Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic driving module and lens device using the same
    Patent number: 10886829
    Abstract: The disclosure discloses an electromagnetic driving module which includes a base, two magnetic elements, a wiring assembly, a reference element, and a sensor element. The two magnetic elements are arranged along a reference line and positioned at two sides of the base. The wiring assembly is connected to the base and arranged adjacent to the two magnetic elements. The reference element is positioned on the base. The sensor element is adjacent to the reference elements and configured to detect the movement of the reference element to position the base. A lens device using the electromagnetic driving module is also disclosed.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: January 5, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: ShangYu Hsu, Nai-Wen Hsu
  • OPTICAL MEMBER DRIVING MODULE
    Publication number: 20200400918
    Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Inventor: Nai-Wen HSU
  • Semiconductor device and method
    Patent number: 10867803
    Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Wen Hsu, Jian-Jou Lian, Neng-Jye Yang, Chia-Wei Wu, Kuan-Lin Chen, Kuo Bin Huang, Li-Min Chen
  • ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
    Publication number: 20200388647
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. The substrate has a plurality of protrusions disposed along a first side of the substrate over the image sensing element and a ridge disposed along the first side of the substrate. The ridge continuously extends around the plurality of protrusions.
    Type: Application
    Filed: August 25, 2020
    Publication date: December 10, 2020
    Inventors: Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu, Shih-Pei Chou
  • Method for maintaining memory sharing in a computer cluster
    Patent number: 10853297
    Abstract: A method includes: by an application executed by a first node, determining whether a non-transparent bridge between the first node and a second node is in a disconnected state; sending a re-initialization request from the application to a driver executed by the first node when the NTB is in the disconnected state; re-initializing a memory of the first node upon the driver receiving the re-initialization request; transmitting a result message related to the re-initialization of the memory to the second node; and implementing a memory-sharing procedure upon completing the re-initialization of the memory and receiving, from the second node, another result message related to re-initialization of a memory of the second node.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: December 1, 2020
    Assignee: Mitac Computing Technology Corporation
    Inventors: Thanh-Tu Thai, Hung-Tar Lin, Ching-Wen Hsu
  • Light blocking sheet, optical lens set, imaging lens assembly and electronic device
    Patent number: 10845507
    Abstract: A light blocking sheet having a central axis includes a central hole and a plurality of inner extended portions. The central axis passes through the central hole, which is enclosed by a hole inner surface. The hole inner surface has a first corresponding circle and a second corresponding circle, wherein a diameter of the first corresponding circle is greater than a diameter of the second corresponding circle. The inner extended portions are adjacent to and surround the central hole, wherein each of the inner extended portions is extended and tapered from the first corresponding circle towards the second corresponding circle and includes an inner surface, and the inner surface includes a line pair. The line pair includes two line sections, wherein one end of one line section thereof and one end of the other line section thereof are towards the second corresponding circle and approach to each other.
    Type: Grant
    Filed: January 19, 2019
    Date of Patent: November 24, 2020
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Ming-Ta Chou, Ming-Shun Chang, Chih-Wen Hsu
  • BSI image sensor and method of forming same
    Patent number: 10847560
    Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng
  • Electromagnetic driving mechanism
    Patent number: 10840792
    Abstract: An electromagnetic driving mechanism is provided, including a housing, a circuit unit, an electromagnetic driving assembly, and a sensing element. The circuit unit is connected to the housing, and has a plastic material and a circuit element. The plastic material is formed on and covers an outer surface of the circuit element by insert molding. The electromagnetic driving assembly is disposed in the housing for forcing an optical element to move relative to the circuit unit. The sensing element is disposed on the circuit unit, and electrically connected to the circuit element for detecting the displacement of the optical element relative to the circuit unit.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 17, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Kuo-Chun Kao, Nai-Wen Hsu, Shih-Ting Huang, Yi-Hsin Nieh, Meng-Ting Lin
  • 3DIC interconnect apparatus and method
    Patent number: 10840287
    Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai, Jiech-Fun Lu, Shih-Chang Liu, Yeur-Luen Tu, Chia-Shiung Tsai
  • Optical lens assembly, imaging lens module and electronic apparatus
    Patent number: 10830928
    Abstract: An optical lens assembly includes at least two lens elements and at least one light blocking sheet. Each of the lens elements includes a connecting structure for aligning the two lens elements. Each of the connecting structures includes a connecting surface and a circular conical surface, and a receiving space is formed between the two lens elements. A vertical distance between the receiving space and an optical axis is shorter than a vertical distance between each circular conical surface and the optical axis. The light blocking sheet is received in the receiving space and has a polygonal opening, and an outside diameter of the light blocking sheet is smaller than or equal to a minimum diameter of each circular conical surface.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: November 10, 2020
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chih-Wen Hsu, Ming-Ta Chou
  • TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200343369
    Abstract: A trench power semiconductor component and a method of manufacturing the same are provided. In the method, a step of forming a trench gate structure includes the following steps. First, a shielding electrode, a bottom insulating layer, and an upper insulating layer are formed in a trench. The bottom insulating layer covers a lower part of an inner wall of the trench, and surrounds the shielding electrode. The upper insulating layer covers an upper part of the inner wall. Thereafter, an interlayer dielectric layer and a U-shaped masking layer are formed in the trench. The interlayer dielectric layer is interposed between the upper insulating layer and the U-shaped masking layer. A portion of the upper insulating layer and a portion of the interlayer dielectric layer which are located at an upper part of the trench are removed so as to form an inter-electrode dielectric layer.
