Abstract: An optical element driving module is provided, including a housing, a movable portion configured to support an optical element, a driving assembly, a positioning sensor, and a non-metallic substrate disposed on a side of the movable portion. The movable portion is movable relative to the housing, the driving assembly is configured to drive movement of the movable portion relative to the housing, and the positioning sensor is configured to detect the movement of the movable portion relative to the housing. Specifically, the non-metallic substrate forms a recess for receiving the positioning sensor, wherein a depth of the recess is greater than a height of the positioning sensor.

Abstract: The disclosure provides an optical driving mechanism, including a frame body, a holding member, a plate coil and a magnet. The holding member is movably disposed in the frame body and configured to hold an optical element. The plate coil is disposed on the holding member. The magnet is disposed on the frame body and corresponds to the plate coil. The plate coil acts with the magnet to generate an electromagnetic force to drive the holding member and the optical element to move along an optical axis of the optical element relative to the frame body.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: The present disclosure provides a trench power semiconductor component and a method of making the same. The trench power semiconductor component includes a substrate, an epitaxial layer, and a trench gate structure. The epitaxial layer is disposed on the substrate, the epitaxial layer having at least one trench formed therein. The trench gate structure is located in the at least one trench. The trench gate structure includes a bottom insulating layer covering a lower inner wall of the at least one trench, a shielding electrode located in the lower half part of the at least one trench, a gate electrode disposed on the shielding electrode, an inter-electrode dielectric layer disposed between the gate electrode and the shielding electrode, an upper insulating layer covering an upper inner wall of the at least one trench, and a protection structure including a first wall portion and a second wall portion.

Abstract: A semiconductor device and method for forming the semiconductor device are provided. A first layer is formed over a semiconductor layer, and a first patterned mask is formed over the first layer. A cyclic etch process is then performed to define a second patterned mask in the first layer. The cyclic etch process includes a first phase to form a polymer layer over the first patterned mask and a second phase to remove the polymer layer and to remove a portion of the first layer. A portion of the semiconductor layer is removed using the second patterned mask to define a fin from the semiconductor layer.

Abstract: An amplification device includes an amplification circuit and a protection circuit. The amplification circuit includes a transistor having a first terminal for outputting an amplified radio frequency signal, a second terminal, and a control terminal coupled to the input terminal of the amplification circuit for receiving a radio frequency signal to be amplified. The protection circuit has a first terminal coupled to the output terminal or the input terminal of the amplification circuit, and a second terminal. The protection circuit includes a switch and a first voltage clamping unit. The switch unit is turned on or turned off according to a control signal. The first voltage clamping unit is coupled to the switch unit for clamping a voltage at the first terminal of the protection circuit within a predetermined region when the switch unit is turned on.

Abstract: An electronically commuted (EC) motor includes an electromagnetic interference (EMI) filter circuit, a bridge circuit, an alternating current (AC) voltage to square wave circuit, a microcontroller, a motor coil, and a power circuit. The EMI filter circuit is for filtering out electromagnetic interference of an alternating current (AC) voltage received from a live line and a neutral line to generate a filtered AC voltage. The bridge circuit is for converting the filtered AC voltage to a first direct current (DC) voltage. The waveform converter circuit is for generating a pair of signals according to a voltage on the neutral line and a signal on the signal line. The microcontroller is for generating a control signal according to the pair of signals. The power circuit is for providing power to the motor coil according to the first DC voltage and the control signal.

Abstract: A method is provided. Plural semiconductor fins are formed on a substrate, and plural trenches each of which is formed between two adjacent semiconductor fins. A silicon liner layer is deposited to be conformal to the semiconductor fins and the trenches. The silicon liner layer is deposited by using a silane compound. Then, an oxide layer is deposited on the silicon liner layer to fill the trenches and cover the semiconductor fins, in which depositing the oxide layer forms water in the oxide layer. Next, a surface of the silicon liner layer is reacted with the water, so as to remove the water from the oxide layer.

