Patents by Inventor Wen Hao

Wen Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230328468
    Abstract: Embodiments are provided for receiving a request to output audio at a first speaker and a second speaker of an electronic device, determining that the electronic device is oriented in a portrait orientation or a landscape orientation, identifying, based on the determined orientation, a first equalization setting for the first speaker and a second equalization setting for the second speaker, providing, for output at the first speaker, a first audio signal with the first equalization setting, and providing, for output at the second speaker, a second audio signal with the second equalization setting.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 12, 2023
    Inventors: Adrian M. Schuster, Prabhu Annabathula, Kevin J. Bastyr, Andrew K. Wells, Wen Hao Zhang
  • Publication number: 20230326633
    Abstract: A resistor structure includes a resistor body; and a first electrode structure disposed at and being in electric contact with a first end of the resistor body, and a second electrode structure disposed at and being in electric contact with a second end opposite to the first end of the resistor body. Each of the first electrode structure and the second electrode structure has at least one conductive protrusion. The at least one conductive protrusion of the first electrode structure and the at least one conductive protrusion of the second electrode structure both serve as voltage-sensing terminals for electric connection to an external voltage measurement device, or both serve as current-sensing terminals for electric connection to a current measurement device.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Inventors: Chih Yu Hu, Wen Hao Wu, Chun Cheng Yao
  • Publication number: 20230315265
    Abstract: A multi-resource editing system and a multi-resource editing method are disclosed. The multi-resource editing system comprises an editor, a user interface and a broadcasting and recording apparatus, wherein the editor comprises an image editing module. The user interface electrically connects the image editing module, wherein the user interface comprises a plurality of windows. The user interface generates at least one editing signal, the at least one editing signal is generated according to an operation result of the user interface, and the image editing module generates at least one editing instruction according to the at least one editing signal and generates a synthetic image scenario according to the at least one editing signal. The image editing module outputs the synthetic image scenario to the broadcasting and recording apparatus such that the broadcasting and recording apparatus generates a broadcast synthetic image according to a recorded image and the synthetic image scenario.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicant: Optoma China Co., Ltd
    Inventors: Kai-Ming Guo, Tian-Shen Wang, Zi-Xiang Xiao, Wen-Hao Zuo
  • Publication number: 20230317757
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor including a plurality of photodetectors disposed within a substrate. The substrate comprises a front-side surface opposite a back-side surface. An outer isolation structure is disposed in the substrate and laterally surrounds the plurality of photodetectors. The outer isolation structure has a first height. An inner isolation structure is spaced between sidewalls of the outer isolation structure. The inner isolation structure is disposed between adjacent photodetectors in the plurality of photodetectors. The outer isolation structure and the inner isolation structure respectively extend from the back-side surface toward the front-side surface. The inner isolation structure comprises a second height less than the first height.
    Type: Application
    Filed: May 31, 2022
    Publication date: October 5, 2023
    Inventors: Yen-Ting Chiang, Yen-Yu Chen, Wen Hao Chang, Tzu-Hsuan Hsu, Feng-Chi Hung, Shyh-Fann Ting, Jen-Cheng Liu
  • Publication number: 20230314702
    Abstract: A package includes an encapsulant having a first side and a second side opposite to the first side, a first integrated circuit die and a second integrated circuit die embedded in the encapsulant, and a first interposer on the first side of the encapsulant. The first interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The package further includes a second interposer on the second side of the encapsulant. The second interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The second interposer optically or electrically couples the first integrated circuit die to the second integrated circuit die.
    Type: Application
    Filed: July 14, 2022
    Publication date: October 5, 2023
    Inventors: Chen-Hua Yu, Chuei-Tang Wang, Wen-Hao Cheng, Tung-Liang Shao, Chung-Hao Tsai
  • Publication number: 20230298916
    Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
  • Patent number: 11762280
    Abstract: An EUV reflective structure includes a substrate and multiple pairs of a Si layer and a Mo layer. The Si layer includes a plurality of cavities.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Benny Ku, Keith Kuang-Kuo Koai, Wen-Hao Cheng
  • Patent number: 11755815
    Abstract: Systems and methods for improving design performance of a layout design through placement of functional and spare cells by leveraging layout dependent effect(LDE) is disclosed. The method includes the steps of: importing a plurality of technology files associated with the layout design into an EDA system; importing a netlist associated with the layout design into the EDA system; importing a standard cell library containing pattern-S timing information of the functional cells and the spare cells; performing floorplan and spare cell insertion, wherein the spare cells are distributed uniformly across the floorplan; and conducting placement and optimization through re-placement of the at least one functional cells and the spare cells to form pattern-S with at least one timing critical cells to improve an overall timing performance of the layout design.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chun-Yao Ku, Jyun-Hao Chang, Ming-Tao Yu, Wen-Hao Chen
  • Publication number: 20230272214
