Abstract: An image capturing device for forming a higher resolution image of an image target having a plurality of pixel areas respectively is disclosed. The image capturing device includes an image sensor having a plurality of sensing pixels corresponding to the plurality of pixel areas respectively; an in-plane motion motor coupled to the image sensor, and configured to cause the image sensor to take a plurality of raw images related to the image target one by one; and a controller configured to synthesize the plurality of raw images into the higher resolution image, wherein: the image sensor has a sensor surface; the in-plane motion motor incrementally moves a plurality of times the image sensor, each time with a distance equal to 1/N of a pixel pitch of one of the plurality of sensing pixels, along a first direction parallel to the sensor surface to respectively capture the plurality of raw images for forming the higher resolution image; and N is a positive integer being larger than 1.

Abstract: A method for manufacturing an apparatus having in-plane and out-of-plane motions is provided. The method includes the steps of providing an in-plane motion motor capable of moving in a first set of three degrees of freedom with respect to a reference plane for mounting thereon a functional device for performing the application function; providing an out-of-plane motion motor having a base plate surface and supporting thereon the in-plane motion motor; and providing four single-axis motors in the out-of-plane motion motor, wherein: each of the four single-axis motors has a single-axis actuator having an actuating end, a planar surface and a side surface; the side surface is attached to the base plate surface; and the four single-axis motors cooperatively enable the reference plane to be capable of moving in a second set of three degrees of freedom, wherein the first set of three degrees of freedom are all different from the second set of three degrees of freedom.

Abstract: A probe pin cleaning pad is provided, including a release layer or composite plate, an adhesive layer, a substrate layer, and a cleaning layer. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. A cleaning method for a probe pin is also provided.

Abstract: A reflector device is provided in the present disclosure, and includes a base, a first single-axis motion motor, a fulcrum structure and a reflector. The base includes a base plate having a base plate surface. The first single-axis motion motor is disposed on the base plate surface, and has a motion direction parallel to a normal direction of the base plate surface. The fulcrum structure is disposed on the base plate surface. The reflector has a first and a second ends connected with the first single-axis motion motor and the fulcrum structure respectively.

Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is spaced apart from the short portion.

Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.

Abstract: A semiconductor device may include function circuits and a test line structure beside the function circuits. The test line structure includes standard cell circuit blocks including a first components and environment circuit regions between the standard cell circuit blocks. The environment circuit regions include second components. The first components are different from the second components in structure, arrangement or a combination thereof.

Abstract: A clean energy power supply system includes a container, a thermal insulation wall, a power-generation device, a power-conversion device, and a power-distribution device. The container has an internal space and a rear door. The thermal insulation wall is located in the internal space and adjacent to the rear door. The power-generation device is disposed in an accommodating space of the container and configured to generate a clean power. The power-conversion device is disposed in the accommodating space and configured to convert the clean power into a converted power. The power-distribution device is disposed in the accommodating space and configured to output the converted power to an external load or an external power grid. The thermal insulation wall is configured to block external airflow flowing through the rear door so as to maintain the temperature of the accommodating space.

Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.

Abstract: A driving mechanism for moving an optical element is provided, including a housing, a frame, a holder, and a driving assembly. The frame is fixed to the housing and forms a depressed surface adjacent to the housing. Specifically, the depressed surface faces the housing and is not in contact with the housing. The holder is movably disposed in the housing for holding the optical element. The drive assembly is disposed in the housing to drive the holder and the optical element to move relative to the frame.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including an interconnect structure overlying a substrate. The interconnect structure has a plurality of metal layers overlying over the substrate. A first dielectric layer overlies an uppermost surface of the interconnect structure. The first dielectric layer has opposing sidewalls defining a trench. A first magnetic layer is disposed within the trench and conformally extends along the opposing sidewalls. Conductive wires are disposed within the trench and overlie the first magnetic layer. A second magnetic layer overlies the first magnetic layer and the conductive wires. The second magnetic layer laterally extends from over a first sidewall of the opposing sidewalls to a second sidewall of the opposing sidewalls.

Abstract: An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Abstract: The frequency detector includes a first impedance circuit and a second impedance circuit. The first impedance circuit has a first terminal for receiving an input signal, and a second terminal for outputting a divisional signal. The second impedance circuit has a first terminal coupled to the second terminal of the first impedance circuit, and a second terminal coupled to a first system voltage terminal. The frequency response of the first impedance circuit is different from a frequency response of the second impedance circuit. The resistance of the first impedance circuit, a resistance of the second impedance circuit, and the divisional signal change with a frequency of the input signal.

Abstract: A wireless input component and an operation method thereof are provided. The wireless input component includes a wireless reception device and a peripheral input device. The wireless reception device includes a connection interface, a storage device and a processor. The connection interface is connected to a first host. The storage device is configured to record operation parameter information of the first host. The processor connects the connection interface and the storage device and is configured to control the storage device. The communication device connects the processor. The peripheral input device includes an input device and a transmission device. The input device is configured to generate an input signal. The transmission device connects the input device and is connected to the communication device through a wireless communication path and configured to transmit the input signal to the communication device of the wireless reception device.

Abstract: A driving mechanism is provided, including a case, a holder and a driving module. The holder is disposed in the case for holding an optical member. The driving module is disposed in the case for driving the holder. The case is substantially quadrilateral and includes a first side and a second side. The driving module includes a first magnetic driving component winding on a periphery of the holder. The first magnetic driving component includes a first segment and a second segment that are respectively substantially parallel to the first side and the second side. The distance between the first segment and the first side is different from the distance between the second segment and the second side.

Abstract: A method is provided. Plural semiconductor fins are formed on a substrate, and plural trenches each of which is formed between two adjacent semiconductor fins. A silicon liner layer is deposited to be conformal to the semiconductor fins and the trenches. The silicon liner layer is deposited by using a silane compound. Then, an oxide layer is deposited on the silicon liner layer to fill the trenches and cover the semiconductor fins, in which depositing the oxide layer forms water in the oxide layer. Next, a surface of the silicon liner layer is reacted with the water, so as to remove the water from the oxide layer.

Abstract: An amplification device includes an amplification circuit, an inductor, a regulator, and a impedance circuit. The amplification circuit has an input terminal for receiving a radio frequency signal, and an output terminal for outputting an amplified radio frequency signal. The inductor has a first terminal, and a second terminal coupled to the output terminal of the amplification circuit. The regulator is coupled to the first terminal of the inductor and generates a steady voltage and/or a steady current. The impedance circuit has a first terminal coupled to the output terminal of the amplification circuit, and a second terminal coupled to a first system voltage terminal. The impedance circuit provides a low frequency impedance path to suppress a beat frequency signal in the amplified radio frequency signal.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A head mounted display (HMD) apparatus is provided. The HMD apparatus includes a first lens, a second lens, a first micro-display disposed on the first lens, a second micro-display disposed on the second lens, a first light source, a second light source, and an eyeglass frame. A first side of the first micro-display corresponding to a first rubbing alignment processing direction and a first side of the second micro-display corresponding to a second rubbing alignment processing direction are symmetric with respect to a center line of the eyeglass frame between the first lens and the second lens. A first incident light emitted by the first light source is obliquely emitted from the first side of the first micro-display toward the first micro-display and a second incident light emitted by the second light source is obliquely emitted from the first side of the second micro-display toward the second micro-display.