Abstract: A package structure includes a plurality of lower elements, a reinforcement structure and an encapsulant. The lower elements are disposed side by side. The reinforcement structure surrounds the lower elements. The encapsulant covers the lower elements and the reinforcement structure. The electrical connectors of the lower elements are exposed from the encapsulant.

Abstract: A lens assembly actuating module includes a holder, a metal yoke, a lens actuator and a Hall sensor. The holder includes a central opening, at least three metal connectors insert-molded with the holder, at least two metal terminals insert-molded with the holder, and a plurality of plated metal layers disposed on a surface of the holder. The metal yoke is coupled with the holder. The lens actuator is for carrying a lens unit including an optical axis. The lens actuator is movably disposed in the metal yoke. The lens actuator includes at least one elastic element and at least three metal hanging wires. The Hall sensor is disposed on one of the plated metal layers of the holder. The Hall sensor is for detecting a movement of the lens unit along a direction perpendicular to the optical axis.

Abstract: A wiring structure includes at least one upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer, at least one upper circuit layer in contact with the upper dielectric layer, and at least one bonding portion electrically connected to the upper circuit layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonding the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

Abstract: A tool holder device includes a receptacle having two conduits perpendicular to each other, a spindle and a shaft are rotatably engaged in the conduits of the receptacle and have bevel gears meshed with each other for allowing the shaft to be rotated relative to the receptacle by the spindle, a housing is secured to the receptacle, a flexible shank is secured to the spindle, a stem is secured to the flexible shank, a flexible sheath is engaged onto the flexible shank and is secured to the receptacle, and a control ferrule is secured to the flexible sheath, and the stem is rotatably received and engaged in the control ferrule. The flexible shank and the flexible sheath allow the tool holder device to be easily operated by the user in a tiny working space.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, a plurality of metallic structures and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The metallic structures are disposed between the upper conductive structure and the lower conductive structure, and electrically connecting the upper conductive structure and the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure, and covers the metallic structures.

Abstract: The present invention provides a mattress system (1) devised to achieve a function of automatic detection, mainly comprising: a mattress (2) having a simple structure; a control unit (3) equipped with a unique user interface (31) for caregivers to simultaneously adjust three major functions, namely, therapy mode, therapy intensity and comfort level; and a connection pipe (4) for supplying air and power. The system (1) is further provided with a built-in auto-setting function to sense the body characteristics of the patient (39) lying on the mattress (2) and determine an effective supporting pressure range for the patient (39).

Abstract: A tool extension rod includes a main piece, a sliding sleeve, and a magnetic assembly. The sliding sleeve is slidably sleeved onto the main piece. When the sliding sleeve moves between a first position and a second position, the magnetic assembly is movable along an axial direction.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer; one or multiple vias penetrating the active layer and the second semiconductor layer to expose the first semiconductor layer; a first contact layer covering the one or multiple vias; a third insulating layer including a first group of one or multiple third insulating openings on the second semiconductor layer to expose the first contact layer; a first pad on the semiconductor stack and covering the first group of one or multiple third insulating openings; and a second pad on the semiconductor stack and separated from the first pad with a distance, wherein the second pad is formed at a position other than positions of the one or multiple vias in a top view of the light-emitting device.

Abstract: A torque screwdriver device is provided, including: a hosing, including a barrel and a cover coveringly connected with the barrel; an input shaft portion, rotatably assembled with the barrel; an output shaft portion, rotatably assembled with the barrel and including a socket mechanism; a torque clutch mechanism, including a first engaging portion disposed on the input shaft portion and a second engaging portion disposed on the output shaft portion, an elastic preload member biasing one of the first and second engaging portions, and a first bearing mechanism, the first bearing mechanism including a stop member abutted against the hosing, a support member abutted against the elastic preload member and at least one low friction member disposed between the stop member and the support member, at least one of the stop member and the support member being movable relative to the at least one low friction member.

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

Abstract: Methods and systems for activity monitoring include capturing an infrared image of an environment that comprises at least one patient being monitored and at least one infrared-emitting tag. A relationship between the patient being monitored and the at least one infrared-emitting tag is determined. An activity conducted by the patient being monitored is determined based on the relationship between the patient being monitored and the at least one infrared-emitting tag. A course of treatment for the patient being monitored is adjusted based on the determined activity.

Abstract: A manufacturing method of a semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having an active component region and a non-active component region, a first dielectric layer, a second dielectric layer, high resistivity metal segments, dummy stacked structures and a metal connection structure. The high resistivity metal segments are formed in the second dielectric layer and located in the non-active component region. The dummy stacked structures are located in the non-active component region, and at least one dummy stacked structure penetrates through the first dielectric layer and the second dielectric layer and is located between two adjacent high resistivity metal segments. The metal connection structure is disposed on the second dielectric layer, and the high resistivity metal segments are electrically connected to one another through the metal connection structure.

Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.

Abstract: Provided is a method for evaluating the risk of drug hypersensitivity reaction induced by antibiotics sulfamethoxazole and/or trimethoprim. The drug hypersensitivity reaction comprises: maculopapular eruption, fixed drug eruption, Stevens-Johnson Syndrome, toxic epidermal necrolysis, drug rash with eosinophilia and systemic symptoms. A specific HLA genotype is associated with the drug hypersensitivity reaction induced by the antibiotics sulfamethoxazole and/or trimethoprim.

Abstract: An electronic device includes: a first insulation layer and a first conductive pillar. The first insulation layer has a first surface and a second surface opposite to the first surface, and the first conductive pillar comprises a first portion and a second portion. The first portion of the first conductive pillar is surrounded by the first insulation layer. The second portion of the first conductive pillar is disposed on the first surface of the first insulation layer. A height of the second portion of the first conductive pillar is equal to or greater than 10% of a height of the first portion of the conductive pillar.

Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.

Abstract: A semiconductor substrate includes a substrate and a plurality of electronic components. The substrate defines a cavity. A total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N. The electronic components in each group are encapsulated by a first insulation layer to form a respective component module. Each of the component modules is disposed in the cavity. A second insulation layer fills the cavity and encapsulates the component modules.

Abstract: A camera module includes a plastic carrier, an imaging lens assembly, a reflective element and a plurality of auto-focusing elements. The plastic carrier includes an inner portion and an outer portion, wherein an inner space is defined by the inner portion, and the outer portion includes at least one mounting structure. The imaging lens assembly is disposed in the inner space of the plastic carrier. The reflective element is for folding an image light by a reflective surface of the reflective element into the imaging lens assembly. The auto-focusing elements include at least two magnets and at least one wiring element, wherein the auto-focusing elements are for moving the plastic carrier along a second optical axis of the imaging lens assembly, and the magnets or the wiring element can be disposed on the mounting structure of the outer portion.

Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the second semiconductor layer includes a first edge; a reflective structure located on the second semiconductor layer and including an outer edge; a first electrode pad located on the reflective structure, wherein the first electrode pad including an outer side wall adjacent to the outer edge, wherein the outer edge extends beyond the outer side wall and does not exceed the first edge in a cross-sectional view of the light-emitting device.

Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.