Abstract: Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.

Abstract: A driving mechanism for moving an optical element is provided, including a housing, a frame, a holder, and a driving assembly. The frame is fixed to the housing and forms a depressed surface adjacent to the housing. Specifically, the depressed surface faces the housing and is not in contact with the housing. The holder is movably disposed in the housing for holding the optical element. The drive assembly is disposed in the housing to drive the holder and the optical element to move relative to the frame.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including an interconnect structure overlying a substrate. The interconnect structure has a plurality of metal layers overlying over the substrate. A first dielectric layer overlies an uppermost surface of the interconnect structure. The first dielectric layer has opposing sidewalls defining a trench. A first magnetic layer is disposed within the trench and conformally extends along the opposing sidewalls. Conductive wires are disposed within the trench and overlie the first magnetic layer. A second magnetic layer overlies the first magnetic layer and the conductive wires. The second magnetic layer laterally extends from over a first sidewall of the opposing sidewalls to a second sidewall of the opposing sidewalls.

Abstract: An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Abstract: A wireless input component and an operation method thereof are provided. The wireless input component includes a wireless reception device and a peripheral input device. The wireless reception device includes a connection interface, a storage device and a processor. The connection interface is connected to a first host. The storage device is configured to record operation parameter information of the first host. The processor connects the connection interface and the storage device and is configured to control the storage device. The communication device connects the processor. The peripheral input device includes an input device and a transmission device. The input device is configured to generate an input signal. The transmission device connects the input device and is connected to the communication device through a wireless communication path and configured to transmit the input signal to the communication device of the wireless reception device.

Abstract: The frequency detector includes a first impedance circuit and a second impedance circuit. The first impedance circuit has a first terminal for receiving an input signal, and a second terminal for outputting a divisional signal. The second impedance circuit has a first terminal coupled to the second terminal of the first impedance circuit, and a second terminal coupled to a first system voltage terminal. The frequency response of the first impedance circuit is different from a frequency response of the second impedance circuit. The resistance of the first impedance circuit, a resistance of the second impedance circuit, and the divisional signal change with a frequency of the input signal.

Abstract: A method is provided. Plural semiconductor fins are formed on a substrate, and plural trenches each of which is formed between two adjacent semiconductor fins. A silicon liner layer is deposited to be conformal to the semiconductor fins and the trenches. The silicon liner layer is deposited by using a silane compound. Then, an oxide layer is deposited on the silicon liner layer to fill the trenches and cover the semiconductor fins, in which depositing the oxide layer forms water in the oxide layer. Next, a surface of the silicon liner layer is reacted with the water, so as to remove the water from the oxide layer.

Abstract: A driving mechanism is provided, including a case, a holder and a driving module. The holder is disposed in the case for holding an optical member. The driving module is disposed in the case for driving the holder. The case is substantially quadrilateral and includes a first side and a second side. The driving module includes a first magnetic driving component winding on a periphery of the holder. The first magnetic driving component includes a first segment and a second segment that are respectively substantially parallel to the first side and the second side. The distance between the first segment and the first side is different from the distance between the second segment and the second side.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: An amplification device includes an amplification circuit, an inductor, a regulator, and a impedance circuit. The amplification circuit has an input terminal for receiving a radio frequency signal, and an output terminal for outputting an amplified radio frequency signal. The inductor has a first terminal, and a second terminal coupled to the output terminal of the amplification circuit. The regulator is coupled to the first terminal of the inductor and generates a steady voltage and/or a steady current. The impedance circuit has a first terminal coupled to the output terminal of the amplification circuit, and a second terminal coupled to a first system voltage terminal. The impedance circuit provides a low frequency impedance path to suppress a beat frequency signal in the amplified radio frequency signal.

Abstract: A head mounted display (HMD) apparatus is provided. The HMD apparatus includes a first lens, a second lens, a first micro-display disposed on the first lens, a second micro-display disposed on the second lens, a first light source, a second light source, and an eyeglass frame. A first side of the first micro-display corresponding to a first rubbing alignment processing direction and a first side of the second micro-display corresponding to a second rubbing alignment processing direction are symmetric with respect to a center line of the eyeglass frame between the first lens and the second lens. A first incident light emitted by the first light source is obliquely emitted from the first side of the first micro-display toward the first micro-display and a second incident light emitted by the second light source is obliquely emitted from the first side of the second micro-display toward the second micro-display.

Abstract: An amplification device includes an amplification circuit and a protection circuit. The amplification circuit includes a transistor having a first terminal for outputting an amplified radio frequency signal, a second terminal, and a control terminal coupled to the input terminal of the amplification circuit for receiving a radio frequency signal to be amplified. The protection circuit has a first terminal coupled to the output terminal or the input terminal of the amplification circuit, and a second terminal. The protection circuit includes a switch and a first voltage clamping unit. The switch unit is turned on or turned off according to a control signal. The first voltage clamping unit is coupled to the switch unit for clamping a voltage at the first terminal of the protection circuit within a predetermined region when the switch unit is turned on.

Abstract: The present disclosure provides recombinant polypeptides, homodimeric and heterodimeric proteins comprising the recombinant polypeptides, nucleic acid molecules encoding the recombinant polypeptides, and vectors and host cells comprising the nucleic acid molecules. The present disclosure also provides compositions comprising the recombinant polypeptides and methods of making and using the recombinant polypeptides.

Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is electrically connected to the short portion.

Abstract: A light blocking sheet having a central axis includes a central hole and a plurality of inner extended portions. The central axis passes through the central hole, which is enclosed by a hole inner surface. The hole inner surface has a first corresponding circle and a second corresponding circle, wherein a diameter of the first corresponding circle is greater than a diameter of the second corresponding circle. The inner extended portions are adjacent to and surround the central hole, wherein each of the inner extended portions is extended and tapered from the first corresponding circle towards the second corresponding circle and includes an inner surface, and the inner surface includes a line pair. The line pair includes two line sections, wherein one end of one line section thereof and one end of the other line section thereof are towards the second corresponding circle and approach to each other.

Abstract: A speaker device having a resonance chamber with adjustable volume can include a speaker chamber and an acoustic deflecting module. The speaker chamber has a transducer, and the audio signal generated by the speaker chamber can be output via the transducer. The acoustic deflecting module is disposed adjacent to the speaker chamber. An outer surface of the acoustic deflecting module changes a transmission direction of the audio signal. An inner volume of the acoustic deflecting module is the resonance chamber with the adjustable volume. The acoustic deflecting module includes a base, a cover, a plate and a driving mechanism. The cover is assembled with the base. The plate is movably disposed inside the cover to form a resonance chamber. The driving mechanism is disposed on the cover and assembled with the plate, and adapted to move the plate inside the resonance chamber for vary a volume of the resonance chamber.

Abstract: A semiconductor wafer and a semiconductor wafer fabrication method are provided. The wafer includes a supporting substrate, a semiconductor substrate and a contact layer. The supporting substrate has a first surface and a second surface opposite to the first surface. The semiconductor substrate is disposed on the first surface of the supporting substrate, in which the semiconductor substrate is configured to form plural devices. The contact layer is disposed on the second surface of the supporting substrate to contact the supporting substrate, in which the contact layer is configured to contact an electrostatic chuck and has a resistivity of the contact layer smaller than a resistivity of the supporting substrate. In semiconductor wafer fabrication method, at first, a raw wafer is provided. Then, the contact layer is formed by using an implantation operation or a deposition operation.

Abstract: A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.

Abstract: Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.

Abstract: A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.