Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Edge-exposure tool with an ultraviolet (UV) light emitting diode (LED)
    Patent number: 10739682
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • MEMS device with movable stage
    Patent number: 10730744
    Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 4, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wen Hsu, Che-Kai Yeh, Chin-Fu Kuo, Chao-Ta Huang
  • METHOD FOR MAINTAINING MEMORY SHARING IN A COMPUTER CLUSTER
    Publication number: 20200233826
    Abstract: A method includes: by an application executed by a first node, determining whether a non-transparent bridge between the first node and a second node is in a disconnected state; sending a re-initialization request from the application to a driver executed by the first node when the NTB is in the disconnected state; re-initializing a memory of the first node upon the driver receiving the re-initialization request; transmitting a result message related to the re-initialization of the memory to the second node; and implementing a memory-sharing procedure upon completing the re-initialization of the memory and receiving, from the second node, another result message related to re-initialization of a memory of the second node.
    Type: Application
    Filed: January 13, 2020
    Publication date: July 23, 2020
    Applicant: Mitac Computing Technology Corporation
    Inventors: Thanh-Tu THAI, Hung-Tar LIN, Ching-Wen HSU
  • Automatic pencil type pointer
    Patent number: 10712838
    Abstract: An automatic pencil type pointer includes a housing, a first circuit unit, a lead propelling unit, and a first electromagnetic unit. The housing has a port and an accommodation space in communication with the port. The first circuit unit is disposed in the accommodation space. The lead propelling unit is disposed in the accommodation space and includes a lead storage tube, a tip sleeve, a graphite lead, and a lead propelling assembly. The tip sleeve is disposed at the port. The graphite lead is accommodated in the lead storage tube. The lead propelling assembly is capable of controlling the graphite lead to be output from the tip sleeve. The first electromagnetic unit includes a first magnet and a first coil. The first coil is wound around the first magnet and is electrically connected to the first circuit unit. The graphite lead passes through the first magnet.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: July 14, 2020
    Assignee: SHENZHEN PU YING INNOVATION TECHNOLOGY CORP., LTD.
    Inventors: Chung-Wen Hsu, Chung-Hsuan Li
  • Microelectromechanical system (MEMS) apparatus with adjustable spring
    Patent number: 10703625
    Abstract: A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 7, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Nan Yeh, Yu-Wen Hsu, Chao-Ta Huang
  • MEMS DEVICE WITH MOVABLE STAGE
    Publication number: 20200212826
    Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wen HSU, Che-Kai YEH, Chin-Fu KUO, Chao-Ta HUANG
  • VIBRATION SENSOR WITH MONITORING FUNCTION AND VIBRATION SIGNAL MONITORING METHOD THEREOF
    Publication number: 20200200593
    Abstract: A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number.
    Type: Application
    Filed: July 19, 2019
    Publication date: June 25, 2020
    Inventors: YU-WEN HSU, CHAO-TA HUANG, LI-TAO TENG
  • STACKED PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
    Publication number: 20200203313
    Abstract: A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Applicant: Powertech Technology Inc.
    Inventors: Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu
  • Optical element driving mechanism
    Patent number: 10690880
    Abstract: A driving mechanism is provided and configured to drive an optical element. The driving mechanism includes a holding unit, a base unit, an elastic element, a driving assembly, and a sensing assembly. The holding unit holds the optical element. The elastic element connects the holding unit to the base unit. The driving assembly drives the optical element to move relative to the base unit. The sensing assembly is disposed between the holding unit and the base unit for detecting the position of the holding unit relative to the base unit, wherein when observed in an optical axis direction of the optical element, the elastic element and the sensing assembly at least partially overlap.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 23, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Chien-Lun Huang, Yu-Cheng Lin, Nai-Wen Hsu
  • Pointer
    Patent number: 10691229
    Abstract: A pointer includes a casing, a first electromagnetic unit, a second electromagnetic unit, a first elastic member, and a pen point. The casing has an accommodation space and a port in communication with the accommodation space. The first electromagnetic unit includes a first magnet and a coil winding around the first magnet. The first magnet is fixedly disposed in the accommodation space. The second electromagnetic unit is movably disposed in the accommodation space along an axial direction, where the second electromagnetic unit includes a second magnet and a protection member wrapping the second magnet, and the second magnet is relatively away from or close to the first magnet. The elastic member is disposed in the casing and can provide an elastic force to the second electromagnetic unit along the axial direction. The pen point is movably disposed at the port and connected to the protection member.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: June 23, 2020
    Assignee: SHENZHEN PU YING INNOVATION TECHNOLOGY CORP., LTD.
