Abstract: An antenna structure includes a metal housing, a first radiator, and an isolating portion. The metal housing includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The side frame defines a slot and the front frame defines a gap. The gap communicates with the slot and extends across the front frame. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned adjacent to the short portion. The isolating portion is connected to the first radiator to improve isolation between the short portion and the first radiator.

Abstract: A head mounted display (HMD) apparatus is provided. The HMD apparatus includes a first lens, a second lens, a first micro-display disposed on the first lens, a second micro-display disposed on the second lens, a first light source, a second light source, and an eyeglass frame. A first side of the first micro-display corresponding to a first rubbing alignment processing direction and a first side of the second micro-display corresponding to a second rubbing alignment processing direction are symmetric with respect to a center line of the eyeglass frame between the first lens and the second lens. A first incident light emitted by the first light source is obliquely emitted from the first side of the first micro-display toward the first micro-display and a second incident light emitted by the second light source is obliquely emitted from the first side of the second micro-display toward the second micro-display.

Abstract: An antenna structure includes a metal housing, a first feed source, and a second feed source. The metal housing includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The side frame defines a slot and the front frame defines a gap. The gap communicates with the slot and extends across the front frame. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first feed source is electrically connected to the long portion and the second feed source is electrically connected to the short portion.

Abstract: A manufacturing method is applied to set a stackable chip package. The manufacturing method includes encapsulating a plurality of chips stacked with each other, disposing a lateral surface of the stacked chips having conductive elements onto a substrate, disassembling the substrate from the conductive elements when the stacked chips are encapsulated, and disposing a dielectric layer with openings on the stacked chips to align the openings with the conductive elements for ball mounting process.

Abstract: A method comprises depositing a mask layer on a front-side surface of a wafer, wherein a portion of the wafer has a first resistivity; with the mask layer in place, performing an ion implantation process on a backside surface of the wafer to implant a resistivity reduction impurity into the wafer through the backside surface of the wafer to lower the first resistivity of the portion of the wafer to a second resistivity; after performing the ion implantation process, removing the mask layer from the front-side surface of the wafer; and forming semiconductor devices on the front-side surface of the wafer.

Abstract: The present invention discloses a coating monitoring system of wind turbines, comprising a monitoring object having at least one coating on the surface. A coating monitoring module is coupled to the monitoring object, and the coating monitoring module comprises a MEMS system including a signal generating device, and a printed circuit board connected to the MEMS system. The coating monitoring module measures a measured coating impedance value of the monitoring object. A potentiostat, calculating an actual coating impedance value of the monitoring object, is connected to the monitoring object. And a computing device coupled to the coating monitoring module, the computing device correcting the measured coating impedance value based on the actual coating impedance value.

Abstract: The present invention provides a linear actuator. The linear actuator includes: a substrate having a cavity; a first fixed electrode structure fixed on the substrate; an elastic linkage; and a movable electrode structure connected to the substrate through the elastic linkage, wherein: the cavity has a first area; at least one of the first fixed electrode structure and the movable electrode structure has a second projection area on the substrate; and the first area and the second projection area overlap. The linear actuator allows the making of an out-of-plane linear motion motor with a large motion stroke, the robustness of impact, the easy removal of residual process contaminants, an improvement of the efficiency of electrical-to-mechanical energy conversion and the off-axis motion decoupling of movable comb structure.

Abstract: The present invention provides a tunable spectrum sensing device. The tunable spectrum sensing device includes: a device body; an out-of-plane motion motor mounted on the device body and including: a base having a normal direction; and a single-axis actuator having a motion direction parallel to the normal direction, and including: a substrate with an electronic element; and an actuating end driven by the electronic element; a first glass mounted on and moved by the actuating end; and a second glass mounted on the device body. The out-of-plane motion motor can keep an object at a specific rotation angle, position the object at a specific out-of-plane displacement or be programmed for the object to perform a specific scan trajectory motion. The out-of-plane motion motor also has a large motion stroke, and thus, there is no need to use multiple tunable spectrum sensing devices to satisfy the spectral bandwidth requirement.

