Abstract: A sound source tracking method adapted to an ongoing video conference comprising: obtaining a streaming signal of the video conference from an internet; performing a video conference procedure to obtain an audio signal from the streaming signal and send the audio signal to a speaker; performing an audio tracking procedure to obtain the audio signal outputted from the video conference procedure to the communication device and send the audio signal to a sound source tracking camera; playing the audio signal to generate a far-end sound; recording a field sound comprising at least one of the far-end sound and a local-end sound; and performing a comparing procedure to determine a shooting direction of the sound source tracking camera, wherein the shooting direction is adjusted so as not to shoot the speaker when a similarity of the far-end sound and the audio signal is greater than a threshold.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a lower conductive structure, an upper conductive structure and a conductive via. The lower conductive structure includes a first dielectric layer and a first circuit layer in contact with the first dielectric layer. The upper conductive structure is attached to the lower conductive structure. The upper conductive structure includes a plurality of second dielectric layers, a plurality of second circuit layers in contact with the second dielectric layers, and defines an accommodating hole. An insulation material is disposed in the accommodating hole. The conductive via extends through the insulation material, and electrically connects the lower conductive structure.

Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.

Abstract: An apparatus and method for providing a decision feedback equalizer are disclosed herein. In some embodiments, a method and apparatus for reduction of inter-symbol interference (ISI) caused by communication channel impairments is disclosed. In some embodiments, a decision feedback equalizer includes a plurality of delay latches connected in series, a slicer circuit configured to receive an input signal from a communication channel and delayed feedback signals from the plurality of delay latches and determine a logical state of the received input signal, wherein the slicer circuit further comprises a dynamic threshold voltage calibration circuit configured to regulate a current flow between output nodes of the slicer circuit and ground based on the received delayed feedback signal and impulse response coefficients of the communication channel.

Abstract: A smart clothes for sensing heart physiological activities and lung respiratory conditions is provided, the smart clothes utilizes conductive connecting elements for being externally connected to a control module, such that the control module can be expanded or upgraded according to functional requirements. Further in the smart clothes, sensing elements and signal transmission wires are made of conductive fabric. As the conductive fabric sensing elements and signal transmission wires are well attached to a clothing body of the smart clothing, the sensing elements can be better adhered to human skin, and thereby sensing accuracy is improved.

Abstract: Methods for assessing the risk of developing adverse drug reaction in a subject in need of such assessment are provided, comprising the step of detecting the presence of an HLA-B allele in a sample obtained from the subject, wherein the presence of allele is indicative of the subject having an increased risk of developing the adverse drug reaction. Also provided are methods of treating or reducing the incidence of the adverse drug reaction.

Abstract: A signal processing circuit, complying with DisplayPort standard and operated in a display device which is as a DisplayPort sink device, includes a main physical circuit, which is configured to receive a first signal from one of a plurality of DisplayPort connectors of the display device connected to a first DisplayPort source device and a plurality of auxiliary physical circuits. Only a first auxiliary physical circuit of the plurality of auxiliary physical circuits is enabled to receive a second signal from the DisplayPort connector connected to the first DisplayPort source device.

Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.

Abstract: The present disclosure is related to a touch technology field and provides a backlight module and a touch display device using the backlight module. The backlight module includes a substrate, plural driving electrode lines, plural receiving electrode lines, and plural light sources. The driving electrode lines are disposed on the substrate. The receiving electrode lines are disposed on the substrate, in which the receiving electrode lines and the driving electrode lines define plural light source regions on the substrate. The lights sources are disposed in the light source regions, in which each of the light source regions includes at least one of the light sources. The touch display device includes the backlight module and a display panel. The backlight module is configured to provide backlight light. The display panel is disposed on the backlight module to use the backlight light to display images.

Abstract: A semiconductor device includes a substrate and a first transistor disposed on the substrate. The first transistor includes first semiconductor sheets and two first source/drain structures. The first semiconductor sheets are stacked in a vertical direction and separated from one another. Each of the first semiconductor sheets includes two first doped layers and a second doped layer disposed between the two first doped layers in the vertical direction. A conductivity type of the second doped layer is complementary to a conductivity type of each of the first doped layers. The two first source/drain structures are disposed at two opposite sides of each of the first semiconductor sheets in a horizontal direction respectively, and the two first source/drain structures are connected with the first semiconductor sheets.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.

Abstract: A thermal imaging apparatus for measuring a temperature of a target in a monitored area comprises a thermal imager, an optical image capturing device and a computing processing device. The thermal imager is configured to capture a thermal image of the monitored area. The optical image capturing device is configured to capture optical images of the monitored area. The computing processing device is configured to determine one of the optical images as a determined optical image synchronizing with the thermal image according to positions of blocks corresponding to the target in the thermal image and the optical images, perform calculation according to the thermal image and the determined optical image to obtain a measured distance between the target and the thermal imaging apparatus, and perform calibration according to the measured distance and the thermal image to obtain a calibrated temperature value of the target.

Abstract: An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.

Abstract: A tool connector is provided, including: a rod, a sliding sleeve, a locking member, a push rod, a sliding rod, a first elastic member and a second elastic member. The sliding sleeve is movably sleeved to the rod. The sliding rod is disposed through the push rod and slidably disposed on the rod. The sliding rod is comovable with the push rod. The first elastic member is elastically abutted against and between the push rod and the rod. The second elastic member is elastically abutted against and between the rod and the sliding sleeve.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure, an intermediate structure and a seed layer. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The conductive structure defines an accommodating hole. The intermediate structure is bonded to an inner surface of the accommodating hole. The seed layer is bonded to the accommodating hole through the intermediate structure.

Abstract: A tool extension rod includes a main piece, a sliding sleeve, and a magnetic assembly. The sliding sleeve is slidably sleeved onto the main piece. When the sliding sleeve moves between a first position and a second position, the magnetic assembly is movable along an axial direction.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes an upper conductive structure, a lower conductive structure and a redistribution structure. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The redistribution structure is disposed between the upper conductive structure and the lower conductive structure to electrically connect the upper conductive structure and the lower conductive structure. The redistribution structure includes a dielectric structure and a redistribution layer embedded in the dielectric structure. The redistribution layer includes at least one circuit layer.

Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.

Abstract: A lens driving apparatus includes a holder, a metal cover, a carrier, a sensing magnet, a printed circuit board, a position sensor, a coil and at least one driving magnet. The metal cover is coupled with the holder and has an opening. The carrier is assembled to a lens assembly having an optical axis, wherein the carrier is disposed in the metal cover and is movable along a direction parallel to the optical axis. The sensing magnet is coupled with the carrier. The printed circuit board is disposed near to one of the four lateral sides of the holder. The position sensor is disposed on the printed circuit board and corresponds to the sensing magnet. The coil is disposed on an outer surface of the carrier. One of the driving magnet is disposed in the metal cover and corresponds to the coil.

Abstract: A semiconductor light-emitting device includes a substrate; a first semiconductor layer and a second semiconductor layer formed on the substrate, wherein the first semiconductor layer includes a first exposed portion and a second portion; a plurality of first trenches formed on the substrate and including a surface composed by the first exposed portion; a second trench formed on the substrate and including a surface composed by the second exposed portion at a periphery region of the semiconductor light-emitting device, wherein each of the plurality of first trenches is branched from the second trench; and a patterned metal layer formed on the second semiconductor layer and including a first metal region and a second metal region, and portions of the second metal region are formed in the plurality of first trenches and the second trench to electrically connect to the first exposed portion and the second exposed portion.