Abstract: A lateral pressure sensing pointer includes a housing, a cartridge, a lateral key, a first elastic member, a first pressure sensing element, and a second elastic member. The housing extends a length along an axial direction, and has an end opening, a lateral opening, and an accommodation space. The end opening and the lateral opening are respectively in communication with the accommodation space. The cartridge is disposed at the end opening. The lateral key is disposed at the lateral opening. One end of the first elastic member is combined with the lateral key and can provide an elastic force along a radial direction perpendicular to the axial direction. The first pressure sensing element is disposed inside the accommodation space and can sense a pressure applied along the radial direction. The second elastic member abuts against the lateral key and can provide an elastic force along the radial direction.

Abstract: A manufacturing method of a chip package structure is provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.

Abstract: A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.

Abstract: An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.

Abstract: An amplifier circuit includes an output terminal, an amplification unit and a switch. The output terminal is used to output an amplification signal. The amplification unit includes a first transistor and a second transistor. The first transistor includes a control terminal for receiving a first input signal, a first terminal coupled to the output terminal for outputting an amplified first input signal, and a second terminal. The second transistor includes a control terminal for receiving a second input signal, a first terminal coupled to the output terminal for outputting an amplified second input signal, and a second terminal. The switch includes a first terminal coupled to the second terminal of the first transistor, and a second terminal. The amplification signal is generated using at least the amplified first input signal and/or the amplified second input signal.

Abstract: In some examples, a computing device includes a first display in a first housing and a second display in a second housing. The computing device may determine an angle between the first display device and the second display device, determine a first temperature map of the first housing based on the angle and first temperature data received from a first set of temperature sensors in the first housing, and determine a second temperature map of the second housing based on the angle and second temperature data received from a second set of temperature sensors in the second housing. The computing device may determine a temperature difference between the first display device and the second display device, determine an action, and perform the action to reduce the temperature, color, and/or color intensity difference between the first display device and the second display device.

Abstract: A bicycle trainer is adapted to be arranged with a bicycle to simulate riding a bicycle on an outdoor road. The bicycle includes a stand, a roller and a resistance source. The stand is adapted to support the bicycle. The roller is pivoted to the stand and adapted to contact a bicycle wheel of the bicycle. The resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller. The resistance source varies the magnitude of the provided resistance according to the rotation speed of the roller.

Abstract: A pressure sensing pointer includes a housing, an electromagnetic unit, a cartridge, a pressing member, a first elastic member, a second elastic member, and a pressure sensing element. The housing has an accommodating space and a port in communication with the accommodating space. The electromagnetic unit is located inside the accommodating space. The cartridge is movably disposed at the port along an axial direction. The pressing member is movably disposed in the accommodating space, and is in linkage connection to the cartridge. One end of the first elastic member is fixed on the pressing member. One end of the second elastic member abuts against the pressing member An amount of compression deformation of the second elastic member in the axial direction is greater than an amount of compression deformation of the first elastic member in the axial direction. The pressure sensing element faces toward the first elastic member.

Abstract: An optical element driving module is provided, including a housing, a movable portion configured to support an optical element, a driving assembly, a positioning sensor, and a non-metallic substrate disposed on a side of the movable portion. The movable portion is movable relative to the housing, the driving assembly is configured to drive movement of the movable portion relative to the housing, and the positioning sensor is configured to detect the movement of the movable portion relative to the housing. Specifically, the non-metallic substrate forms a recess for receiving the positioning sensor, wherein a depth of the recess is greater than a height of the positioning sensor.

Abstract: A speaker module includes a bracket, a plurality of first cushion members, a speaker and a plurality of second cushion members. The bracket includes a plurality of first pillars. Each of the first cushion members is disposed on one of the first pillars. The speaker is connected to the first cushion members. The second cushion members are connected to a periphery of the bracket.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.