    Inventors: Chung-Wen Hsu, Chung-Hsuan Li
  • OPTICAL ELEMENT DRIVING MODULE
    Publication number: 20200192052
    Abstract: An optical element driving module is provided, including a housing, a movable portion configured to support an optical element, a driving assembly, a positioning sensor, and a non-metallic substrate disposed on a side of the movable portion. The movable portion is movable relative to the housing, the driving assembly is configured to drive movement of the movable portion relative to the housing, and the positioning sensor is configured to detect the movement of the movable portion relative to the housing. Specifically, the non-metallic substrate forms a recess for receiving the positioning sensor, wherein a depth of the recess is greater than a height of the positioning sensor.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Inventors: Shang-Yu HSU, Nai-Wen HSU
  • COATING MONITORING SYSTEM OF WIND TURBINES AND OPERATING METHOD THEREOF
    Publication number: 20200191121
    Abstract: The present invention discloses a coating monitoring system of wind turbines, comprising a monitoring object having at least one coating on the surface. A coating monitoring module is coupled to the monitoring object, and the coating monitoring module comprises a MEMS system including a signal generating device, and a printed circuit board connected to the MEMS system. The coating monitoring module measures a measured coating impedance value of the monitoring object. A potentiostat, calculating an actual coating impedance value of the monitoring object, is connected to the monitoring object. And a computing device coupled to the coating monitoring module, the computing device correcting the measured coating impedance value based on the actual coating impedance value.
    Type: Application
    Filed: December 25, 2018
    Publication date: June 18, 2020
    Inventors: YUEH-LIEN LEE, JAU-HORNG CHEN, CHENG-HSIEN CHUNG, HUA-TUNG WU, SHU-WEN HSU
  • Semiconductor device and method of manufacture
    Patent number: 10685870
    Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: June 16, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Wen Hsu, Ming-Che Ku, Neng-Jye Yang, Yu-Wen Wang
  • Optical driving mechanism
    Patent number: 10684447
    Abstract: The disclosure provides an optical driving mechanism, including a frame body, a holding member, a plate coil and a magnet. The holding member is movably disposed in the frame body and configured to hold an optical element. The plate coil is disposed on the holding member. The magnet is disposed on the frame body and corresponds to the plate coil. The plate coil acts with the magnet to generate an electromagnetic force to drive the holding member and the optical element to move along an optical axis of the optical element relative to the frame body.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 16, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kuo-Chun Kao, Nai-Wen Hsu, Shih-Ting Huang, Shao-Chung Chang, Sin-Jhong Song
  • Trench power semiconductor and method of making the same
    Patent number: 10680076
    Abstract: The present disclosure provides a trench power semiconductor component and a method of making the same. The trench power semiconductor component includes a substrate, an epitaxial layer, and a trench gate structure. The epitaxial layer is disposed on the substrate, the epitaxial layer having at least one trench formed therein. The trench gate structure is located in the at least one trench. The trench gate structure includes a bottom insulating layer covering a lower inner wall of the at least one trench, a shielding electrode located in the lower half part of the at least one trench, a gate electrode disposed on the shielding electrode, an inter-electrode dielectric layer disposed between the gate electrode and the shielding electrode, an upper insulating layer covering an upper inner wall of the at least one trench, and a protection structure including a first wall portion and a second wall portion.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: June 9, 2020
    Assignee: SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventors: Hsiu-Wen Hsu, Chun-Ying Yeh, Yuan-Ming Lee
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
    Publication number: 20200176322
    Abstract: A semiconductor device and method for forming the semiconductor device are provided. A first layer is formed over a semiconductor layer, and a first patterned mask is formed over the first layer. A cyclic etch process is then performed to define a second patterned mask in the first layer. The cyclic etch process includes a first phase to form a polymer layer over the first patterned mask and a second phase to remove the polymer layer and to remove a portion of the first layer. A portion of the semiconductor layer is removed using the second patterned mask to define a fin from the semiconductor layer.