    Abstract: A thermoplastic vulcanizate and a method for preparing the same are provided. The thermoplastic vulcanizate includes a thermoplastic, a cross-linked rubber particle, and a compatibilizer, wherein the cross-linked rubber particle is dispersed in the thermoplastic serving as a continuous phase, wherein the cross-linked rubber particle is a product of a composition via a cross-linking reaction. The composition includes an ethylene copolymer and a cross-linking agent, wherein the weight ratio of the thermoplastic to the ethylene copolymer is 3:17 to 1:1.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, FORMOSA PLASTICS CORPORATION
    Inventors: Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Ying-Cheng WENG, Shih-Hsun LIN
  • Publication number: 20230275048
    Abstract: A method is provided. The method includes forming an interconnect structure electrically connected to a semiconductor device; forming a tantalum-based barrier layer over the interconnect structure; oxidizing the tantalum-based barrier layer to form a tantalum oxide over the tantalum-based barrier layer; and forming a metal layer over the tantalum oxide.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Hao CHENG, Yen-Yu CHEN, Chih-Wei LIN, Yi-Ming DAI
  • Patent number: 11742231
    Abstract: The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 29, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Chih Chu, Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Patent number: 11735105
    Abstract: A driving circuit, a driving method and a display apparatus are provided. The driving method is provided for driving a light-emitting unit including a first light-emitting element series and a second light-emitting element series connected in parallel and connected to a processing unit and a driving unit of a driving circuit. The processing unit detects a first voltage value and a second voltage value. The driving unit detects and transmits a first current value and a second current value to the processing unit. The processing unit determines and compares a first power value and a second power value. When the first and second power values are different, the processing unit controls the driving unit to adjust a driving current setting of the light-emitting element series until the first and second power values are equal. The invention ensures luminance consistency of different light-emitting element series and the luminance uniformity of display apparatus.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: August 22, 2023
    Assignee: Qisda Corporation
    Inventors: Po-Wen Wang, Tung-Hsien Tsai, Wen-Hao Kuo, Chin-Sheng Chueh
  • Publication number: 20230263012
    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Inventors: Chung-Chia CHEN, Ji Young CHOUNG, Dieter HAAS, Yu-Hsin LIN, Jungmin LEE, Wen-Hao WU, Si Kyoung KIM
  • Publication number: 20230263014
    Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.
    Type: Application
    Filed: March 14, 2023
    Publication date: August 17, 2023
    Inventors: Yu-hsin LIN, Ji Young CHOUNG, Chung-chia CHEN, Jungmin LEE, Wen-Hao WU, Takashi ANJIKI, Takuji KATO, Dieter HAAS, Si Kyoung KIM, Stefan KELLER
  • Patent number: 11727185
    Abstract: A system includes a non-transitory computer readable medium configured to store instructions thereon. The system further includes a processor connected to the non-transitory computer readable medium. The processor is configured to execute the instruction for comparing a size of a via pillar structure of a first layout pattern of a plurality of layout patterns with a size of a via pillar structure of a second layout pattern of the plurality of layout patterns, wherein each of the plurality of layout patterns meets an electromigration (EM) rule. The processor is further configured to execute the instructions for replacing, in a layout design, the first layout pattern with the second layout pattern in response to the size of the via pillar structure of the second layout pattern being less than the size of the via pillar structure of the first layout pattern.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shao-Huan Wang, Sheng-Hsiung Chen, Wen-Hao Chen, Chun-Chen Chen, Hung-Chih Ou
  • Patent number: 11728226
    Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen, Yi-Ming Dai
  • Publication number: 20230255064
    Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Chung-chia CHEN, Ji Young CHOUNG, Dieter HAAS, Yu-hsin LIN, Jungmin LEE, Wen-Hao WU, Si Kyoung KIM
  • Patent number: 11717246
    Abstract: In a medical image generation method, projection data of a scanned object is acquired during rotation of a radiographic source, and a scout image of the scanned object is generated in one scanning direction using corresponding projection data in two opposite scanning directions in the projection data. The scanning direction is used to represent a relative position relationship between the radiographic source and the scanned object. Using projection data in two opposite directions to generate a scout image in one direction during rotary scanning of a radiographic source can significantly shorten the generation time of the scout image.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: August 8, 2023
    Assignee: Siemens Healthcare GmbH
    Inventors: Xiang Wen, Yi Tian, Tao Tao Li, Guo Qing Zhang, Wen Hao Chen
  • Publication number: 20230237237
    Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 27, 2023
    Inventors: Po-Chia Lai, Kuo-Ji Chen, Wen-Hao Chen, Wun-Jie Lin, Yu-Ti Su, Mohammed Rabiul Islam, Shu-Yi Ying, Stefan Rusu, Kuan-Te Li, David Barry Scott
  • Publication number: 20230236791
    Abstract: A system and method for media content sequencing. Prior tracks for a listening session are segmented into groups based on attribute scores for an audial attribute. A preferred group is then selected, which can be based on user feedback regarding the prior tracks in the listening session. Candidate tracks, such as from a candidate track pool for future playback in the listening session, are also segmented into the groups of the prior tracks. The candidate tracks can then be ranked based on their associated group and the preferred group.
    Type: Application
    Filed: January 21, 2022
    Publication date: July 27, 2023
    Applicant: Spotify AB
    Inventors: Rishabh MEHROTRA, Aaron Wen Hao Ng