Abstract: The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.

Abstract: A driving circuit, a driving method and a display apparatus are provided. The driving method is provided for driving a light-emitting unit including a first light-emitting element series and a second light-emitting element series connected in parallel and connected to a processing unit and a driving unit of a driving circuit. The processing unit detects a first voltage value and a second voltage value. The driving unit detects and transmits a first current value and a second current value to the processing unit. The processing unit determines and compares a first power value and a second power value. When the first and second power values are different, the processing unit controls the driving unit to adjust a driving current setting of the light-emitting element series until the first and second power values are equal. The invention ensures luminance consistency of different light-emitting element series and the luminance uniformity of display apparatus.

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

Abstract: A system includes a non-transitory computer readable medium configured to store instructions thereon. The system further includes a processor connected to the non-transitory computer readable medium. The processor is configured to execute the instruction for comparing a size of a via pillar structure of a first layout pattern of a plurality of layout patterns with a size of a via pillar structure of a second layout pattern of the plurality of layout patterns, wherein each of the plurality of layout patterns meets an electromigration (EM) rule. The processor is further configured to execute the instructions for replacing, in a layout design, the first layout pattern with the second layout pattern in response to the size of the via pillar structure of the second layout pattern being less than the size of the via pillar structure of the first layout pattern.

Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

Abstract: In a medical image generation method, projection data of a scanned object is acquired during rotation of a radiographic source, and a scout image of the scanned object is generated in one scanning direction using corresponding projection data in two opposite scanning directions in the projection data. The scanning direction is used to represent a relative position relationship between the radiographic source and the scanned object. Using projection data in two opposite directions to generate a scout image in one direction during rotary scanning of a radiographic source can significantly shorten the generation time of the scout image.

Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.

Abstract: A system and method for media content sequencing. Prior tracks for a listening session are segmented into groups based on attribute scores for an audial attribute. A preferred group is then selected, which can be based on user feedback regarding the prior tracks in the listening session. Candidate tracks, such as from a candidate track pool for future playback in the listening session, are also segmented into the groups of the prior tracks. The candidate tracks can then be ranked based on their associated group and the preferred group.

Abstract: A thermoplastic and thermoset foam nucleation additive, which is added to a foamed material, includes a gas absorbent and a nano-compound, wherein the nano-compound and the gas absorbent are mixed to form the thermoplastic and thermoset foam nucleation additive. The gas absorbent includes a central structure and a short chain structure, wherein a first chemical bond is formed between the short chain structure and the central structure. The nano-compound includes a base structure and a long chain structure, wherein a second chemical bond is formed between the long chain structure and the base structure. A number of carbon atoms in the short chain structure is not less than 8, and a molecular weight of the long chain structure is higher than 10000 g/mole.

Abstract: A driving circuit, a driving method and a display apparatus are provided. The driving method is provided for driving a light-emitting unit including a first light-emitting element series and a second light-emitting element series connected in parallel and connected to a processing unit and a driving unit of a driving circuit. The processing unit detects a first voltage value and a second voltage value. The driving unit detects and transmits a first current value and a second current value to the processing unit. The processing unit determines and compares a first power value and a second power value. When the first and second power values are different, the processing unit controls the driving unit to adjust a driving current setting of the light-emitting element series until the first and second power values are equal. The invention ensures luminance consistency of different light-emitting element series and the luminance uniformity of display apparatus.

Abstract: A method of forming an integrated circuit includes placing a first and a second standard cell layout design of the integrated circuit on a layout design, and manufacturing the integrated circuit based on at least the first or second standard cell layout design. The first standard cell layout design has a first height. The second standard cell layout design has a second height. Placing the first standard cell layout design includes placing a first set of pin layout patterns on a first layout level over a first set of gridlines, extending in a first direction, and having a first width in a second direction. Placing the second standard cell layout design includes placing a second set of pin layout patterns on the first layout level over a second set of gridlines, extending in the first direction, and having a second width in the second direction.

Abstract: Embodiments are provided for receiving a request to output audio at a first speaker and a second speaker of an electronic device, determining that the electronic device is oriented in a portrait orientation or a landscape orientation, identifying, based on the determined orientation, a first equalization setting for the first speaker and a second equalization setting for the second speaker, providing, for output at the first speaker, a first audio signal with the first equalization setting, and providing, for output at the second speaker, a second audio signal with the second equalization setting.

Abstract: The disclosure provides an image sensor integrated chip and a method for forming the same. The image sensor integrated chip includes a substrate, an isolation structure, an image sensing element, a gate structure, a first dielectric layer, and a reflective layer. The substrate includes a pixel region. The isolation structure is disposed in the substrate and is configured at opposite sides of the pixel region. The image sensing element is disposed in the pixel region of the substrate. The gate structure is disposed on the pixel region of the substrate. The first dielectric layer is disposed above the pixel region of the substrate and covers sidewalls and a portion of a top surface of the gate structure. The reflective layer is disposed on the first dielectric layer. The reflective layer overlaps with the image sensing element and the portion of the top surface of the gate structure in a first direction perpendicular to a surface of the substrate.

Abstract: A target position determination of a single-slot collimating plate and a collimator assembly are disclosed. A first measurement signal is acquired based upon of the first instance of air scanning, when the single-slot collimating plate moves a predetermined distance from a starting position to a first position in a first direction of the Z axis. A second measurement signal is acquired based upon the second instance of air scanning, when the single-slot collimating plate moves a predetermined distance from the starting position to a second position in the direction opposite to the first direction. A composite measurement signal and a composite air calibration signal are determined based upon the first measurement signal and the second measurement signal. The composite measurement signal is calibrated using the composite air calibration signal. The target position of the single-slot collimating plate is determined based upon the calibrated composite measurement signal.

Abstract: A lithography system includes a radiation source configured to generate a radiation, a reticle configured to redirect the radiation, a first type injection nozzle proximal to the reticle and configured to generate a first particle shield in a propagation path of the radiation, and a second type injection nozzle proximal to the radiation source and configured to generate a second particle shield in the propagation path of the radiation. The second type injection nozzle and the first type injection nozzle are of different types.

Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.

Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.

Abstract: A multi-bit flip-flop includes a first flip-flop, a second flip-flop and a first inverter. The first flip-flop has a first driving capability. The second flip-flop has a second driving capability different from the first driving capability. The first inverter is configured to receive a first clock signal on a first clock pin, and is configured to generate a second clock signal inverted from the first clock signal. The first flip-flop and the second flip-flop are configured to share at least the first clock pin.