    Type: Application
    Filed: November 13, 2019
    Publication date: June 4, 2020
    Inventors: Fo-Ju LIN, Chia-Wei CHANG, Chiung Wen HSU
  • AMPLIFICATION DEVICE
    Publication number: 20200162031
    Abstract: An amplification device includes an amplification circuit and a protection circuit. The amplification circuit includes a transistor having a first terminal for outputting an amplified radio frequency signal, a second terminal, and a control terminal coupled to the input terminal of the amplification circuit for receiving a radio frequency signal to be amplified. The protection circuit has a first terminal coupled to the output terminal or the input terminal of the amplification circuit, and a second terminal. The protection circuit includes a switch and a first voltage clamping unit. The switch unit is turned on or turned off according to a control signal. The first voltage clamping unit is coupled to the switch unit for clamping a voltage at the first terminal of the protection circuit within a predetermined region when the switch unit is turned on.
    Type: Application
    Filed: April 17, 2019
    Publication date: May 21, 2020
    Inventors: Jhao-Yi Lin, Chih-Sheng Chen, Ching-Wen Hsu
  • Three-Mode Selection Electronically Commuted Motor
    Publication number: 20200144907
    Abstract: An electronically commuted (EC) motor includes an electromagnetic interference (EMI) filter circuit, a bridge circuit, an alternating current (AC) voltage to square wave circuit, a microcontroller, a motor coil, and a power circuit. The EMI filter circuit is for filtering out electromagnetic interference of an alternating current (AC) voltage received from a live line and a neutral line to generate a filtered AC voltage. The bridge circuit is for converting the filtered AC voltage to a first direct current (DC) voltage. The waveform converter circuit is for generating a pair of signals according to a voltage on the neutral line and a signal on the signal line. The microcontroller is for generating a control signal according to the pair of signals. The power circuit is for providing power to the motor coil according to the first DC voltage and the control signal.
    Type: Application
    Filed: October 16, 2019
    Publication date: May 7, 2020
    Inventors: Chorng-Wei Liaw, Hsien-Wen Hsu, Ying-Chieh Lin
  • SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
    Publication number: 20200135551
    Abstract: A method is provided. Plural semiconductor fins are formed on a substrate, and plural trenches each of which is formed between two adjacent semiconductor fins. A silicon liner layer is deposited to be conformal to the semiconductor fins and the trenches. The silicon liner layer is deposited by using a silane compound. Then, an oxide layer is deposited on the silicon liner layer to fill the trenches and cover the semiconductor fins, in which depositing the oxide layer forms water in the oxide layer. Next, a surface of the silicon liner layer is reacted with the water, so as to remove the water from the oxide layer.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 30, 2020
    Inventors: I-Wen HSU, Yu-Yun PENG, An-Di SHEU, Jei-Ming CHEN
  • Lateral pressure sensing pointer
    Patent number: 10635197
    Abstract: A lateral pressure sensing pointer includes a housing, a cartridge, a lateral key, a first elastic member, a first pressure sensing element, and a second elastic member. The housing extends a length along an axial direction, and has an end opening, a lateral opening, and an accommodation space. The end opening and the lateral opening are respectively in communication with the accommodation space. The cartridge is disposed at the end opening. The lateral key is disposed at the lateral opening. One end of the first elastic member is combined with the lateral key and can provide an elastic force along a radial direction perpendicular to the axial direction. The first pressure sensing element is disposed inside the accommodation space and can sense a pressure applied along the radial direction. The second elastic member abuts against the lateral key and can provide an elastic force along the radial direction.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: April 28, 2020
    Assignee: SHENZHEN PU YING INNOVATION TECHNOLOGY CORP., LTD.
    Inventors: Chung-Wen Hsu, Chung-Hsuan Li