a backward rectifier. The first forward rectifier is coupled between a first-phase power and a first output terminal. The second forward rectifier is coupled between a second-phase power and the first output terminal. The third forward rectifier is coupled between a third-phase power and the first output terminal. The backward rectifier is coupled between a neutral line and a second output terminal. The first forward rectifier, the second forward rectifier, and the third forward rectifier are configured to half-wave rectify the first-phase power, the second-phase power, and the third-phase power to generate rectified first-phase to third-phase power sources, and superimpose the rectified first-phase to third-phase power sources on the first output end to serve as an output voltage of the electronic transformer.
    Type: Application
    Filed: November 15, 2022
    Publication date: February 22, 2024
    Inventors: Si-Wei CHEN, Wen-Hao KUO
  • Patent number: 11905964
    Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 20, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Chu-Hsien Chou, Yi-Chih Lin, Pei-Chuan Lee, Wen-Hao Liu
  • Publication number: 20240039518
    Abstract: A device including a first supply voltage track, a second supply voltage track, a first reference track, a first standard cell, and a second standard cell. The first supply voltage track is configured to provide a first voltage and the second supply voltage track is configured to provide a second voltage that is greater than the first voltage. The first standard cell is configured to be electrically connected to the first supply voltage track to receive the first voltage and electrically connected to the first reference track. The second standard cell is configured to be electrically connected to the second supply voltage track to receive the second voltage and electrically connected to the first reference track.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 1, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chih Ou, Wen-Hao Chen
  • Publication number: 20240036449
    Abstract: A light source module applicable to a projection device includes a heat dissipation assembly, a first light source, and a second light source. The heat dissipation assembly includes first and second heat dissipation components. The first heat dissipation component includes a first base and a first fin set. The first fin set has a first ventilation surface. The second heat dissipation component includes a second base and a second fin set. The second base has a first surface, a second surface and a ventilation opening. The first surface is opposite to the second surface. The second fin set is arranged on the first surface. The second surface faces the first ventilation surface. The ventilation opening penetrates the first and second surfaces and is aligned with the first ventilation surface. The first light source is arranged on the first base. The second light source is arranged on the second base.
    Type: Application
    Filed: July 27, 2023
    Publication date: February 1, 2024
    Inventors: WEI-YI LEE, WEN-HAO CHU
  • Publication number: 20240040831
    Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 1, 2024
    Inventors: Chung-chia CHEN, Jungmin LEE, Yu-hsin LIN, Ji Young CHOUNG, Wen-Hao WU, Dieter HAAS, Si Kyoung KIM
  • Publication number: 20240026462
    Abstract: The present disclosure provides a method, a system and a kit for assessing the homologous recombination deficiency (HRD) status of a subject. The present disclosure further provides a method, a system and a kit for identifying a treatment based on the HRD status for the human subject.
    Type: Application
    Filed: August 13, 2021
    Publication date: January 25, 2024
    Inventors: WOEI-FUH WANG, YA-CHI YEH, YING-JA CHEN, SHU-JEN CHEN, CHIEN-HUNG CHEN, KUAN-YING CHEN, WEN-HAO TAN
  • Publication number: 20240020456
    Abstract: Systems and methods for improving design performance of a layout design through placement of functional and spare cells by leveraging layout dependent effect (LDE) is disclosed. The method includes the steps of: importing a plurality of technology files associated with the layout design into an EDA system; importing a netlist associated with the layout design into the EDA system; importing a standard cell library containing pattern-S timing information of the functional cells and the spare cells; performing floorplan and spare cell insertion, wherein the spare cells are distributed uniformly across the floorplan; and conducting placement and optimization through re-placement of the at least one functional cells and the spare cells to form pattern-S with at least one timing critical cells to improve an overall timing performance of the layout design.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 18, 2024
    Inventors: Chun-Yao Ku, Jyun-Hao Chang, Ming-Tao Yu, Wen-Hao Chen
  • Publication number: 20240019758
    Abstract: An optical device includes a first ring resonator with a first radius, a second ring resonator with a second radius, and an optical waveguide feeding the first and second ring resonators in parallel. The first and second ring resonators are positioned on opposing sides of the optical waveguide. The first and second ring resonators and the optical waveguide are disposed above a semiconductor substrate.
    Type: Application
    Filed: April 24, 2023
    Publication date: January 18, 2024
    Inventor: Wen-Hao Cheng
  • Publication number: 20240011160
    Abstract: A precursor supply system for thin film deposition is provided. The precursor supply system includes a precursor source container, and the precursor source container includes: a top wall; a bottom wall; a side wall circumferentially connecting the top wall and the bottom wall, wherein at least a portion of an interior surface of the precursor source container has a three-dimensional (3D) pattern; an inlet configured to allow introduction of a carrier gas into the precursor source container; and an outlet configured to allow exit of a precursor vapor generated in the precursor source container.
    Type: Application
    Filed: July 11, 2022
    Publication date: January 11, 2024
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
  • Publication number: 20240004123
    Abstract: An optical film comprises a light incident side and a light emitting side opposite to the light incident side. A plurality of light incident microstructures are formed on the light incident side, and the light incident microstructures are tapered structures. According to the structural design of the light incident microstructures of the optical film, the light field of a light source can be expanded to achieve the purpose of emitting light at a specific angle. The invention also provides a backlight module and a display device including the optical film.
    Type: Application
    Filed: September 5, 2023
    Publication date: January 4, 2024
    Applicant: Radiant Opto-Electronics Corporation
    Inventors: Wei-Hsuan CHEN, Chung-Yung TAI, Wen-Hao CAI, Chun-Yi WU
  • Publication number: 20240003993
    Abstract: A thin-film deposition system includes a thin-film deposition chamber. A magnetron assembly is positioned within the thin-film deposition chamber to assist in thin-film deposition processes. A magnetic sensor apparatus is positioned adjacent to the magnetron assembly. The magnetic sensor apparatus includes a plurality of magnetic sensors that each sense the magnetic field in a particular location within the thin-film deposition chamber. The control system generates a magnetic field distribution based on the sensor signals from the magnetic sensors. An analysis model that has been trained with a machine learning process analyzes the magnetic field distribution and determines whether or not an abnormal magnetic field distributions process. The control system can stop the thin-film deposition process based on the output of the analysis model.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
  • Publication number: 20240004137
    Abstract: An optical device includes a first ring resonator positioned in a first plane, a first optical waveguide positioned in the first plane and configured to provide photons to the first ring resonator, a second ring resonator positioned in a second plane that is below the first plane, and a second optical waveguide positioned in the second plane. The second optical waveguide is configured to receive photons escaping from the second ring resonator.
    Type: Application
    Filed: March 22, 2023
    Publication date: January 4, 2024
    Inventor: Wen-Hao Cheng
  • Publication number: 20240004264
    Abstract: An optical device includes a ring resonator, a first optical waveguide with an end portion merged into a circumference of the ring resonator, and a second optical waveguide free of contact with the circumference of the ring resonator. The first optical waveguide is configured to receive photons. The second optical waveguide is configured to output photons coupled from the ring resonator.
    Type: Application
    Filed: April 24, 2023
    Publication date: January 4, 2024
    Inventor: Wen-Hao CHENG