Abstract: Provided are an image transform method and an image transform network. The method is for the image transform network including an image generator, a transform discriminator and a focus discriminator, and includes: generating a transformed image according to an un-transformed image and focus information by the image generator; computing a transform discrimination value according to the transformed image by the transform discriminator; computing a value of a first generator loss function and updating the image generator by the image generator; generating a focus discrimination value according to the un-transformed image, the transformed image, and the focus information by the focus discriminator; and computing a value of a second generator loss function according to the focus discrimination value and updating the image generator according to the value of the second generator loss function by the image generator.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers and a plurality of circuit layers in contact with the dielectric layers. The conductive through via extends through the conductive structure. The conductive through via is a monolithic structure, and includes a main portion and an extending portion protruding from the main portion.

Abstract: A lens driving apparatus is for driving a lens assembly and includes a holder, a metal cover, a carrier, at least one detection magnet, a circuit board, at least one position detection unit, a coil and at least three driving magnets. The holder has a rectangular appearance, wherein the holder includes a holder opening and four sides. The carrier is displaceable relative to the holder along a direction parallel to a central axis. The holder further includes at least three first terminals and a plurality of second terminals. The first terminals are positioned close to only one of the four sides of the holder and extended outward from the holder along the direction parallel to the central axis, wherein the position detection unit is positioned close to another one of the four sides. The second terminals are fixedly connected to the circuit board.

Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.

Abstract: Methods for treating a wound or promote wound healing are provided, comprising the step of administering a composition including an effective amount of ?-1 adrenergic receptor antagonist to a subject in need thereof. Also provided is apparatus for wound healing, comprising a dressing and a composition including an effective amount of ?-1 adrenergic receptor antagonist.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an antenna zone and a routing zone. The routing zone is disposed on the antenna zone, where the antenna zone includes a first insulation layer and two or more second insulation layer and a thickness of the first insulation layer is different from that of the second insulation layer.

Abstract: A light-emitting wireless charging structure includes a base, a wireless charging module, a light-emitting element and an upper cover. The wireless charging module is disposed on the base. The light-emitting element is disposed on the base adjacent to the wireless charging module. The upper cover covers the wireless charging module and the light-emitting element. The upper cover has a lower surface facing the wireless charging module and an upper surface opposite to the bottom surface. When the light-emitting element emits light, light coming from the light-emitting element passes through the upper cover and forms a mark on the upper surface to indicate the position of the wireless charging module. When the light-emitting element is turn off or kept in an off state, either the mark that has been formed on the upper surface disappears therefrom or no any mark is ever shown on the top surface.

Abstract: The present disclosure is related to a touch technology field and provides a backlight module and a touch display device using the backlight module. The backlight module includes a substrate, plural driving electrode lines, plural receiving electrode lines, and plural light sources. The driving electrode lines are disposed on the substrate. The receiving electrode lines are disposed on the substrate, in which the receiving electrode lines and the driving electrode lines define plural light source regions on the substrate. The lights sources are disposed in the light source regions, in which each of the light source regions includes at least one of the light sources. The touch display device includes the backlight module and a display panel. The backlight module is configured to provide backlight light. The display panel is disposed on the backlight module to use the backlight light to display images.

Abstract: A system and a method for compensating uniformity of brightness are provided. The system includes an edge-type backlight assembly, a display panel, a brightness sensor, a compensating calculator, and a local dimming controller. The display panel is disposed above the edge-type backlight assembly. The display panel includes plural regions for local dimming. The brightness sensor is configured to measure whether the brightness distribution of the display panel is uniform. When the brightness distribution of the display panel is not uniform, the compensating calculator calculates a brightness compensation value corresponding to each of the regions of the display panel. The local dimming controller is configured to drive the edge-type backlight assembly according to the brightness compensation value corresponding to each of the regions of the display panel.

Abstract: A wiring structure includes a first unit, a second unit, a first insulation wall, a first redistribution layer and a third unit. The first unit is disposed at a first elevation and having a first circuit layer and a first dielectric layer surrounding the first circuit layer. The second unit is disposed at the first elevation and having a second circuit layer and a second dielectric layer surrounding the second circuit layer. The first insulation wall is disposed between the first unit and the second unit. The first redistribution layer is disposed on the first unit and the second unit, and electrically connected between the first unit and the second unit. The third unit is disposed on the first redistribution layer and having a third circuit layer and a third dielectric layer surrounding the third circuit layer.

Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers and a plurality of circuit layers in contact with the dielectric layers. The conductive through via extends through at least a portion of the conductive structure. At least one of the circuit layers includes a first portion in contact with the conductive through via and a second portion in contact with the dielectric layer. A surface roughness of the first portion of the circuit layer is greater than a surface roughness of the second portion of the circuit layer.

Abstract: A socket includes a first and a second sleeve members. The first sleeve member has a first end for connecting to a driving tool and a second end having a first connecting portion for sleeving onto a first fastener, and has an internal space and an internal circumferential wall. The second sleeve member is movably inserted into the internal space and has an external circumferential wall and a second connecting portion connected together. The second connecting portion is for sleeving onto a second fastener whose size is different from a size of the first fastener. One of the external and the internal circumferential walls is tapered from the first end toward the second end to form a gap. The other one of the external and the internal circumferential walls has a restriction unit extending into the gap.

Abstract: A method for fabricating a static random access memory (SRAM) includes the steps of: forming a gate structure on a substrate; forming an epitaxial layer adjacent to the gate structure; forming a first interlayer dielectric (ILD) layer around the gate structure; transforming the gate structure into a metal gate; forming a contact hole exposing the epitaxial layer, forming a barrier layer in the contact hole, forming a metal layer on the barrier layer, and then planarizing the metal layer and the barrier layer to form a contact plug. Preferably, a bottom portion of the barrier layer includes a titanium rich portion and a top portion of the barrier layer includes a nitrogen rich portion.

Abstract: A method of manufacturing a multi-layer wafer is provided. Under bump metallization (UMB) pads are created on each of two heterogeneous wafers. A conductive means is applied above the UMB pads on at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded to adhere the UMB pads together via the conductive means. At least one stress compensating polymer layer may be applied to at least one of two heterogeneous wafers. The stress compensating polymer layer has a polymer composition of a molecular weight polymethylmethacrylate polymer at a level of 10-50% with added liquid multifunctional acrylates forming the remaining 50-90% of the polymer composition.

Abstract: A circular includes a housing, a sawing assembly including a motor and a saw blade located at two opposite sides of the housing and connected together so that the saw blasé can be driven by the motor to saw the workpiece and a saw blade shield secured to the housing and covering a part of the saw blade to prevent the saw blade from cutting the surrounding people, and a prism assembly including a protective cover affixed to the front end of the saw blade shield and a prism located in the protective cover to reflect the image of the saw blade sawing the workpiece through a window of the protective cover to the line of sight of the operator. In this way, the operator can clearly confirm whether the sawing path is skewed with the normal operating posture to improve the efficiency.

Abstract: A brain wave monitoring system includes an electronic device and at least one electroencephalograph connected to the electronic device, each electroencephalograph includes 8 channels respectively connected to a corresponding electrode for receiving a brain wave signal. The electronic device scans a number of the at least one electroencephalograph and sequentially displays multiple channels of the at least one electroencephalograph according to an identifier of each of the at least one electroencephalograph. The brain wave monitoring system can automatically detect the number of electroencephalographs connected to the electronic device, and display the brain wave signals of all channels of all electroencephalographs according to the number of electroencephalographs and 8 channels of each electroencephalograph. The brain wave monitoring system can also prompt a guide message according to a channel impedance value and a signal quality index to assist a user improving a quality of the brain wave.

Abstract: A model parameters security protection method is implemented in a computing device in communication connection with at least one security protection device. The method includes training a data model based on an artificial neural network using a number of images and obtaining parameter information of the data model, encrypting the parameter information and generating a configuration file comprising the encrypted parameter information, and sending the configuration file to the at least one security protection device. The parameter information includes at least one of a weight of neuron and an offset value of the neuron of the artificial neural network.

Abstract: A memory device includes a word line, a bit line, an active region and a bit line contact structure. The word line is disposed in the substrate, and extends along a first direction. The bit line is disposed over the substrate, and extends along a second direction. The active region is disposed in the substrate, and extends along a third direction. The bit line contact structure is disposed between the active region and the bit line. A top view pattern of the bit line contact structure has a long axis. An angle between the extending direction of this long axis and the third direction is less than an angle between the extending direction of this long axis and the first direction, and is less than an angle between the extending direction of this long axis and the second direction.

Abstract: A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of the substrate. The at least one electronic component is disposed on the first surface of the substrate. The at least one semiconductor die is disposed on the at least one redistribution structure and electrically connected to the at least one electronic component through the substrate.