    Type: Application
    Filed: March 20, 2020
    Publication date: October 29, 2020
    Inventor: HSIU-WEN HSU
  • Absorption enhancement structure for image sensor
    Patent number: 10804315
    Abstract: The present disclosure, in some embodiments, relates to method of forming an integrated chip. The method may be performed by forming an image sensing element within a substrate. A dry etching process is performed on the substrate to form a plurality of intermediate protrusions defined by the substrate. A wet etching process is performed on the plurality of intermediate protrusions to form a plurality of protrusions from the plurality of intermediate protrusions.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: October 13, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu, Shih-Pei Chou
  • Optical member driving module
    Patent number: 10795116
    Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 6, 2020
    Assignee: TDK Taiwan Corp.
    Inventor: Nai-Wen Hsu
  • Semiconductor Device and Method of Manufacture
    Publication number: 20200312711
    Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Yao-Wen Hsu, Ming-Che Ku, Neng-Jye Yang, Yu-Wen Wang
  • Ink-type pointer
    Patent number: 10787026
    Abstract: An ink-type pointer including a housing, a circuit unit, a pen and ink writing module, and an electromagnetic unit. The housing includes an end opening and an accommodation space. The end opening is in communication with the accommodation space. The circuit unit is disposed inside the accommodation space. The pen and ink writing module is disposed inside the accommodation space, and includes a cartridge, a nib, and liquid ink. The cartridge includes a chamber, the nib is connected to the cartridge and extends out of the end opening, and the liquid ink is accommodated in the cartridge and is output through the nib. The electromagnetic unit is disposed inside the accommodation space and includes a magnet and a coil. The magnet includes a through hole, the coil is wound round the magnet and is electrically connected to the circuit unit, and the cartridge passes through the through hole.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 29, 2020
    Assignee: SHENZHEN PU YING INNOVATION TECHNOLOGY CORP., LTD.
    Inventors: Chung-Wen Hsu, Chung-Hsuan Li
  • Method for calculating pixel voltage for liquid crystal on silicon display device
    Patent number: 10777153
    Abstract: A liquid crystal on silicon display device is provided. Multiple grey levels of a pixel are transformed into multiple color values. The grey levels respectively correspond to multiple first sub-pixels. For each of the first sub-pixels, at least one parameter of a reflectance fitting function is obtained according to the color values, a gamma correction is performed according to the corresponding grey level to obtain a reflectance, and a pixel voltage is calculated according to the at least one parameter and the reflectance. The pixel voltage is applied to a pixel electrode of the corresponding first sub-pixel.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: September 15, 2020
    Assignee: Himax Display, Inc.
    Inventors: Yuet-Wing Li, Wen-Hsu Chen
  • Control circuit with bypass function
    Patent number: 10778158
    Abstract: A control circuit with a bypass function includes a first signal terminal, a second signal terminal, an output terminal, a first switch unit to a fourth switch unit, an output switch unit and a bypass unit. The first signal terminal is used for receiving a first signal. The second signal terminal is used for receiving a second signal. The first switch unit is coupled to the first signal terminal. The second switch unit is coupled between the first switch unit and the output switch unit. The third switch unit is coupled to the second signal terminal. The fourth switch unit is coupled between the third switch unit and the output switch unit. The output switch unit is coupled between the second switch unit and the output terminal. The bypass unit is coupled between the first switch unit and the output terminal to provide a bypass path corresponding to the first signal.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 15, 2020
    Assignee: RichWave Technology Corp.
    Inventors: Chih-Sheng Chen, Jhao-Yi Lin, Ching-Wen Hsu
  • Driving mechanism
    Patent number: 10764475
    Abstract: A driving mechanism is provided, including a housing, a hollow frame, a holder, and a driving assembly. The frame is fixed to the housing and has a stop surface. The holder is movably disposed in the housing for holding the optical element. The driving assembly is disposed in the housing to drive the holder and the optical element moving along the optical axis of the optical element relative to the frame. Specifically, the stop surface is parallel to the optical axis to contact the holder and restrict the holder in a limit position.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 1, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Composition for preventing and treating infection, and method for producing said composition
    Patent number: 10758603
    Abstract: Disclosed is a composition for preventing and treating a Mycoplasma hyorhinis infection in swine. The composition uses XylF, DnaK, P72, or a combination thereof as an active pharmaceutical ingredient. Further disclosed are an expression vector and a method for producing the active pharmaceutical ingredient of the composition using a prokaryotic expression system.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: September 1, 2020
    Assignee: Agricultural Technology Research Institute
    Inventors: Jiunn-Horng Lin, Zeng-Weng Chen, Jyh-Perng Wang, Chiung-Wen Hsu, Weng-Zeng Huang, Ming-Wei Hsieh, Tzu-Ting Peng, Shih-Ling Hsuan
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20200271890
    Abstract: A driving mechanism is provided and configured to drive an optical element. The driving mechanism includes a base unit, a holding unit, a driving assembly, a sensing assembly, and a first circuit component. The holding unit is configured to hold an optical element that has an optical axis. The driving assembly is configured to drive the optical element to move relative to the base unit. The sensing assembly is configured to detect the movement of the holding unit relative to the base unit. The first circuit component is disposed in the base unit and electrically connected to the sensing assembly, wherein the first circuit component extends in a direction that is substantially parallel to the optical axis.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Chien-Lun HUANG, Yu-Cheng LIN, Nai-Wen HSU