Abstract: A light sensing apparatus is disclosed.

Abstract: A micro-electromechanical actuating device is disclosed. The micro-electromechanical actuating device includes a substrate having a cavity having a first area; a fixing portion disposed on the substrate; a first frame disposed around the fixing portion; and an elastic element connecting the first frame and the fixing portion, and causing the first frame to be suspended above the substrate, wherein the first frame has a projecting area onto the substrate; and the first area and the projecting area have an overlapping portion.

Abstract: A method for manufacturing an apparatus having in-plane and out-of-plane motions is provided. The method includes the steps of providing an in-plane motion motor capable of moving in a first set of three degrees of freedom with respect to a reference plane for mounting thereon a functional device for performing the application function; providing an out-of-plane motion motor having a base plate surface and supporting thereon the in-plane motion motor; and providing four single-axis motors in the out-of-plane motion motor, wherein: each of the four single-axis motors has a single-axis actuator having an actuating end, a planar surface and a side surface; the side surface is attached to the base plate surface; and the four single-axis motors cooperatively enable the reference plane to be capable of moving in a second set of three degrees of freedom, wherein the first set of three degrees of freedom are all different from the second set of three degrees of freedom.

Abstract: A probe pin cleaning pad is provided, including a release layer or composite plate, an adhesive layer, a substrate layer, and a cleaning layer. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. A cleaning method for a probe pin is also provided.

Abstract: A reflector device is provided in the present disclosure, and includes a base, a first single-axis motion motor, a fulcrum structure and a reflector. The base includes a base plate having a base plate surface. The first single-axis motion motor is disposed on the base plate surface, and has a motion direction parallel to a normal direction of the base plate surface. The fulcrum structure is disposed on the base plate surface. The reflector has a first and a second ends connected with the first single-axis motion motor and the fulcrum structure respectively.

Abstract: An image capturing device for forming a higher resolution image of an image target having a plurality of pixel areas respectively is disclosed. The image capturing device includes an image sensor having a plurality of sensing pixels corresponding to the plurality of pixel areas respectively; an in-plane motion motor coupled to the image sensor, and configured to cause the image sensor to take a plurality of raw images related to the image target one by one; and a controller configured to synthesize the plurality of raw images into the higher resolution image, wherein: the image sensor has a sensor surface; the in-plane motion motor incrementally moves a plurality of times the image sensor, each time with a distance equal to 1/N of a pixel pitch of one of the plurality of sensing pixels, along a first direction parallel to the sensor surface to respectively capture the plurality of raw images for forming the higher resolution image; and N is a positive integer being larger than 1.

Abstract: The present invention provides a single-axis actuator. The single-axis actuator includes: a substrate; a driving capacitor; an actuating end driven by the driving capacitor; and a first pair of resilient elements connecting the actuating end and the substrate for effecting a parametric characteristic of the single-axis actuator to apply to an generation of an acoustic wave.

Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is spaced apart from the short portion.

Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.

Abstract: A clean energy power supply system includes a container, a thermal insulation wall, a power-generation device, a power-conversion device, and a power-distribution device. The container has an internal space and a rear door. The thermal insulation wall is located in the internal space and adjacent to the rear door. The power-generation device is disposed in an accommodating space of the container and configured to generate a clean power. The power-conversion device is disposed in the accommodating space and configured to convert the clean power into a converted power. The power-distribution device is disposed in the accommodating space and configured to output the converted power to an external load or an external power grid. The thermal insulation wall is configured to block external airflow flowing through the rear door so as to maintain the temperature of the accommodating space.

Abstract: A semiconductor device may include function circuits and a test line structure beside the function circuits. The test line structure includes standard cell circuit blocks including a first components and environment circuit regions between the standard cell circuit blocks. The environment circuit regions include second components. The first components are different from the second components in structure, arrangement or a combination thereof.

Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.